• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.1052-1055
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• 2001

In micro-drilling of brittle materials including glass, cracks occur at the exit surface. In drilling glass, the main type of crack is cone crack. Cone crack is generated by thrust force acting at the bottom surface of the workpiece. Cone crack size could be reduced by changing cutting conditions, but cone crack still existed. Two methods were proposed to prevent crack formation and perfect hole shapes were obtained. One method is attaching two glass plates with water and the other method is constraining two glass plates. The proposed methods eliminated tensile stress acting on the exit surface of glass and prevented crack propagation.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.12 s.177
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• pp.163-169
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• 2005

Micro hole is ode of basic elements for micro device or micro parts. Micro electrochemical machining (ECM) can be applied to the machining of micro holes less than 50 ${\mu}m$ in diameter, which it is not easy to apply other techniques to. For the machining of passivating metals such as stainless steel, machining conditions should be chosen carefully to prevent a passive layer. The machining conditions also affect the machining resolution, In this paper, machining characteristics of micro ECM were investigated according to machining conditions such as electrolyte concentration and pulse conditions. From the investigation, optimal machining conditions were suggested for micro ECM of stainless steel.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1998.10a
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• pp.170-175
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• 1998

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.12
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• pp.786-790
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• 2016

Hole explosion behaviors were observed during drilling fine holes with laser beam on the LTCC green bar of $320{\mu}m$ thick after lamination of green sheets prepared by tape casting of thick film process. The incidence of these hole explosions was inversely proportional to hole sizes. The incidence of hole explosion was 20 % number of hole with the size of $60{\mu}m$ exploded for the UV radiation, while the explosion did not appear for hole sizes over $100{\mu}m$. To prevent hole explosion behavior during laser-drilling of fine holes, carbon black powder was added as an additive in the LTCC composition, which has superior thermal durability. As a consequence, hole explosion rate was suppressed to 0.8 % for the hole size of $50{\mu}m$ green sheet with the carbon black amount of 10 weight % and the laser power of 3 watt. Added carbon is thought to reduce the heat-affected region during laser drilling.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.16 no.1
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• pp.36-41
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• 2017

In this paper, $Si_3N_4/hBN$ ceramics with various hexagonal boron nitride (hBN) contents (0, 10, 20, or 30 wt%) were fabricated via spark plasma sintering (SPS) at $1500^{\circ}C$, 50MPa, and 10m holding time. The material properties such as the relative density, hardness, and fracture toughness were systematically evaluated according to the hBN content in the $Si_3N_4/hBN$ ceramics. The results show that relative density, hardness, and fracture toughness continuously decreased as the hBN content increased. In addition, peak-step drilling (with tool diameter $500{\mu}m$) was performed to observe the effects of hBN content in micro-hole shape and cutting force. A machined hole diameter of $510{\mu}m$ (entrance) and stable cutting force were obtained at 30 wt% hBN content. Consequently, $Si_3N_4/30wt%$ hBN ceramic is a feasible material upon which to apply semi-conductor components, and this study is very meaningful for determining correlations between material properties and machining performance.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.10
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• pp.40-44
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• 2010

Laser drilling is an enabling technology for Through Silicon Via (TSV) interconnect applications. Recent advances in picoseconds laser drilling of blind, micron sized vias in silicon is presented here highlighting some of the attractive features of this approach such as excellent sidewall quality. In this study, we dealt with comparison of heat affection around drilled hole between a picosecond laser and a nanosecond laser process under the UV wavelength. Points which special attention should be paid are that picosecond laser process lowered experimentally recast layer, surface debris and micro-crack around hole in comparison with nanosecond laser process. These finding suggests that laser TSV process has possibility to drill under $10{\mu}m$ via. Finally, the laser drilling platform was constructed successfully.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.1
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• pp.62-67
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• 2012

Recently UV laser is widely used to process micro parts using various materials such as polymers, metals and ceramics because it has a very high intensity at the focused spot area. It is generally known that there are still some difficulties for alumina($Al_2O_3$) ceramics to directly make micro patterns like holes and lines on the surface of working material using 355nm UV laser because the alumina has a very low absorption coefficient at that wavelength. But nowadays new alumna with nano-porous holes is developed and applied to advanced micro functional parts of IT, BT and BT industries. In this paper, we are going to show the mechanism of photo-thermal ablation for nano-porous ceramics. Inside hole there is a lot of multiple reflections along the depth of hole. Experimentally we can find the micro hole drilling and micro grooving on the surface of nano-porous alumina.

• Journal of Korean Institute of Industrial Engineers
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• v.39 no.3
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• pp.149-155
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• 2013

Electric discharging machining (EDM) is commonly adopted to machine the precise and tiny part when it is difficult to meet the productivity and the tolerance by the conventional cutting method. The die-sinking EDM method works well to machine the micro-parts and the perpendicular wall of die and mould, whereas EDM drilling, called super drill, is excellent to machine the deep and narrow hole regardless the material hardness and the hole location. However, the electrode wear is rapid compared to the conventional cutting tool and makes it difficult to control the electrode feeding and to machine precisely. This paper presents an efficient method to estimate the electrode wear using hole pass-through experiment while the stochastic method is used to compensate for the estimation model. To validate the proposed method, the commercial EDM drill machine is used. The experiment result shows that the electrode wear amount can be predicted very precisely.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.7 no.3
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• pp.30-35
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• 2008

As demands for being economical, precise drilling process is on the increase. Therefore, the objective of this study is to develop a step cutter that can be controllable through micro dimension and can be changed from separate manufacturing processes of drilling and boring into an integrated one. In order to attain this object the step cutter is designed with a 3D geometric modeling and the design could be modified easily by using parametric modeling methodology. Also, collision is not occurred during manufacturing process because of cutting simulation. The step cutter is assembled by parts made up of 5-axis machining and sintering. Validation tests are accomplished. They show that developed cutter has characteristics such as reduction of machining time as well as the good surface roughness of the machined hole. Indeed, reliability could be obtained from a durability test.

• Journal of Sensor Science and Technology
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• v.13 no.1
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• pp.72-77
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• 2004

In this paper, we fabricated an apparatus of the electro-chemical discharge drilling for boring narrow through-hole into a glass. In the electrolyte, electro-chemical discharge creates high temperature condition by the electro-discharge energy. Therefore, glass are removed by the accelerated chemical reaction with glasses and chemicals in the high temperature condition. For optimization of the electro-chemical discharge drilling, the process condition was studied experimentally as a function of the electrolyte concentration, supply voltage and process time. The optimum condition was from DC25V to DC30V of applied voltage, 35 wt% NaOH solution.