• 한국산학기술학회논문지
• /
• 제11권2호
• /
• pp.772-779
• /
• 2010

이 연구는 심미성과 내구성을 살릴 수 있는 보철 재료들을 선택하기 위해 각종 도재 보철 재료들의 열 순환 전후 결합 강도를 측정하였다. 결합 강도 측정을 위해 시중에 시판되고 있는 base-alloy중에서 with Beryllium 금속과 non-Beryllium 금속 8종과 Zirconia 1종위에 각종 도재 제품들을 소성하여 열 순환 전 후 결합 강도 측정 다음과 같은 결과를 얻었다. 1) PTM(press-to-metal) 도재가 열 순환 시행 전후의 각각 73.2MPa, 59.2MPa로 높은 결합 강도를 보였다. 2) non-Beryllium 금속 위에 소성한 도재가 with-Beryllium 금속 위에 소성한 도재보다 결합 강도가 우수했다. 3) Zirconia 도재는 38.7MPa의 가장 낮은 결합 강도를 보였다.

• 대한금속재료학회지
• /
• 제47권8호
• /
• pp.500-507
• /
• 2009

Pb-free solder has recently been used in electronics in efforts to meet environmental regulations, and a number of Pb-free solder alloy choices beyond the near-eutectic SnAgCu solder are now available. With increased demand for thin and portable electronics, the high cost of alloys containing significant amounts of silver and their poor mechanical shock performance have spurred the development of low Ag SnAgCu solder, which provides improved mechanical performance at a reasonable cost. Although low Ag SnAgCu solder exhibits significantly higher fracture resistance under high-strain rates, little thermal fatigue data exist for this solder. Therefore, it is necessary to investigate thermal fatigue reliability of low Ag SnAgCu solder under variation of thermal stress in order to allow its implementation in electronic products with high reliability requirements. In this study, the reliability of Sn0.3Ag0.7Cu(SAC0307), a low Ag solder alloy, is discussed and compared with that of Sn3Ag0.5Cu(SAC305). Three sample types and six samples size are evaluated. Mechanical properties and microstructure of the solder joint are investigated under thermal shock cycles. It was observed that the mechanical strength of SAC0307 dropped slightly with thermal cycling relative to that of SAC305. This reveals that the failure mode of SAC0307 is different from that SAC305 under this critical condition.

• 대한금속재료학회지
• /
• 제49권12호
• /
• pp.983-988
• /
• 2011

Failure analyses of the screws in spinal fixation devices were carried out. The fractured screws were retrieved from a patient who had spinal surgery in the thoracic vertebrae from number 10 to 15. The failure occurred one month after the removal of the braces. Microstructures and fracture surfaces were examined by optical and scanning electron microscopy. The microstructures of the screws corresponded to annealed Ti-6Al-4V bar. However, in the vicinity of the screw surface, there was an insufficient number of fine precipitates. Fracture surfaces showed typical fatigue failure modes. Regarding the fact that no machining defects were detected, fatigue crack initiation might have been caused by the lack of precipitates near the screw surfaces. Only the fourth of five fixed screws was severely stress-concentrated by the action of the spinal bones, while the stress of the 4th screw was decreased to half of its acceptable level when the screw was supplemented by one more, which might have been fixed in the 6th vertebra under the 5th position by the switching of its position. The stress simulation was conducted by ANSYS with 3D CAD of PRO/E in order to understand the stress concentration behavior and to provide an effective spinal surgery guide.

• 대한금속재료학회지
• /
• 제46권9호
• /
• pp.577-584
• /
• 2008

The electrolytic reduction of spent oxide fuel involves the liberation of oxygen in a molten LiCl electrolyte, which results in a chemically aggressive environment that is too corrosive for typical structural materials. So, it is essential to choose the optimum material for the process equipment handling molten salt. In this study, corrosion behavior of Inconel 713LC, Inconel MA 754, Nimonic 80A and Nimonic 90 in the molten salt $LiCl-Li_2O$ under an oxidizing atmosphere was investigated at $650^{\circ}C$ for 72~216 hrs. Inconel 713LC alloy showed the highest corrosion resistance among the examined alloys. Corrosion products of Inconel 713LC were $Cr_2O_3$, $NiCr_2O_4$ and NiO, and those of Inconel MA 754 were $Cr_2O_3$ and $Li_2Ni_8O_{10}$ while $Cr_2O_3$, $LiFeO_2$, $(Cr,Ti)_2O_3$ and $Li_2Ni_8O_{10}$ were produced from Nimonic 80A. Also, corrosion products of Nimonic 90 were found to be $Cr_2O_3$, $(Cr,Ti)_2O_3$, $LiAlO_2$ and $CoCr_2O_4$. Inconel 713LC showed local corrosion behavior and Inconel MA 754, Nimonic 80A, Nimonic 90 showed uniform corrosion behavior.

• 대한금속재료학회지
• /
• 제49권12호
• /
• pp.924-929
• /
• 2011

It is well known that grain boundary cavitation is the main failure mechanism in austenitic stainless steel under tensile hold creep-fatigue interaction conditions. The cavities are nucleated at the grain boundary during cyclic loading and grow to become grain boundary cracks. The attenuation of ultrasound depends on scattering and absorption in polycrystalline materials. Scattering occurs when a propagation wave encounters microstructural discontinuities, such as internal voids or cavities. Since the density of the creep-fatigue cavities increases with the fatigue cycles, the attenuation of ultrasound will also be increased with the fatigue cycles and this attenuation can be detected nondestructively. In this study, it is found that individual grain boundary cavities are formed and grow up to about 100 cycles and then, these cavities coalesce to become cracks. The measured ultrasonic attenuation increased with the cycles up to cycle 100, where it reached a maximum value and then decreased with further cycles. These experimental measurements strongly indicate that the open pores of cavities contribute to the attenuation of ultrasonic waves. However, when the cavities develop, at the grain boundary cracks whose crack surfaces are in contact with each other, there is no longer any open space and the ultrasonic wave may propagate across the cracks. Therefore, the attenuation of ultrasonic waves will be decreased. This phenomenon of maximum attenuation is very important to judge the stage of grain boundary crack development, which is the indication of the dangerous stage of the structures.

• 열처리공학회지
• /
• 제9권1호
• /
• pp.1-11
• /
• 1996

Mechanical alloying is an effective process to finely distribute inert dispersoids in an Al-TM(TM is a transition metal) system. It has been considered that high melting point aluminides are formed by precipitation from supersaturated Al(Ti) powder. This analysis is based on the fact that much higher content of TM than the solubioity can be dissolved in alpha aluminum during the high energy ball milling. Thus, decomposition behavior of Ti in the Al(Ti) was considered very important. But it is confirmed that the higher portion of Ti than Al(Ti) solid solution is existed as nano-sized Ti particles in the MA powders by high energy ball nilling from the XRD spectrum and TEM analysis in this study. Therefore, the role of undissolved TM particles affect the formation of aluminides should be suitably considered. In this study, we present experimental observation on the formation of $Al_3Ti$ fron mechanical alloyed Al-Ti alloys in the hyperperitectic region. This study showed that, in the mechanically alloyed Al-20wt%Ti specimen, intermediate phase of cubic $Al_3Ti$ and tetragonal $Al_{24}Ti_8$ formed at $300{\sim}400^{\circ}C$ and $400{\sim}500^{\circ}C$, respectively, before the MA state reaches to equilibrium at higher temperatures. The formation behavior of $Ll_2-Al_3Ti$ is interpreted by interdiffusion of Al and Ti in solid state based on the fact that large amount of nano-sized Ti particles exist in the milled powder. Present analysis indicated undissolved Ti particles of nanosize should have played an important role initiation the formation of $Al_3Ti$ phase during annealing.

• 대한금속재료학회지
• /
• 제50권5호
• /
• pp.401-406
• /
• 2012

When viewed using a magnetic resonance imaging (MRI) system, invasive materials inside the human body, in many cases, severely distort the MR image of human tissues. The degree of the MR image distortion increases in proportion not only to the difference in the susceptibility between the invasive material and the human tissue, but also to the intensity of the magnetic field induced by the MRI system. In this study, by blending paramagnetic Ti particles with diamagnetic graphite, we synthesized $Ti_{100-x}C_x$ composites that can reduce the artifact in the MR image under the high-strength magnetic field. Of the developed composites, $Ti_{70}C_{30}$ showed the magnetic susceptibility of ${\chi}=67.6{\times}10^{-6}$, which corresponds to 30% of those of commercially available Ti alloys, the lowest reported in the literature. The level of the MR image distortion in the vicinity of the $Ti_{70}C_{30}$ composite insert was nearly negligible even under the high magnetic field of 4.7 T. In this paper, we reported on a methodology of designing new structural materials for bio-applications, their synthesis, experimental confirmation and measurement of MR images.

• 대한금속재료학회지
• /
• 제56권11호
• /
• pp.779-786
• /
• 2018

There have been previous attempts to observe the occurrence of dynamic ferritic transformation at temperatures even above $Ae_3$ in a low-carbon steel, and not only in steels, but recently also in titanium alloys. In this study, a new approach is proposed that involves treating true stress-true strain curves in uniaxial compression tests at various temperatures, and different strain rates in 0.1C-6Ni steel, which is a model alloy used to decelerate the kinetics of ferrite transformation from austenite. The initial flow stress up to peak stress was used to analyze the change in dynamic softening phenomena, such as dynamic recovery, dynamic recrystallization, and dynamic transformation. It is worth mentioning that for predicting the occurrence of dynamic transformation, flow stress before reaching peak stress is much more sensitive to the change in the dynamic softening rate due to dynamic transformation, compared to peak stress. It was found that the occurrence of dynamic ferritic transformation could be successfully obtained even at temperatures above $Ae_3$ once the deformation condition was satisfied. This deformation condition is a function of both the strain rate and the deformation temperature, which can be described as the Zener - Hollomon parameter. In addition, the driving force of dynamic ferritic transformation might be much less than that of the dynamic recrystallization of austenite at a given deformation condition. By applying this technique, it is possible to predict the occurrence of dynamic transformation more sensitively compared with the previous analysis method using peak stress during deformation.

• 대한금속재료학회지
• /
• 제49권2호
• /
• pp.93-103
• /
• 2011

Precipitation behavior of high-nitrogen duplex Fe-24Cr-7Mn-4Ni-4Mo-0.43N stainless steel aged at $850^{\circ}C$ was investigated using scanning transmission electron microscopy. Based on the analyses of selected area diffraction patterns, four kinds of precipitates (intermetallic sigma (${\sigma}$) and chi (${\chi}$), $Cr_2N$ and secondary austenite) were identified. At the ferrite/austenite phase boundary, the ${\sigma}$ phase and secondary austenite were formed via ${\alpha}{\rightarrow}{\gamma}+{\sigma}$ eutectoid reaction. The precipitation of $Cr_2N$ occurred at the austenite grain boundary as well as the interior of the ferrite. The intermetallic ${\chi}$ phase also formed within the ferrite and showed a cube-cube orientation relationship with the ferrite. Further aging produced a lamellar structure composed of $Cr_2N$ and austenite along the ferrite/austenite boundary and enhanced the precipitation of the ${\chi}$ phase. The crystallographic features of the precipitates were also examined in terms of the orientation relationship with the austenite or ferrite matrix.

• 대한금속재료학회지
• /
• 제47권12호
• /
• pp.842-851
• /
• 2009

The long-term reliability of Sn-0.3wt%Ag-0.7wt%Cu solder joints was evaluated and compared with Sn-3.0wt%Ag-0.5wt%Cu under thermal shock conditions. Test vehicles were prepared to use Sn-0.3Ag-0.7Cu and Sn-3.0Ag-0.5Cu solder alloys. To compare the shear strength of the solder joints, 0603, 1005, 1608, 2012, 3216 and 4232 multi-layer ceramic chip capacitors were used. A reflow soldering process was utilized in the preparation of the test vehicles involving a FR-4 material-based printed circuit board (PCB). To compare the shear strength degradation following the thermal shock cycles, a thermal shock test was conducted up to 2,000 cycles at temperatures ranging from $-40^{\circ}C$ to $85^{\circ}C$, with a dwell time of 30 min at each temperature. The shear strength of the solder joints of the chip capacitors was measured at every 500 cycles in each case. The intermetallic compounds (IMCs) of the solder joint interfaces werealso analyzed by scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDS). The results showed that the reliability of Sn-0.3Ag-0.7Cu solder joints was very close to that of Sn-3.0Ag-0.5Cu. Consequently, it was confirmed that Sn-0.3Ag-0.7Cu solder alloy with a low silver content can be replaced with Sn-3.0Ag-0.5Cu.