• Corrosion Science and Technology
• /
• 제4권1호
• /
• pp.23-28
• /
• 2005

Several plasma-sprayed ceramic coatings with two- and three-layers were characterized and tested for the application of cooling tube coatings of oxygen convert gas recovery system (OG cooling system) in the steel making plant. Thermal cycling tests using a torch heating with compressed air cooling were carried out and characterized before and after the tests. The effects of metallic bond coat as well as ceramic top coat were also studied. Possible failure mechanisms with low carbon steel substrate were assessed in term of microstructure, porosity, bond strength, thermal expansion coefficient, and the phase transformation. Finally, the results of field tests at the OG cooling system are presented and discussed their microstructural degradation. Test results have shown that three-layered coatings perform better than two-layered coatings.

• 한국표면공학회지
• /
• 제37권3호
• /
• pp.169-174
• /
• 2004

MgO thin films were reactively deposited using an internal inductively coupled plasma assisted sputtering method varying reactive gas ratio to get stoichiometric film composition, and bipolar dc substrate bias to suppress micro arcs. The minimum frequency required for arc suppression was about 10KHz depending on ICP power. Their crystallinity was analyzed using X-ray diffraction and surface morphology using AFM. The surface was very smooth with rms roughness less than 0.42nm. The preferred orientation of the films were changing from (200) to bulk-like characteristics as Ar: $O_2$ratio was controlled to 10 : 2. Optical emission spectroscopy revealed that there were two distinct discharge modes: a blue one and a green one, where enhanced emission from Ar and Mg were observed. This cannot simply be understood by metallic or oxide mode of reactive sputtering due to ICP coupled to magnetron discharge.

• Elastomers and Composites
• /
• 제34권4호
• /
• pp.299-314
• /
• 1999

Bonding metal and textile components to rubber has always posed a problem. In this paper, an attempt had been made to modify textile and metal surfaces for bonding with rubber. The metal surfaces were modified using silane coupling agents and textile fibers were modified using plasma polymerization techniques. Some results on adhesion of metals to a range of sulfur-cured rubber compounds using a combination of organofunctional silanes are given here. The treatment was not only effective for high-sulfur compounds but also for low-sulfur com pounds as used in engine mounts and even for some semi-EV compounds. Coatings of plasmapolymerized pyrrole or acetylene were deposited on aramid and polyester tire cords. Standard pull-out force adhesion measurements were used to determine adhesion of tire cords to rubber compounds. The plasma coatings were characterized by various techniques and the performance results are explained in an interpenetrating network model.

• 한국분말야금학회:학술대회논문집
• /
• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part 1
• /
• pp.284-285
• /
• 2006

The nano-sized Fe powders were prepared by plasma arc discharge process using pure Fe rod. The microstructure and the sintering behavior of the prepared nanopowders were evaluated. The prepared Fe nanopowders had nearly spherical shapes and consisted of metallic core and oxide shell structures. The higher volume shrinkage at low sintering temperature was observed due to the reduction of surface oxide. The nanopowders showed 6 times higher densification rate and more significant isotropic shrinkage behavior than those of micron sized Fe powders.

• 한국표면공학회:학술대회논문집
• /
• 한국표면공학회 2012년도 춘계학술발표회 논문집
• /
• pp.179-180
• /
• 2012

Back ferrule is a circular ring shaped metallic object which is used for fastening, joining or reinforcement during the tube fitting as well as to prevent leakage. Therefore, during tube fitting the leading edge of the back ferrule should be sufficiently hard enough to prevent leakage. In our research, we concentrated the improvement of two major factors. Firstly, to improve the surface hardness of the back ferrule made by AISI 316 Stainless Steel. Secondly, the enhancement of corrosion resistance of back ferrule after plasma treatment. Initially, the corrosion resistance and hardness of the back ferrule (both commercial and without treated) was not good enough for tube fitting but after applying plasma treatment with suitable conditions on ferrule, we improved the corrosion resistance and hardness of the back ferrule dramatically.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
• /
• pp.259-259
• /
• 2008

The LTCC (Low Temperature Co-fired Ceramic) technology meets the requirements for high quality microelectronic devices and microsystems application due to a very good electrical and mechanical properties, high reliability and stability as well as possibility of making integrated three dimensional microstructures. The wet process, which has been applied to the etching of the metallic thin film on the ceramic substrate, has multi process steps such as lithography and development and uses very toxic chemicals arising the environmental problems. The other side, Plasma technology like ion beam sputtering is clean process including surface cleaning and treatment, sputtering and etching of semiconductor devices, and environmental cleanup. In this study, metallic multilayer pattern was fabricated by the ion beam etching of Ti/Pd/Cu without the lithography. In the experiment, Alumina and LTCC were used as the substrate and Ti/Pd/Cu metallic multilayer was deposited by the DC-magnetron sputtering system. After the formation of Cu/Ni/Au multilayer pattern made by the photolithography and electroplating process, the Ti/Pd/Cu multilayer was dry-etched by using the low energy-high current ion-beam etching process. Because the electroplated Au layer was the masking barrier of the etching of Ti/Pd/Cu multilayer, the additional lithography was not necessary for the etching process. Xenon ion beam which having the high sputtering yield was irradiated and was used with various ion energy and current. The metallic pattern after the etching was optically examined and analyzed. The rate and phenomenon of the etching on each metallic layer were investigated with the diverse process condition such as ion-beam acceleration energy, current density, and etching time.

• 한국세라믹학회지
• /
• 제47권6호
• /
• pp.618-622
• /
• 2010

Cost-effective purification methods of silicon were carried out in order to replace the conventional Siemens method for solar grade silicon. Firstly, acid leaching which is a hydrometallurgical process was preceded with grinded silicon powders of metallurgical grade (~99% purity) to remove metallic impurities. Then, plasma treatments were performed with the leached silicon powders of 99.94% purity by argon plasma at 30 kW power under atmospheric pressure. Plasma treatment was specifically efficient for removing Zr, Y, and P but not for Al and B. Another purification step by EB treatment was also studied for the 99.92% silicon lump which resulted in the fast removal of boron and aluminum. That means the two methods are effective alternative tools for removing the doping elements like boron and phosphor.

• 한국표면공학회지
• /
• 제41권1호
• /
• pp.33-37
• /
• 2008

Polycarbonate has a high transmittance to light, low specific gravity, flexibility and cost-effectiveness that extends the application field of the polymer to bio-engineering, optics, electronic parts, etc. Moreover, electro plating of metallic film on PC could endow the parts the electromagnetic interference shielding capability. However, poor adhesion of copper on PC limited the wide usage in the industry. In this work, a composite(PC/ABS) and MmSH(Momentary mold Surface Heating) injection process were used to improve the plating characteristics; plating thickness, gloss and adhesion. Also plasma treatment and chemical treatment were employed for improving adhesion. Plating characteristics on PC/ABS were better than those on PC due to the anchoring effect of butadiene. MmSH injection process could ameliorate the gloss and coating adhesion. Also plating thickness and adhesion of PC and PC/ABS were increased by plasma treatment.

• Journal of Welding and Joining
• /
• 제25권4호
• /
• pp.42-48
• /
• 2007

An inert gas atomized NiTiZrSiSn bulk metallic glass feedstock was sprayed onto the copper plate using vacuum plasma spraying process. In order to change the in-flight particle energy, that is, thermal energy, the hydrogen gas flow rate in plasma gas mixture was increased at the constant flow rate of argon gas. Coating and single pass spraying bead were produced with the least feeding rate. Regardless of the plasma gas composition, fully melted through unmelted particle could be observed on the overlay coating. However, the frequency of the unmelted particle number density was increased with the decrease of the hydrogen gas flow rate. The amorphous phase fraction within coating was also affected by the number density of the unmelted particle.

• 한국재료학회지
• /
• 제14권3호
• /
• pp.218-223
• /
• 2004

P-type $\beta$-FeSi$_2$ with a nominal composition of $Fe_{0.92}Mn_{0.08}Si_2$ powders has been produced by mechanical alloying process. As-milled powders were spray dried and consolidated by atmospheric plasma thermal spraying as a rapid sintering process. As-milled powders were of metastable state and fully transformed to $\beta$-$FeSi_2$ phase by subsequent isothermal annealing. However, as-thermal sprayed $Fe_{0.92}Mn_{0.08}Si_2$ consisted of untransformed mixture of $\alpha$-$Fe_2Si_{5}$ and $\varepsilon$-FeSi phases. Isothermal annealing has been carried out to induce transformation to the thermoelectric semiconducting $\beta$-$FeSi_2$ phase. Isothermal annealing at $845^{\circ}C$ in vacuum gradually led to the thermoelectric semiconducting $\beta$-$FeSi_2$ phase transformation, but some residual metallic $\alpha$ and $\varepsilon$ phases were unavoidable even after prolonged annealing. Thermoelectric properties of $\beta$-$FeSi_2$ materials before and after isothermal annealing were evaluated. Seebeck coefficient increased and electric conductivity decreased with increasing annealing time due to the phase transition from metallic phases to semiconducting phases. Thermoelectric properties showed gradual increment, but overall properties appeared to be inferior to those of vacuum hot pressed specimens.