• Laser Solutions
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• v.12 no.3
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• pp.1-6
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• 2009

This paper describes the method for the fabrication of micro dot array on a plastic mold steel using DPSS (diode pumped solid-states) UV laser and wet etching process. We suggest the process of the ablation of a photoresist (PR) coated on plastic mold steel and wet etching process using solutions of various concentrations of $FeCl_3$, $HNO_3$ in water as etchant. This method makes it possible to fabricate metallic roller mold because the microstructures are directly fabricated on the metal surface. In the range of operating conditions studied, $17\;{\mu}J$ laser pulse energy and 50 ms laser exposure time, an etchant containing 40wt% $FeCl_3$, 5wt% $HNO_3$ and etch time for 45 s gave the $10\;{\mu}m$ of micro dot pattern on plastic mold steel.

• Proceedings of the KIEE Conference
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• 1998.07g
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• pp.2515-2517
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• 1998

The micro fresnel lens(MFL) was modeled and fabricated on a XY-stage electrostatically driven by comb actuator. The modeled MFL was approximated as a step shape with 4-phase and 4-zone plate. The focal length and diameter of the MFL is 20mm and 912${\mu}m$, respectively. The XY-stage suspending the MFL is designed to generate a large static displacement up to about 20${\mu}m$. On SOI substrates, we first fabricated MFL using the RIE(reactive Ion etching) technology and then patterned and etched bulk silicon to make XY-stage. After the fabrication of all structures on top side of the SOI substrates. $Si_3N_4$ was deposited for passivation of all structures using PECVD(plasma enhanced chemical vapor deposition). All the MFL systems width comb drive actuator were released by KOH etching from the bottom side of the SOI wafer using double-sided alignment technique. In fabrication of MFL, a dry etching conditions is established in order to improve surface roughness and to control the etched depth.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.28 no.4
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• pp.449-455
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• 2004

The objective of this study is to obtain the correlation between the spray characteristics and the etching characteristics for the optimization of etching system in the micro fabrication industry. The etching characteristics such as etching rate were measured under different conditions. The single spray characteristics such as droplet size and velocity were measured by PDA system. These were compared to the etching characteristics. The twin spray characteristics in the overlap region were analyzed to predict the effect of them on the etching characteristics with the pitch and also were compared to the single spray. The etching rate was increased in case of high spray pressure and in the region of spray center. It was found that the etching characteristics could be correlated with the single spray characteristics and the twin spray characteristics were correlated with the etching characteristics.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.177-178
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• 2012

• 유체기계공업학회:학술대회논문집
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• 2001.11a
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• pp.381-386
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• 2001

This paper reports on the development of micro power system under way at Seoul National University. The interdisciplinary tin consists of members with various backgrounds of mechanics and materials. The need for micro power systems is explained, and a turbine under development is described. Design, and fabrication are introduced, and technical challenges in each phase are described. Furthermore, the interaction between the available fabrication methods and design is explained. Design involves use of commercially available codes to analyze flow fields, and fabrication takes advantage of the silicon wafer etching processes used to manufacture semiconductor devices.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.6
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• pp.172-178
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• 2004

Tungsten carbide microshaft can be used as various micro-tools for MEMS because it has high hardness and high rigidity. In this study, experiments are performed to produce tungsten carbide micro-shaft using electrochemical etching. H$_2$SO$_4$ solution is used as electrolyte because it can dissolve tungsten and cobalt simultaneously. Optimal electrolyte concentration and machining voltage satisfying uniform shape, good surface quality, and high MRR of workpiece are experimentally found. By controlling the various machining parameters, a straight micro-shaft with 5 ${\mu}{\textrm}{m}$ diameter, 3 mm length, and 0.2$^{\circ}$taper angle was obtained.

• Journal of the Semiconductor & Display Technology
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• v.19 no.2
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• pp.77-81
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• 2020

Silicon wafer etching in micro electro mechanical systems (MEMS) fabrication is challenging to form 3-D structures. Well known Si-wet etch of silicon employs potassium hydroxide (KOH), tetramethylammonium hydroxide (TMAH) and sodium hydroxide (NaOH). However, the existing silicon wet etching process has a fatal disadvantage that etching of the back side of the wafer is hard to avoid. In this study, a wet etching bath for 150 mm wafers was designed to prevent back-side etching of silicon wafer, and we demonstrated the optimized process recipe to have anisotropic wet etching of silicon wafer without any damage on the backside. We also presented the design of wet bath for 300 mm wafer processing as a promising process development.

• Clean Technology
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• v.9 no.3
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• pp.101-105
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• 2003

Plasma etching technology has been developed since it is recognized that silicon etching is very crucial in MEMS(Micro Electro Mechanical System) technology. In this study ICP(Inductive Coupled Plasma) technology was used as a new plasma etching to increase ion density without increasing ion energy, and to maintain the etching directions. This plasma etching can be used for many MEMS applications, but it has been used for PCR(Polymerase Chain Reaction) device fabrication. Platen power, Coil power and process pressure were parameters for observing the etching rate changes. Conclusively Platen power 12W, Coil power 500W, etchng/passivation cycle 6/7sec gives the etching rate of $1.2{\mu}m/min$ and sidewall profile of $90{\pm}0.7^{\circ}$, exclusively. It was concluded from this study that it was possible to minimize the environmental effect by optimizing the etching process using SF6 gas.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.49 no.6
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• pp.367-374
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• 2000

This paper presents a method to fabricate freestanding structures by (100) silicon anisotropic etching and nickel electroless plating. The electroless plating process is simpler than the electroplating, and provides good coating uniformity and improved mechanical properties. Furthermore, the (100) silicon anisotropic etching in KOH solution with being aligned to <100> direction provides vertical (100) sidewalls on etched (100) surface. In this paper, the effects of the nickel electroless plating condition on the properties of electroless plated metal structures are investigated to apply fabrication of micro structures and then various micro structures are fabricated by nickel electroless plating. And then, the structures are released by silicon anisotropic etching in KOH solution with a large gap between the structure and the substrate. The fabricated cantilever structures are $210\mum$. wide, $5\mum$. thick and $15\mum$. over the silicon substrate, and the comb structure has the comb electrodes which are $4\mum$. wide and $4.3\mum$. thick separated by$1\mum$. It is released by silicon anisotropic etching in KOH solution. The gap between the structure and the substrate is $2.5\mum$.

• Restorative Dentistry and Endodontics
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• v.29 no.4
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• pp.353-364
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• 2004

The purpose of this study was to compare and to evaluate the combination use of 5 kinds of dentin adhesive systems and 5 kinds of composite resins using micro-shear bond test. Five adhesive systems (Prime & Bond NT (PBN). Onecoat bond (OC), Excite (EX), Syntac (SY), Clearfil SE bond (CS)) and five composite resins (Spectrum (SP), Synergy Compact (SC), Tetric Ceram (TC), Clearfil AP-X (CA), Z100 (Z1)) were used for this study ($5{\;}{\times}{\;}5{\;}={\;}25group$, n =14/group). The slices of horizontally sectioned human tooth were bonded with each bonding system and each composite resin, and tested by a micro-shear bond strength test. These results were analyzed statistically. The mean micro-shear bond strength of dentin adhesive systems were in order of CS (22.642 MPa), SY (18.368 MPa), EX (14.599 MPa). OC (13.702 MPa). PBN (12.762 MPa). The mean bond strength of self-etching primer system group (CS, SY) in dentin was higher than that of self-priming adhesive system groups (PBN, EX, OC) significantly (P<0.05). The mean bond strength of composite resins was in order of SP (19.008 MPa), CA (17.532 MPa). SC (15.787 MPa), TC (15.068 MPa). Z1 (14.678 MPa). Micro-shear bond strength of SP was stronger than those of other composite resins significantly (P < 0.05). And those of TC and Z1 were weaker than other composite resins significantly (P < 0.05). No difference was found in micro-shear bond strength of composite resin in self-etching primer adhesive system groups (CS, SY) statistically. However, there was significant difference of micro-shear bond strength of composite resin groups in self-priming adhesive systems group (PBN, EX, OC). The combination of composite resin and dentin adhesive system recommended by manufacturer did not represent positive correlation. It didn't seem to be a significant factor.