• Journal of Advanced Marine Engineering and Technology
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• 제18권4호
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• pp.62-68
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• 1994

Recently, the trends toward reduction in size and weight of industrial products increased the application of micro hole for manufacturing gadgets of high precision and gave rise to a great deal of interest for micro hole drilling M/C. Quite a few research work is performed on micro drilling on domestic basis compared with the tendency of analyzing cutting mechanism, adaptive control, monitoring of generally available drills of diameter greater than 1mm. This study adresses the design, manufacturing and controlling a micro hole drilling M/C with the overload detection instrument and the step feed mechanism. Controlling and monitoring of the drilling process are acomplished on PC basis for more user interfaces and effectiveness. The test machine of the results of this research shows a good foundation for extending further micro hole machining technique.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2001년도 춘계학술대회 논문집(한국공작기계학회)
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• pp.275-280
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• 2001

Recently, the trends of industrial products grow more miniaturization, variety and mass production. Micro drilling which take high precision in cutting work is requested more micro hole and high speed working. Especially, Micro deep hole drilling is becoming more important in a wide spectrum of precision production industries, ranging from the production of automotive fuel injection nozzle, watch and camera parts, medical needles, and thick multi-layered Printed Circuit Boards(PCB) that are demanded for very high density electric circuitry. This paper shows the tool monitoring results of micro drill with tool dynamometer. And additionally, microscope with built-in monitor inspection show the relationship between burr in workpiece and chip form of micro drill machining.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1555-1558
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• 2005

In this study, we measured cylindricity and Runout of the air bearing spindle, and tested PCB(printed circuit boards) drilling with 0.4mm micro drill at 90,000rpm and 110,000rpm in order to obtain drilling hole error. Results are as follows; The air bearing spindle's Runout was not so high within $10\mu{m}$ from 20,000rpm to 80,000rpm but it grew after 80,000rpm. Drilling hole size error was 9% at 80,000rpm and 12% at 110,000rpm because of spindle's Run out. Drilled hole shape falsified more 110,000rpm than 90,000rpm.

• 한국기계가공학회지
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• 제16권1호
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• pp.36-41
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• 2017

In this paper, $Si_3N_4/hBN$ ceramics with various hexagonal boron nitride (hBN) contents (0, 10, 20, or 30 wt%) were fabricated via spark plasma sintering (SPS) at $1500^{\circ}C$, 50MPa, and 10m holding time. The material properties such as the relative density, hardness, and fracture toughness were systematically evaluated according to the hBN content in the $Si_3N_4/hBN$ ceramics. The results show that relative density, hardness, and fracture toughness continuously decreased as the hBN content increased. In addition, peak-step drilling (with tool diameter $500{\mu}m$) was performed to observe the effects of hBN content in micro-hole shape and cutting force. A machined hole diameter of $510{\mu}m$ (entrance) and stable cutting force were obtained at 30 wt% hBN content. Consequently, $Si_3N_4/30wt%$ hBN ceramic is a feasible material upon which to apply semi-conductor components, and this study is very meaningful for determining correlations between material properties and machining performance.

• 한국전기전자재료학회논문지
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• 제19권9호
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• pp.825-831
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• 2006

As an increase of chip complexity and level of chip integration, chip input/output (I/O) pad pitches are also drastically reduced. With arrival of high complexity SoC (System on Chip) and SiP (System in Package) products, conventional horizontal type probe card showed its limitation on probing density for wafer level test. To enhance probing density, we proposed new vertical type probe card that has the $70{\mu}m$ probe needle with tungsten wire in $80{\mu}m$ micro-drilled hole in ceramic board. To minimize alignment error, micro-drilling conditions are optimized and epoxy-hardening conditions are also optimized to minimize planarity changes. To apply wafer level test for target devices (T5365 256M SDRAM), designed probe card was characterized by probe needle tension for test, contact resistance measurement, leakage current measurement and the planarity test. Compare to conventional probe card with minimum pitch of $50{\sim}125{\mu}m\;and\;2\;{\Omega}$ of average contact resistance, designed probe card showed only $22{\mu}$ of minimum pitch and $1.5{\Omega}$ of average contact resistance. And also, with the nature of vertical probing style, it showed comparably small contact scratch and it can be applied to bumping type chip test.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1202-1205
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• 2005

Micro hole is one of basic elements for micro device or micro parts. By micro ECM, micro holes less than $50\mu{m}$ in diameter can be machined easily. Machining characteristics of micro ECM were investigated according to machining conditions such as electrolyte concentration and pulse conditions. From the investigation, optimal machining conditions were suggested for micro ECM of stainless steel. For the micro machining with high resolution, the change of machining gap should be predicted. By using electrochemical principle equations, the change of machining gap was simulated.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2010년도 춘계학술발표대회 초록집
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• pp.32-38
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• 2010

Hybrid material(ceramic+metal) processes were developed for micro filter using ceramics coating at metal filter surface by thermal spray method, micro hole drilling at ceramic coated filter surface by femtosecond laser, and fiber laser direct welding of ceramic and metal (SUS304, SM45C) by capillary effect. Thermal spray process was used for ceramic powders and metal filters. The used ceramic powders were $Al_2O_3+40TiO_2$(Metco 131VF) powder of maximum particle size $5{\mu}m$ and ${Al_2O_3}99+$(Metco 54NS) power of maximum particle size 45m. Ceramic coated filters using thermal spray method had a great influence on powder material, particle size and coating thickness but had a fine performance as a micro filter. CW fiber laser was used to drill the top ceramic layer and melt the bottom metal layer for joining applications.