• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.9
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• pp.1746-1752
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• 2002

Fatigue fracture in machine components is produced by surface micro-crack from stress concentration area such as notch and material defect. It is difficult to predict the remaining fatigue lift of mechanical components because the surface micro-crack on critical area initiates and grows with statistical distribution. Plane bending fatigue tests were carried out on the plain specimen of Al 2024-T3 and the initiation and growth behavior of surface micro cracks were observed. The statistical distribution of surface length of multiple micro cracks and their maximum length were investigated. The maximum surface crack length distributions were analyzed on the basis of the statistics of extremes in order to examine the prediction of remaining life.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.10 no.1
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• pp.1-7
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• 2011

Micromachining is gaining popularity due to recent advancements in MEMS(Micro Electro Mechanical Systems). Using conventional micromachining, it is relatively difficult to produce moving components in the order of microns. Photolithography for silicon material has high accuracy machining, but it has low aspect ratio. X-ray lithography has ultra high accuracy machining, but it has expensive cost. Micro-EDM(electro discharge machining) has been gaining popularity as a new alternative method to fabricate micro-structures. In this study, Micro-EDM machine is developed available for fabricate micro-structures and two processes such as side cut EDM and milling EDM is proposed. Several sets of experiment results have been performed to study the characteristics of the machining process.

• 한국가시화정보학회:학술대회논문집
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• 2007.11a
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• pp.109-113
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• 2007

Micro-PIV is a well-known method for measurement of two- dimensional, two-component velocity in the microfluidic devices. Lots of the micro fluidic devices generate three-dimensional flow and 3D measurement of velocity is helpful to understand the physics of micro flow phenomena. In this study, we developed new micro 3D measurement method by applying 2-frame PTV in stereoscopic micro system. In this study, we did the validation study of SMPTV by using the simulated flow model to verify the accuracy and the feasibility of measurement and compared with SMPIV method. The results showed that SMPTV provides better spatial resolution and measurement accuracy than SMPIV method.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.977-980
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• 1997

Ultraprecision machining process and MEMS technology have been taken more and more important position in machining of micro parts such as PDP and IT components, as the application field of micro parts increases. A micro machining center is very effective equipment for the fabrication of micro parts, because of its benefits such as lower power consumption, high precision and lower machining cost. Therefore, we study the possibility of application to the micro machining of barrier ribs used in PDP and also analyse the machining characteristics. The fabricated barrier rib has 30~$200\mu\textrm{m}$ pitch and was made by the flat endmill with the diameter of 0.2mm, 40, 000rpm condition.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1907-1910
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• 2003

Miniaturized machine tool can be used to produce 3D features based on CNC and PC-NC technology in the micro/meso scale. Wide applications of CNC technology are developed and there are lots of know-hows in the cutting process and their CNC application. It helps micro/meso scale structure to machine components, which can be used directly for practical applications. In the present research, as the machine tool is miniaturized, the manufacturing machine tools costs less when compared to the equipment used in other micromachining technologies. Moreover, with advancement of micro tool technology, the cutting process can be used to produce micro/meso scale parts. In conclusion, the proposed system can reduce the cost by utilizing the current machining technology, and as a result, complex micro/meso parts can be produced efficiently with high productivity.

• Journal of Korea Technology Innovation Society
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• v.6 no.4
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• pp.429-446
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• 2003

The status of microfactory or microfactory-related research in some advanced countries are investigated. Under the financial support of government, Japan has accomplished the Microfactory Project, the United States has pursued the Micro/Meso mMf project, and European countries have been studying micro assembly systems. In Korea, several universities and some large manufacturers have participated in the development of micro-components or micrcrdevices based on MEMS technology since the late 1990's. Microfactory is a process which achieves an integrated micro-manufacturing system in a production system, which is followed by the steps of micro-technology of machine parts based on micro-system technology. In addition, this process is a new concept of manufacturing system that renovates the existing manufacturing system It is sure that the research of micro- manufacturing technology must lead to nano-technology in the near future, with intensive financial supports of government for this technology.

• Journal of the Semiconductor & Display Technology
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• v.10 no.2
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• pp.7-12
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• 2011

In this paper, a laser scattering mechanism are designed to detect micro defects such as dent, scratch, pinhole, etc. Its influential parameters are experimentally selected and scattering patterns of micro defects have been analyzed for silicon wafer in solar cell. As a result of experiments, scattered lights are rather increased in wafer surface with micro defects, in comparison to no micro ones. Scattering parameters are optimally selected for obtaining robust and high quality laser scattering images of micro defects. It is shown that scattered light components are linearly increased according to the increase of micro defect sizes, and the depth of micro-defects give a large influence on optical deflection.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.2
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• pp.138-144
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• 2004

The initiation and the propagation of solder joint crack depend on its environmental conditions, such as high temperature creep and thermal fatigue. Creep is known to be the most important factor for the mechanical failure of solder joints in micro-electronic components and micro-systems. This is mainly caused by the different thermal expansion coefficients of the materials used in the micro-electronic packages. To determine the reliability of solder joints and consequently the electronic components, the characterization of the creep behavior of this group of materials is crucial. This paper is to apply the theory of creep into solder joints and to provide related technical information needed for evaluation of reliability of solder joint to failure. 63Sn-37Pb solder was used in this study. This paper experimentally shows a way to enhance the reliability of solder joints.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.19 no.5
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• pp.710-715
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• 2010

This study developed an automatic tool change system of the SMA-based tool clamping device for applications of micro-machine tools. This paper first describes clamping and unclamping procedures of the automatic tool change system and its basic configuration. Second, it presents fabrication techniques of components, such as a heating/cooling system and a tool loader. Finally, it describes automatic tool change test conducted with a prototype in which the fabrication techniques of components were employed. As the results of the test, times needed for clamping and unclamping operations were estimated to 18(s) and 8(s) respectively. The experimental results confirm that the proposed automatic tool change system can be sucessfully applied to micro-machine tools.

• Proceedings of the KSME Conference
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• 2000.11a
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• pp.754-758
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• 2000

Milli-structure components are classified as component group whose size is between macro and micro scale. that is, about less than 20mm and larger than 1mm. The forming of these components has a typical phenomenon of bulk deformation with thin sheets because of the forming size. In order to conventional metal forming, where numerical process simulation is already fully applied, the micro-forming process is characterized by some scale effects which have to be considered in an advanced process simulation. milli-structure rectangular cup drawing is analyzed and designed using the finite element method and experiment. The result of the finite element analysis is confirmed by a series of experiments.