• 인포메이션 디스플레이
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• 제19권6호
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• pp.41-51
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• 2018

차세대 디스플레이로 부상하고 있는 Micro LED는 현재까지 여러 기술적인 문제로 상용화가 어려운 상황이다. 특히 Micro 단위로 작은 LED를 디스플레이 기판으로 옮기는 전사(Transfer) 기술이 상용화를 가지고 올 수 있는 핵심 기술이며, 중요한 변수다. 전사기술의 핵심은 LED를 원하는 위치에 빠르고 정확하게 이동시키는 것에 있다. 따라서 Micro LED에서 가장 핵심 과제인 전사 기술에 대해 고민할 필요가 있으며, 전사 기술 중 하나인 Elastomer Stamp를 이용한 전사 기술에 대해서 분석해보고 정리해보았다.

• Tribology and Lubricants
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• 제38권3호
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• pp.93-100
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• 2022

Micro-light emitting diode (micro-LED) displays offer numerous advantages such as high brightness, fast response, and low power consumption. Hence, they are spotlighted as the next-generation display. However, defective LEDs may be created due to non-uniform contact loads or LED alignment errors. Therefore, a repair process involving the replacement of defective LEDs with favorable ones is necessitated. The general repair process involves the removal of defective micro-LEDs, interconnection material transfer, as well as new micro-LED transfer and bonding. However, micro-LEDs are difficult to repair since their size decreases to a few tens of micron in width and less than 10 ㎛ in thickness. The conventional nozzle-type dispenser for fluxes and the conventional vacuum chuck for LEDs are not applicable to the micro-LED repair process. In this study, transfer conditions are determined using a micro stamp for repairing micro-LEDs. Results show that the aging time should be set to within 60 min, based on measuring the aging time of the flux. Additionally, the micro-LEDs are subjected to a compression test, and the result shows that they should be transferred under 18.4 MPa. Finally, the I-V curves of micro-LEDs processed by the laser and hot plate reflows are measured to compare the electrical properties of the micro-LEDs based on the reflow methods. It was confirmed that the micro-LEDs processed by the laser reflow show similar electrical performance with that processed by the hot plate reflow. The results can provide guidance for the repair of micro-LEDs using micro stamps.

• 마이크로전자및패키징학회지
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• 제29권2호
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• pp.121-127
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• 2022

마이크로 LED는 크기가 100 ㎛ 이하인 LED 소자로 기존 LED에 비해 해상도, 밝기 등 여러 면에서 우수한 성능을 보일 뿐 아니라 유연 디스플레이, VR/AR 등 다양한 분야에 적용이 가능하다. 마이크로 LED 디스플레이를 제작하기 위해선 LED 웨이퍼로부터 최종기판으로 마이크로 LED를 옮기는 전사 공정이 필수적이며, 본 연구에서는 진공 척을 이용하여 마이크로 LED를 고속 대량 전사하는 방식을 제안하고 이를 검증하였다. MEMS 기술을 이용한 PDMS 마이크로 몰딩 공정을 통해 진공 척을 제작하였으며, PDMS 몰딩 공정을 제어하기 위해 댐 구조를 이용한 스핀 코팅 공정을 성공적으로 적용하였다. 솔더볼을 이용한 진공 척 구동 실험을 통해 진공 척을 이용한 마이크로 LED의 대량 전사 가능성을 확인하였다.

• 전자통신동향분석
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• 제37권2호
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• pp.53-61
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• 2022

MicroLEDs have various advantages and application areas and are in the spotlight as next-generation displays. Nevertheless, the commercialization of microLEDs is slow because of high cost as well as difficulties in the transfer, bonding, and bad pixel repairing process. In this study, we review the development trends of transfer, bonding, and defective pixel repair technologies, which are critical for microLED commercialization, focusing on materials that determine these technologies. In addition, we focus on the simultaneous transfer bonding technology developed by the Electronics and Telecommunications Research Institute, which has been attracting enormous research attention recently.

• 한국전기전자재료학회논문지
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• 제36권6호
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• pp.563-569
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• 2023

마이크로 발광다이오드(LED)는 칩 사이즈가 100마이크로미터 이하인 무기발광재료로 우수한 전기적, 광학적, 기계적 성능 때문에 유연 디스플레이, AR/VR, 바이오 메디컬 분야의 차세대 광원으로 큰 주목을 받고 있다. 특히, 바이오메디컬 분야에 적용하기 위해서는 매우 작은 크기의 마이크로 LED 칩을 원하는 유연 기판에 옮기기 위한 기술이 요구되며, 실제 인간의 얼굴, 장기 등 여러 신체 부위에 적용하기 위해서는 대량의 마이크로 LED 칩을 낮은 정밀 오차, 빠른 속도, 높은 수율로 타겟 기판에 전사하는 것이 중요하다. 본 논문의 목적은 미용/의료용 유연 마이크로 LED 디바이스 제작 공정 방법을 소개하고, 이를 실제 미용/의료 산업에 적용하기 위해 필요한 마이크로 LED 전사 기술을 소개한다. 해당 기술로 제작된 유연 마이크로 LED 디바이스는 피부 질환, 암, 신경질환 등 인간 질병 치료에 널리 활용될 것으로 기대된다.

• 반도체디스플레이기술학회지
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• 제22권2호
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• pp.1-5
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• 2023

In the past, display devices have undergone many changes, such as plasma TVs and LCDs, and have continued to develop. Recently, new display technologies, such as Organic Light Emitting Diode displays and Inorganic Light Emitting Diode displays, have been developed. Among them, Micro LED displays have the potential to improve performance more than LCDs and OLEDs, but a lot of effort and time are needed until the mass production technology (transfer and bonding) of Micro LED displays is developed. We have developed a new Micro LED display light source that can be produced using existing transfer and bonding process technologies to enable faster commercialization of Micro LED in the industry. This light source is TFT deposition on LED. TFT deposition on LED has the advantage of being able to produce displays using existing process technology, making early commercialization of display application products possible. In this study, we applied the Active Driving method to verify the performance of TFT deposition on LED as a display to determine its commercialization potential. Additionally, to facilitate faster application of Micro LED in the industry, we applied TFT deposition on LED to Optical Wireless Communication systems, which are widely used in application service areas such as safety/security and sensors, to verify its communication performance. The experimental results confirmed that TFT deposition on LED is not only capable of AM driving but can also be applied to OWC systems.

• 한국가시화정보학회지
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• 제10권1호
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• pp.34-39
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• 2012

In the present study, oxygen transfer process across gas-liquid interface in a Y-shape micro-channel is quantitatively visualized using the micro laser induced fluorescence (${\mu}$-LIF) technique. Diffusion coefficient of Oxygen ($D_L$) is estimated based on the experimental results and compared to its theoretical value. Tris ruthenium (II) chloride hexahydrate was used as the oxygen quenchable fluorescent dye. A light-emitting diode (LED) with wavelength of 450 nm was used as the light source and phosphorescence images of fluorescent dye were captured by a CMOS high speed camera installed on the microscope system. Water having dissolved oxygen (DO) value of 0% and pure oxygen gas were injected into the Y-shaped microchannel by using a double loading syringe pump. In-situ pixel-by-pixel calibration was carried out to obtain Stern-Volmer plots over whole flow field. Instantaneous DO concentration fields were successfully mapped according to Stern-Volmer plots and DL was calculated as $2.0675{\times}10^{-9}\;m^2/s$.

• World Technopolis Review
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• 제1권1호
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• pp.6-15
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• 2012

Science and technology parks have been popular among policy-makers at several spatial levels to promote innovation and economic growth of certain localities. However, this mainly property-led policy tool has been criticised for two reasons. First, it often failed to successfully support regional networking and technology transfer to regional firms. Only unplanned science and technology parks, such as Silicon Valley, seem to have been successfully fostering regional networking and technology transfer which has led, in turn, to the development of competitive innovative clusters. Secondly, it has too often bet on the same horses and become too specialised in the same fields, such as in micro-electronics or in biotechnology. This specialisation has been theoretically supported by the cluster concept. It has led to both a zero sum game of competition between locations as well as potentially negative path dependence and lock-ins. This paper suggests increasingly supporting diversification in science and technology parks by bringing together hitherto unconnected technologies. Several recently discussed concepts could be used to support diversification, such as related variety (Frenken et al. 2007), regional branching (Boschma and Frenken 2011), regional innovation platforms (Harmaakorpi et al. 2011) and transversality (Cooke 2011).

• ETRI Journal
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• 제46권2호
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• pp.347-359
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• 2024

A simultaneous transfer and bonding (SITRAB) process using areal laser irradiation is introduced for high-yield and cost-effective production of mini- or micro-light-emitting diode (LED) display panels. SITRAB materials are special epoxy-based solvent-free pastes. Three types of pot life are studied to obtain a convenient SITRAB process: Room temperature pot life (RPL), stage pot life (SPL), and laser pot life (LPL). In this study, the RPL was found to be 1.2 times the starting viscosity at 25℃, and the SPL was defined as the time the solder can be wetted by the SITRAB paste at given stage temperatures of 80℃, 90℃, and 100℃. The LPL, on the other hand, was referred to as the number of areal laser irradiations for the tiling process for red, green, and blue LEDs at the given stage temperatures. The process windows of SPL and LPL were identified based on their critical time and conversion requirements for good solder wetting. The measured RPL and SPL at the stage temperature of 80℃ were 6 days and 8 h, respectively, and the LPL was more than six at these stage temperatures.

• 대한기계학회논문집B
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• 제31권3호
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• pp.248-255
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• 2007

Thermal bubble formation is a fundamental process in nucleate boiling heat transfer and many microelectromechanical thermal systems. One of the established facts is that heterogeneous nucleation is originated from vapors trapped inside cavities. Based on this, we performed an experimental study on the formation of thermal bubbles from microcavity fabricated by microfabrication technology on a copper plate. The cavity was filled with aluminum particles to enhance thermal bubble formation. We observed the thermal bubble behaviors, such as bubble incipience, diameter, frequency and coalescence during nucleate boiling. The experimental data showed that the superheat required to trigger the bubble formation was significantly reduced when the cavity was filled with microparticles. We found that the initial increase of superheat led to the increase of both the departure diameter and frequency while the further increase of superheat caused multiple bubbles to coalesce resulting in the decrease of departure frequency.