• 전기학회논문지
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• 제61권1호
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• pp.22-27
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• 2012

Correct and fast detection of a micro-grid (MG) islanding is essential to the MG since operation, control and protection of the MG depend on an operating mode i.e., an interconnected mode or an islanding mode. When islanding occurs, the frequency of the point of common coupling (PCC) is not the nominal frequency during the transient state owing to the frequency rise or drop of generators in the MG. Thus, the active and reactive power calculated by the frequency domain based method such as Fourier Transform might contain some errors. This paper proposes an islanding detection algorithm for the MG based on the instantaneous active and reactive powers delivered to the dedicated line in the time domain. During the islanding mode, the instantaneous active and reactive powers delivered to the dedicated line are constants, which depend on the voltage of the PCC and the impedance of the dedicated line. In this paper, the instantaneous active and reactive powers are calculated in the time domain and used to detect islanding. The performance of the proposed algorithm is verified under various scenarios including islanding conditions, fault conditions and load variation using the PSCAD/EMTDC simulator. The results indicate that the algorithm successfully detects islanding for the MG.

• 한국정밀공학회지
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• 제18권10호
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• pp.178-183
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• 2001

Abrasive jet machining(AJM) process is similar to the sand blasting and effectively removes hard and brittle materials. AJM has applied to rough working such as debarring and rough finishing. As the need for machining of ceramics, semiconductor, electronic devices and LCD are increasing, micro AJM is developed, and has become the inevitable technique to micromachining. This paper describes the performance of the micro AJM in micro grooving of glass. Diameter of hole and width of line in grooving is 80${\mu}{\textrm}{m}$. Experimental results showed good performance in micro grooving of glass, but the size of machined groove increased about 2~4${\mu}{\textrm}{m}$. With the fine tuning of masking process and compensation of film wear. this micro AJM could be effectively applied to the micro machining of semiconductor, electronic devices and LCD.

• 센서학회지
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• 제20권3호
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• pp.187-192
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• 2011

Abrasive blaster is similar to sand blaster, and effectively removes hard and brittle materials. Exiting abrasive blaster has applied to rough working such as deburring and rough finishing. As the need for machining of ceramics, semiconductor, electronic devices and LCD are increasing, micro abrasive blaster was developed, and became the inevitable technique to micromachining. This paper describes the performance of the micro blaster in MEMS process of glass and succeed in domestically producing complete micro blaster. Diameter of hole and width of line in this etching is 100 ${\mu}m$ ~ 1000 ${\mu}m$. Experimental results showed good performance in micro channel and hole in glass wafer. Therefore, this micro blaster could be effectively applied to the micro machining of semiconductor, micro PCR chip.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2009년도 춘계학술발표대회
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• pp.12.1-12.1
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• 2009

For the micro conductive line, memory device fabrication process use many expensive processes such as manufactur-ing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because nano-metal particles contained inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as FPCB, PCB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line on flexible PCB substrate for the next generation electronic circuit using Ag nano-particles contained ink. To improve the line tolerance on flexible PCB, metal lines are fabricated by sequential prinitng method. Sequential printing method has vari-ous merits about fine, thick and high resolution pattern lines without bulge.

• 한국정밀공학회지
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• 제25권5호
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• pp.96-102
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• 2008

Manufacturing of printed electronics using printing technology has begun to get into the hot issue in many ways due to the low cost effectiveness to existing semi-conductor process. This technology, with low cost and high productivity, can make it possible to produce printed electronics such as TFT, solar cell, RFID Tag, printed battery, and so on. In this study, apparatus of gravure-offset printing are developed for fine line-width/gap printing and the results obtained from the apparatus shows that it is possible to make around 20 micro-meter line-width/gap printing patterns. The roll-to-roll printing system for fine line-width printing based on primary experiment is presented. The printing results obtained from the system shows around 30 micro-meter line-width/gap printing patterns.

• Journal of Electrical Engineering and Technology
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• 제10권3호
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• pp.1328-1334
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• 2015

A new system for evaluating the voltage management errors of distribution equipment is presented in this paper. The main concept of the new system is to use real distribution live-line voltage to evaluate and correct the voltage measurement data from distribution equipment. This new approach is suitable for a new Distribution Management System (DMS) which has been developed for a distribution power system due to the connection of distributed generation growth. The data from distribution equipment that is installed at distribution lines must be accurate for the performance of the DMS. The proposed system is expected to provide a solution for voltage measurement accuracy assessment for the reliable and efficient operation of the DMS. An experimental study on actual distribution equipment verifies that this voltage measurement accuracy assessment system can assess and calibrate the voltage measurement data from distribution equipment installed at the distribution line.

• 한국표면공학회지
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• 제53권4호
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• pp.138-143
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• 2020

In this study, we produced a coil of micro-pattern that can be used for electromagnetic wave absorber, heating material, wireless charging, sensor, antenna, etc. by using electrochemical additive manufacturing method. Currently, it contains research contents for manufacturing a micro pattern coil having practicality through control of process control variables such as applied voltage, distance between electrode, and nozzle injection. Circulation of the electrolyte through the nozzle injection control can significantly contribute to improving the surface characteristics of the coil because of minimizing voltage fluctuations that may occur during the additive manufacturing process. In addition, by applying the pulse method in the application of voltage, the lamination characteristics of the plated body were improved, which showed that the formation of a fine line width plays an important role in the production of a micro pattern coil. By applying the pulse signal to the voltage application, the additive manufacturing characteristics of the produced product were improved, and it was shown that the formation of a fine line width plays an important role in the production of a micro pattern coil.

• Applied Microscopy
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• 제46권1호
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• pp.27-31
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• 2016

It has been investigated what kind of characteristic X-ray in electron probe micro-analyzer (EPMA) is effective for the determination of compounds of Si series materials. After comparing the characteristic X-rays among the primary and secondary lines in $K_{\alpha}$ and $K_{\beta}$ obtained from the Si series standard samples, it was found that the secondary line of $K_{\alpha}$ exhibited the most informative spectrum although the intensity was considerably weak. As a result of analyzing the spectrum shapes of the Si series standard samples, the spectrum shape of the secondary line of $K_{\alpha}$ for SiC was different from those for other Si compounds. To grasp the characteristics of the shape, a line was perpendicularly drawn from the peak top to base line in order to divide a spectrum into two areas. The area ratio of right to left was defined to call as the asymmetry index here. As a result, the asymmetry index value of the SiC was greater than one, while those of other Si compounds were less than one. It was found from the EPMA analysis that identification of SiC became successful to distinguish from other Si compounds and this method was applicable for micro-sized compounds in a practical composite material.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 추계학술대회 논문집
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• pp.963-966
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• 2000

Abrasive jet machining(AJM) process is similar to the sand blasting, and effectively removes hard and brittle materials. AJM has applied to rough working such as deburring and rough finishing. As the needs for machining of ceramics, semiconductor, electronic devices and LCD are increasing, micro AJM was developed, and became the inevitable technique to micromachining. This paper describes the performance of the micro AJM in micro groove cutting of glass. Diameter of hole and width of line in this groove cutting is 80${\mu}{\textrm}{m}$. Experimental results showed good performance in micro groove cutting in glass, but the size of machined groove was increased about 2~4${\mu}{\textrm}{m}$. therefore, this micro AJM could be effectively applied to the micro machining of semiconductor, electronic devices and LCD parts.

• 한국기계가공학회지
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• 제15권1호
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• pp.8-13
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• 2016

The micro drill bit automatic regrinding in-line system is a system that refurbishes drill bits used in a PCB manufacturing process. This system is able to refurbish drill bits with a minimum size of ø0.15-0.075mm that have previously been discarded. Beyond the conventional manual cleaning process using ultrasound, this system adopts a water jet cleaning system, making it capable of cleaning drill bits with a minimum size of ø0.15-0.075mm. This paper analyses various contact pressures applied to the surface of drill bits depending on the shooting pressure of the cleaning device and fluid velocity in order to optimize the nozzle location and to detect structural instability caused by the contact pressures.