• Transactions of Materials Processing
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• v.25 no.6
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• pp.353-358
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• 2016

Direct energy deposition (DED) is an additive manufacturing technique that involves the melting of metal powder with a high-powered laser beam and is used to build a variety of components. In recent year, it can be widely used in order to produce hard, wear resistant and/or corrosion resistant surface layers of metallic mechanical parts, such as dies and molds. For the purpose of the hardfacing to achieve high wear resistance and hardness, application of high speed steel (HSS) can be expected to improve the tool life. During the DED process using the high-carbon steel, however, defects (delamination or cracking) can be induced by rapid solidification of the molten powder. Thus, substrate preheating is generally adopted to reduce the deposition defect. While the substrate preheating ensures defect-free deposition, it is important to select the optimal preheating temperature since it also affects the microstructure evolution and mechanical properties. In this study, AISI M4 powder was deposited on the AISI 1045 substrate preheated at different temperatures (room temperature to $500^{\circ}C$). In addition, the micro-hardness distribution, cooling rates, and microstructures of the deposited layers were investigated in order to observe the influence of the substrate preheating on the mechanical and metallurgical properties.

• Journal of the Korean Ceramic Society
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• v.54 no.1
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• pp.43-48
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• 2017

In this study, we investigate the effect of additive size on the densification and thermal conductivity of AlN ceramics with $MgO-CaO-Al_2O_3-SiO_2$ (MCAS) additives. Micro-sized MCAS powder prepared via melting and nano-sized MCAS powder synthesized via the polymeric complex method are used as sintering additives. We analyze the densification behavior of AlN added with 5 wt.% of MCAS by dilatometry as well as by isothermal sintering in the temperature range of $1300{\sim}1700^{\circ}C$. AlN exhibits higher sinterability with nano-MCAS than with micro-MCAS, and both specimens approach their maximum densities when sintered at $1600^{\circ}C$ for 4 h. The thermal conductivities of AlN with 5 wt% of nano- and micro-MCAS additives sintered at $1600^{\circ}C$ are 82.6 and 32.0 W/mK, respectively. We find that nano-MCAS is more effective in sintering of AlN ceramics at lower temperatures, and thus for enhancing their thermal conductivities.

• Journal of Powder Materials
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• v.17 no.4
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• pp.319-325
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• 2010

Electrical discharge machining (EDM) is an attractive machining technique but it requires electrically conductive ceramic materials. In this study, Alumina matrix composites reinforced with CNTs were fabricated through CNT purification, mixing, compaction and spark plasma sintering (SPS) processes. $Al_2O_3$ nanocomposites with the different CNT concentrations were synthesized. The mechanical and electrical characteristics of $Al_2O_3$/CNTs composites were examined in order to apply the materials to the EDM process. In addition, micro-EDM using wire electrical discharge grinding (WEDG) was conducted under the various EDM parameters to investigate the machining characteristics of machined hole by Field Emission Scanning Electron Microscope (FE-SEM). The results show that $Al_2O_3$/CNTs 10%Vol. was more suitable than the other materials because high conductivity and large discharge energy caused violent sparks resulting in bad machining accuracy and surface quality.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.55-59
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• 2015

Novel low-volume solder-on-pad (SoP) process is proposed for a fine pitch Cu pillar bump interconnection. A novel solder bumping material (SBM) has been developed for the $60{\mu}m$ pitch SoP using screen printing process. SBM, which is composed of ternary Sn-3.0Ag-0.5Cu (SAC305) solder powder and a polymer resin, is a paste material to perform a fine-pitch SoP in place of the electroplating process. By optimizing the volumetric ratio of the resin, deoxidizing agent, and SAC305 solder powder; the oxide layers on the solder powder and Cu pads are successfully removed during the bumping process without additional treatment or equipment. The Si chip and substrate with daisy-chain pattern are fabricated to develop the fine pitch SoP process and evaluate the fine-pitch interconnection. The fabricated Si substrate has 6724 under bump metallization (UBM) with a $45{\mu}m$ diameter and $60{\mu}m$ pitch. The Si chip with Cu pillar bump is flip chip bonded with the SoP formed substrate using an underfill material with fluxing features. Using the fluxing underfill material is advantageous since it eliminates the flux cleaning process and capillary flow process of underfill. The optimized interconnection process has been validated by the electrical characterization of the daisy-chain pattern. This work is the first report on a successful operation of a fine-pitch SoP and micro bump interconnection using a screen printing process.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2004.03a
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• pp.593-596
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• 2004

We are developing a micro-solid propellant rocket array thruster for simple attitude control of a 10 kg class micro-spacecraft. The prototype has ø 0.8 mm solid propellant micro-rockets arrayed at a pitch of 1.2 mm on a 22 x 22 mm substrate. In previous studies, an impulse thrust of 4.6 x 10$^{-4}$ Ns was obtained in vacuum, but we found the problems of unacceptably low ignition success rate and incomplete combustion. This paper describes experiments to improve the ignition rate. In order to achieve this goal, we tried to solidify paste-like ignition aid (RK) on the ignition heaters with strong adhesion. To make the paste-like RK, isoamyl acetate was added to RK powder. We tested 9 rockets, but only 2 rockets were ignited with huge ignition energy. This is because the heat con-duction between the ignition heater and the RK was too low to ignite the RK, since dried RK had a lot of pores. Also, a large cavity was sometimes found just above the ignition heater.

• Journal of Sensor Science and Technology
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• v.19 no.4
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• pp.291-296
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• 2010

Recently, recycling method of waste wafer has been an area of solar cell to cut costs. Micro_blasting is one of the promising candidates for recycling of waste wafer due to their extremely simple and cost-effective process. In this paper, we attempt to explore the effect of micro_blasting and DRE(damage removal etching) process for solar cell. The optimal process conditions of micro_blasting are as follows: $10{\mu}m$ sized $Al_2O_3$ powder, jetting pressure of 400 kPa, and scan_speed of 30 cm/s. And the particles formed on micro_blasted wafer were removed by DRE precess which was performed by using HNA(HF/$HNO_3$/$CH_3COOH$) and TMAH(tetramethyl ammonium hydroxide). Structural analysis was done using a-step and the XRD patterns.

• Journal of Powder Materials
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• v.25 no.3
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• pp.246-250
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• 2018

In this study, we investigate the deformation behavior of $Hf_{44.5}Cu_{27}Ni_{13.5}Nb_5Al_{10}$ metallic glass powder under repeated compressive strain during mechanical milling. High-density (11.0 g/cc) Hf-based metallic glass powders are prepared using a gas atomization process. The relationship between the mechanical alloying time and microstructural change under phase transformation is evaluated for crystallization of the amorphous phase. Planetary mechanical milling is performed for 0, 40, or 90 h at 100 rpm. The amorphous structure of the Hf-based metallic glass powders during mechanical milling is analyzed using differential scanning calorimetry (DSC) and X-ray diffraction (XRD). Microstructural analysis of the Hf-based metallic glass powder deformed using mechanical milling reveals a layered structure with vein patterns at the fracture surface, which is observed in the fracture of bulk metallic glasses. We also study the crystallization behavior and the phase and microstructure transformations under isothermal heat treatment of the Hf-based metallic glass.

• Journal of Powder Materials
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• v.16 no.5
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• pp.326-335
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• 2009

Fe based (Fe$_{68.2}$C$_{5.9}$Si$_{3.5}$B$_{6.7}$P$_{9.6}$Cr$_{2.1}$Mo$_{2.0}$Al$_{2.0}$) amorphous powder, which is a composition of iron blast cast slag, were produced by a gas atomization process, and sequently mixed with ductile Cu powder by a mechanical ball milling process. The Fe-based amorphous powders and the Fe-Cu composite powders were compacted by a spark plasma sintering (SPS) process. Densification of the Fe amorphous-Cu composited powders by spark plasma sintering of was occurred through a plastic deformation of the each amorphous powder and Cu phase. The SPS samples milled by AGO-2 under 500 rpm had the best homogeneity of Cu phase and showed the smallest Cu pool size. Micro-Vickers hardness of the as-SPSed specimens was changed with the milling processes.

• Journal of Powder Materials
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• v.13 no.5 s.58
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• pp.321-326
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• 2006

Electronic packaging involves interconnecting, powering, protecting, and cooling of semiconductor circuits fur the use in a variety of microelectronic applications. For microelectronic circuits, the main type of failure is thermal fatigue, owing to the different thermal expansion coefficients of semiconductor chips and packaging materials. Therefore, the search for matched coefficients of thermal expansion (CTE) of packaging materials in combination with a high thermal conductivity is the main task for developments of heat sink materials electronics, and good mechanical properties are also required. The aim of this work is to develop copper matrix composites reinforced with carbon nanofibers. The advantages of carbon nanofibers, especially the good thermal conductivity, are utlized to obtain a composite material having a thermal conductivity higher than 400 W/mK. The main challenge is to obtain a homogeneous dispersion of carbon nanofibers in copper. In this paper, a technology for obtaining a homogeneous mixture of copper and nanofibers will be presented and the microstructure and properties of consolidated samples will be discussed. In order to improve the bonding strength between copper and nanofibers, different alloying elements were added. The microstructure and the properties will be presented and the influence of interface modification will be discussed.

• Journal of Powder Materials
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• v.12 no.6 s.53
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• pp.447-452
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• 2005

The synthesis and consolidation of titanium silicide by electro-discharge-sintering has been investigated. As-received Ti powder was in flaky shape and the mean particle size was $45.0{\mu}m$, whereas the mean particle size of the pre-milled Si powder with angular shape was $8.0{\mu}m$. Single pulse of 2.5 to 5.0 kJ/0.34g-elemental Ti and pre-milled Si powder mixture with the composition of $Ti-37.5at.\%$ Si was applied using $300{\mu}F$ capacitor. The solid with $Ti_5Si_3$ phase has been successfully fabricated by the discharge with the input energy more than 2.5kJ in less than $129{\mu}sec.$ Hv values were found to be higher than $1000kgf/mm^2$. The formation of $Ti_5Si_3$ occurred through a fast solid state diffusion reaction.