• Proceedings of the Korean Vacuum Society Conference
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• 2000.02a
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• pp.90-90
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• 2000

이온빔을 이용한 리소그래피의 경우 미크론 이하의 미세구조를 형성할 수 있는 유용한 수단으로서 방사광 X-선과 함께 주목을 받고 있으며, 이와 같은 미세구조 제작은 MEMS (Micro Electro-Mechanical System) 개발에 있어서 매우 중요하다. 그러나 이온빔을 이용한 리소그래피에 대한 연구가 많이 이루어져 있지 않은 상태이다. MeV급 양정사 빔을 이용한 리소그래피의 가능성을 확인하기 위하여 기본적인 실험을 수행하였으며, 최적 이온빔 조사 조건 및 최적 현상 조건을 도출하였다. Resist로는 PMMA를 사용하였으며, 1.8 MeV 양성자 빔을 사용하여 50$\mu\textrm{m}$ 깊이의 구조물을 만들었다. 1.8MeV 양성자 빔의 조사선량이 7x1013ions/cm2 이상이 되면 PMMA 내부에 기포가 형성되므로 적정 조사선량을 4x1013 ions/cm2으로 결정하였다. 또한 선량을 4x1013ions/cm2 으로 고정하고 선량률을 변화시켜주면 선량률이 8x1011ions/cm2S 일 때부터 시료에 기포나 터짐 현상 등의 문제가 발생하였으며 5x1010~~1x1010ions/cm2s 의 선량률이 조사시간, 결함측면에서 가장 적합한 영역임을 알 수 있었다. 현상제로는 20% morpholine, 5% etanolamine 60% diethylenglykol-monobutylether, 15% 증류수를 혼합하여 사용하였다. 현상 온도를 30~5$0^{\circ}C$로 변화시켜서 현상을 한 결과, 4$0^{\circ}C$에서 현상 소요시간은 1시간 이내이며 SEM으로 관찰된 표면의 상태도 제일 양호한 결과를 보였다. 82 mesh 밀도, 선굵기 60$\mu\textrm{m}$, 크기 20x20 mm인 백금 망을 마스크로 사용하여 실제 3차원 미세구조를 제작하여 보았다. 그림 1에서 제작된 구조물의 SEM 사진을 보여주었으며, 식각된 면의 조도가 매우 뛰어나며 모서리의 직각성도 우수함을 확인할 수 있다. 이와 같이 도출된 시험 조건을 기초로 하여 리소그래피 후에 전기 도금을 이용한 금속 몰드 제작 및 이온빔 리소그래피 장점을 최대한 살릴수 있는 미세구조 제작에 대한 연구를 계속 추진할 계획이다.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.216.1-216.1
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• 2013

PZT 박막은 강유전 특성과 압전소자 특성을 나타내는 물질로 DRAM (dynamic random acess memory)과 FRAM (ferroelectric RAM) 등의 기억소자용 capacitor와 MEMS (micro electro mechanical system) 소자의 압전 물질로 사용하기 위한 연구가 진행중에 있다. 하지만 이러한 연구에서는 PZT 박막의 전기적 특성 향상을 주목적으로 연구가 진행되어 왔다. 특히, 박막 공정중 발생하는 plasma에 의한 PZT의 전기적 특성 변화가 박막 표면의 물리적 변화에 기인할 것으로 추정하고 있지만 이에 대한 구체적인 연구는 미비하다. 이 연구에서는 plasma에 의한 PZT 박막 표면의 물리적 특성 변화를 연구하기 위하여 PZT 박막을 sol-gel을 이용하여 Si 기판위에 약 100 nm의 두께로 증착하였으며, 이후 최대 300 W의 Ar plasma로 plasma power을 증가시켜 각각 10분간 plasma처리를 실시하였다. PZT 박막 표면의 nano-mechanics 특성을 분석하기 위하여 Nano-indenter와 Kelvin Probe Force Microscopy (KPFM)을 사용하여 surface hardness, surface morphology를 확인하였고 특히, surface potential 분석을 통하여 PZT 박막 표면의 plasma에 의한 박막 극 표면의 전기적 특성 변화를 연구하였다. 이 연구로 plasma에 의한 PZT 박막은 표면으로부터 최대 43 nm 깊이에서의 hardness는 최대 5.1 GPa에서 최소 4.3 GPa의 분포로 plasma power 변화에 의한 특성은 측정 불가능하였다. 이는 plasma에 의한 영향이 시료 극 표면에 국한되어 나타나기 때문으로 추정되며 이를 보완하기 위하여 surface potential을 분석하였다. 결과에 의하면 plasma power가 0 W에서 300 W로 증가함에 따라 potential이 30 mV에서 -20 mV로 감소하였으나 potential의 분산은 100 W에서 최대인 17 mV로 측정되었으며, 이때 RMS roughness역시 가장 높은 20.145 nm로 측정되었다. 특히, 100 W에서 potential에서는 물결 모양과 같은 일정한 패턴의 potential 무늬가 확인되었다.

• Smart Structures and Systems
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• v.6 no.5_6
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• pp.641-659
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• 2010

Structural Health Monitoring (SHM) gradually becomes a technique for ensuring the health and safety of civil infrastructures and is also an important approach for the research of the damage accumulation and disaster evolving characteristics of civil infrastructures. It is attracting prodigious research interests and the active development interests of scientists and engineers because a great number of civil infrastructures are planned and built every year in mainland China. In a SHM system the sheer number of accompanying wires, fiber optic cables, and other physical transmission medium is usually prohibitive, particularly for such structures as offshore platforms and long-span structures. Fortunately, with recent advances in technologies in sensing, wireless communication, and micro electro mechanical systems (MEMS), wireless sensor technique has been developing rapidly and is being used gradually in the SHM of civil engineering structures. In this paper, some recent advances in the research, development, and implementation of wireless sensors for the SHM of civil infrastructures in mainland China, especially in Dalian University of Technology (DUT) and Harbin Institute of Technology (HIT), are introduced. Firstly, a kind of wireless digital acceleration sensors for structural global monitoring is designed and validated in an offshore structure model. Secondly, wireless inclination sensor systems based on Frequency-hopping techniques are developed and applied successfully to swing monitoring of large-scale hook structures. Thirdly, wireless acquisition systems integrating with different sensing materials, such as Polyvinylidene Fluoride(PVDF), strain gauge, piezoresistive stress/strain sensors fabricated by using the nickel powder-filled cement-based composite, are proposed for structural local monitoring, and validating the characteristics of the above materials. Finally, solutions to the key problem of finite energy for wireless sensors networks are discussed, with future works also being introduced, for example, the wireless sensor networks powered by corrosion signal for corrosion monitoring and rapid diagnosis for large structures.

• Korean Journal of Materials Research
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• v.8 no.8
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• pp.744-750
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• 1998

Unlike common device, MEMS(micro-electro-mechanical system) device consists of very small mechanical structures which determine the performance of the device. Because of its small mechanical structure inside. MEMS device is very sensitive to thermal stress caused by CTE(coefficient of thermal expansion) mismatch between its components. Therefore, its characteristics are affected by material properties. process temperature. and dimensions of each layer such as chip, adhesive and substrate. In this study. we investigated the change of the thermal stress in the chip attached to a substrate. With computer-aided finite element method (FEM), the computer simulation of the thermal stress was conducted on variables such as bonding material, process temperature, bonding layer thickness and die size. The commercial simulation program, ABAQUS ver5.6, was used. Subsequently 3-layer test samples were fabricated, and their degree of bending were measured by 3-D coordinate measuring machine. The experimental results were in good agreement with the simulation results. This study shows that the bonding layer could be the source of stress or act as the buffer layer for stress according to its elastic modulus and CTE. Solder adhesive layer was the source of stress due to its high elastic modulus, therefore high compressive stress was developed in the chip. And the maximum tensile stress was developed in the adhesive layer. On the other hand, polymer adhesive layer with low elastic modulus acted as buffer layer, and resulted in lower compressive stress. The maximum tensile stress was developed in the substrate.

• Journal of Navigation and Port Research
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• v.37 no.6
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• pp.575-580
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• 2013

The IMU(Inertial Measurement Unit) which is the expensive equipment has been used as a special limited area, usually in measurement of posture of applying to the areas of ship, submarine, aircraft and military equipment application. However, in the current situation, MEMS AHRS technology can replace the high-priced IMU in MEMS AHRS selected application field. In this paper, wireless hull motion measurement system was suggested for measuring key elements of ship's movement such as rolling, pitching and yawing using gyro, acceleration and magnetic sensors of AHRS. In order to reduce the error such as instantaneous acceleration, effects and vibration of geomagnetic, we have adopted the sensors equipped with Kalman filtering. The Wireless hull motion measurement system using AHRS sensors was tested in actual ship and it could easily be applied in limited installation circumstances of the ship. In the future, this system can be useful in the navigation safety and marine accident analysis by using with ship equipment such as INS or VDR in the maritime.

• The Journal of the Acoustical Society of Korea
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• v.22 no.3
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• pp.217-223
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• 2003

A novel cooling method induced by acoustic streaming generated by ultrasonic vibration at 30㎑ is presented. Ultrasonic vibration is obtained by piezoelectric devices and the maximum vibration amplitude of 50 m is achieved by including a horn, mechanical vibration amplifier in the system and making the complete system resonate. To investigate the enhancement of heat transfer capability of acoustic streaming, the temperature variations of heat source and air in the vicinity of heat source are measured in real-time. It is observed that acoustic streaming is instantly induced by ultrasonic vibration, resulting in the significant temperature drop due to the bulk air flow caused by acoustic streaming. In addition, it is observed that the cooling effect on the heat source is maximized when the gap between the ultrasonic vibrator and heat source coincides with the multiples of half-wavelength of the ultrasonic wave. This fact results from the resonance of the sound wave. The theoretical analysis of the dependence on the gap is also accomplished and verified by experiment. The advantage of the proposed cooling method by acoustic streaming is noise-free due to the ultrasonic vibration and maintenance-free because of the absence of moving parts. Moreover. This cooling method can be utilized to the nano and micro-electro mechanical systems, where the fan-based conventional cooling method can not be employed.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.14 no.6
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• pp.528-535
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• 2004

Ultrasonic Vibrator is designed to achieve the maximum vibration amplitude at 30 kHz by in-cluding a horn (diameter, 40 mm), mechanical vibration amplifier at the top of the ultrasonic vibrator in the system and making the complete system resonate. In addition, it is experimentally visualized by particle imaging velocimetry (PIV) that the acoustic streaming velocity in the gap is at maximum when the gap between the ultrasonic vibrator and stationary plate agrees with the multiples of half-wavelength of the ultrasonic wave. This fact results from the resonance of the sound wave and the theoretical analysis of that is also accomplished and verified by experiment. It is observed that the magnitude of the acoustic streaming dependent upon the gap between the ultrasonic vibrator and stationary plate possibly changes due to the measurement of the average velocity fields of the acoustic streaming induced by the ultrasonic vibration at resonance and non-resonance. There exists extremely small average velocity at non-resonant gaps while the relatively large average velocity exists at resonant gaps compared with non-resonant gaps. It also reveals that there should be larger axial turbulent intensity at the hub region of the vibrator and at the edge of it in the resonant gap where the air streaming velocity is maximized and the flow phenomena is conspicuous than that at the other region. Because the variation of the acoustic streaming velocity at resonant gap is more distinctive than that at non-resonant gap, shear stress increases more in the resonant gap and is also maximized at the center region of the vibrator except the local position of center (r〓0). At the non-resonant gap there should be low values of vorticity distribution, but in contrast to the non-resonant gap, high and negative values of it exist at the center region of the vibrator with respect to the radial direction and in the vicinity of the middle region with respect to the axial direction. Acoustic streaming is noise-free due to the ultrasonic vibration and maintenance-free because of the absence of moving parts. Moreover, the proposed method by acoustic streaming can be utilized to the nano and micro-electro mechanical systems as a driving mechanism in addition to the augmentation of the streaming velocity.

• Journal of the Korean Society for Nondestructive Testing
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• v.24 no.6
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• pp.573-580
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• 2004

The main goal of this study was to develop a micro-fabrication process for the capacitive micromachined ultrasonic transducer (cMUT). In order to achieve this goal, the former research results of the micro-electro-mechanical system (MEMS) process for the cMUT were analyzed. The membrane deposition, sacrificial layer deposition and etching were found to be a main process of fabricating the cMUT. The optimal conditions for those microfabrication were determined by the experiment. The thickness, uniformity, and residual stress of the $Si_3N_3$ deposition which forms the membrane of the cMUT were characterized after growing the $Si_3N_3$ on Si-wafer under various process conditions. As a sacrificial layer, the growth rate of the $SiO_2$ deposition was analyzed under several process conditions. The optimal etching conditions of the sacrificial layer were analyzed. The microfabrication process developed in this study will be used to fabricate the cMUT.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.45 no.1
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• pp.36-45
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• 2017

Abstract It is necessary to verify the properties of an inertial measurement unit in the flight environment before applying to military applications. In this paper, we presented a new approach to verify an inertial measurement unit(IMU) in regard to the performance and the robustness in flight environments for the high-dynamics vehicle systems. We proposed two methods for verification of an IMU. We confirmed normal operation of an IMU and properties in flight environment by using direct comparison method. And we proposed real time multi-navigation system to complement the first method. The proposed method made it possible to compare navigation result at the same time. Therefore, it is easy to analyze the performance of an inertial navigation system and robustness during the vehicle flight. To verify the proposed method, we carried out a flight test as well as an experimental test of flight vibration on the ground. As a result of the experiment, we confirmed flight environment properties of an IMU. Therefore, we shows that the proposed method can serve the reliability improvement of IMU.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.21 no.7
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• pp.831-841
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• 2010

The conventional vertical probe has the thin and long signal path that makes transfer characteristic of probe worse because of the S-shaped structure. So we propose the new vertical probe structure that has branch springs in the S-shaped probe. It makes closed loop when the probe mechanically connects to the electrode on a wafer. We fabricated the proposed vertical probe and measured the transfer characteristic and mechanical properties. Compared to the conventional S-shaped vertical probe, the proposed probe has the overdrive that is 1.2 times larger and the contact force that is 2.5 times larger. And we got the improved transfer characteristic by 1.4 dB in $0{\sim}10$ GHz. Also we developed the simulation model of the probe card by using full-wave simulator and the simulation result is correlated with measurement one. As a result of this simulation model, the cantilever probe and PCB have the worst transfer characteristic in the probe card.