• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2000년도 특별강연 및 추계학술발표대회 개요집
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• pp.170-172
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• 2000

In this research, newly proposed heat source equations were calculated to predict micro distortion of small structure in laser welding and compared with experimental results which were measured using laser speckle metrology. A finite element code, ABAQUS is used for the heat transfer analysis with a three-dimensional plane assumption. The results suggest that weld distortion is varied according to the heat source of the. laser beam.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 춘계학술발표대회 개요집
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• pp.285-287
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• 2002

This study is investigated in variations of micro-structures and mechanical properties of Ti/SUS321L joint with bonding temperature and time using brazing method. According to increasing bonding temperature and time, it was observed the thickness of their reaction layer increased. In tensile test, it was examined that the tensile strength had maximum value at the bonding time of 5min and decreased after bonding time over 5min because of increasing their oxides and intermetallic compounds.

• 소성∙가공
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• 제11권7호
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• pp.596-600
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• 2002

The ultrasonic bonding method and its feasibility are investigated in this work for joining the micro components and MEMS packaging. The ultrasonic bonding process is analyzed using a lumped mode, and preliminary experiments using the eutectic solder and copper pin were carried out to verify possibility to MEMS packaging. The ultrasonic bonding process appears to be adequate for MEMS packaging by providing localized heating at the selected area. Microscopic behavior of the bond joint through ultrasonic vibration needs further investigation.

• Journal of Welding and Joining
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• 제15권6호
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• pp.32-40
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• 1997

Solid state diffusion bonding is the joining process performed by creep and diffusion, which is accelerated by heating below melting temperature and proper pressing, in vacuum or shielding gas atmosphere. By this process we can obtain sufficient joint which can't be expected from the fusion welding. For Ti-6Al-4V alloy, the optimum solid state diffusion bonding condition and mechanical properties of the joint were found, and micro void morphology at bond interface was observed by SEM. The results of tensile test showed sufficient joint, whose mechanical properties are similar to that of base metal. 850$^{\circ}$C, 3MPa is considered as the optimum bonding condition. Void morphology at interface is long and flat at the initial stage. As the percentage of bonded area increases, however, small and round voids are found. Variation of void shape can be explained as follows. As for the void shrinkage mechanism, at the initial stage, power law creep is the dominant, but diffusion mechanism is dominant when the percentage of bonded area is increased.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2009년 추계학술발표대회
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• pp.110-110
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• 2009

본 연구에서는 전산유체역학적 방법을 이용하여 레이저-GMA 하이브리드 용접에서 용융풀 거동에 대한 3차원 과도해석을 수행하였다. 철강재의 주요 합금원소 중 하나인 크롬의 용융풀에서의 거동을 구현하기 위해 크롬에 대해 추가적인 보전 방정식을 도입하였다. 이를 이용하여 합금원소 분포에 대한 용접 변수별 영향을 해석적으로 분석하였으며 이를 EPMA(Electron Probe Micro Analyzer)를 통해 분석한 시험결과와도 비교하였다. 결과적으로 용접변수 중 선행 조건이 합금원소 분포에 구별할만한 영향을 미침을 알 수 있었고 이는 용융풀의 거동을 지배하는 주요 유동 패턴의 상이함에 기인한 것으로 보여진다.

• 대한용접접합학회:학술대회논문집
• /
• 대한용접접합학회 2000년도 특별강연 및 추계학술발표대회 개요집
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• pp.141-143
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• 2000

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2000년도 특별강연 및 추계학술발표대회 개요집
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• pp.251-253
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• 2000

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2006년 추계학술발표대회 개요집
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• pp.155-157
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• 2006

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2003년도 추계학술발표대회 개요집
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• pp.159-161
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• 2003

Electrode movement signal has been widely used in resistance spot welding system This study is to compare accelerometer signal with gap sensor signal in servo gun system. This study propose that accelerometer output signal is a useful technique of quality monitoring in resistance welding processes.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2004년도 춘계 학술발표대회 개요집
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• pp.333-335
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• 2004

현재 저항 점 용접 공정에서 기존의 공기 가압 장치에서 서보모터를 이용한 서보 가압 장치로 변화가 진행되고 있다. 특히 마이크로 접합부의 경우 그 대상부가 미소ㆍ미세하기 때문에 접합부의 두께, 변형량, 접합후 전기 저항의 크기 둥이 크게 문제가 될 수 있다. (중략)