• Title/Summary/Keyword: Metallic Interfaces

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Improvement of the mechanical properties of titanium carbonitride-metal composites by modification of interfaces (계면 개선을 통한 타이타늄 탄/질화물 금속 복합재료의 기계적 물성 향상)

  • Kwon, Hanjung
    • Ceramist
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    • v.23 no.2
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    • pp.114-131
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    • 2020
  • Fracture in the titanium carbonitride-metal composites occurs by crack propagation through the carbonitride grains or in the interfaces. Thus, intrinsic properties of the carbonitride need to be enhanced and the interfaces should be also modified to coherent structure to strengthen the composites. Especially, interfacial structure can be the main factor to determine the mechanical properties of titanium carbonitride-metal composites because the interfaces between carbonitride grains and metallic phase are weak parts due to heterogeneous nature of carbonitride and metallic phase. In this paper, methodologies for improving the interfacial structure of titanium carbonitride-metal composites are suggested. Total area of the interfaces can be reduced using solid solution type carbonitrides as raw materials instead of a mixture of various carbonitrides in the composites. Also, synthesis of titanium carbonitride-metal composite powders and the low-temperature sintering of the composite powders for short time can be the way for formation of coherent interfaces. The sintering of the composite powders for short time at low temperature can reduce the potential of formation of interfaces by dissolution and precipitation of carbonitride in the liquid metal. As a result of formation of coherent boundaries due to low-temperature and short-time sintering, interfaces between titanium carbonitride grains and metallic phase have the favorable structure for the enhanced fracture toughness. It is believed that the low-temperature sintering of solid solution type composite powders for short time can be the way to improve the low toughness of the titanium carbonitride-metal composites.

A Study on Large Area Roll Projection Welding for Metallic Sandwich Plate : Part 2 - Numerical Analysis (금속 샌드위치 판재 대면적 롤 프로젝션 용접에 관한 연구 : Part 2 - 수치 해석)

  • Kim, Jong-Hwa;Ahn, Jun-Su;Na, Suck-Joo
    • Journal of Welding and Joining
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    • v.27 no.3
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    • pp.92-96
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    • 2009
  • Metallic sandwich plate has many good properties such as high specific stiffness, high specific strength, good impact absorptivity, effective thermal insulation and soundproofing. In our study, a new bonding method, 3-layer roll projection welding, is introduced to fabricate the metallic sandwich plate. The new method uses a pair of roll electrodes like the seam welding, and projection welding is made at two internal interfaces of the 3-layer weldment consisting of a structured inner sheet and a pair of skin sheets. During the welding process, skin sheet temperature are measured to produce metallic sandwich plate with uniform and good quality. But it is difficult to observe or measure the temperature at the welding points during welding process because the welding points exist at the internal interfaces. Therefore FEM numerical analysis using ABAQUS is conducted to estimate the generated heat at the welding points with different welding conditions.

Microscopic analysis of metal matrix composites containing carbon Nanomaterials

  • Daeyoung Kim;Hye Jung Chang;Hyunjoo Choi
    • Applied Microscopy
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    • v.50
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    • pp.4.1-4.10
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    • 2020
  • Metallic matrix composites reinforced with carbon nanomaterials continue to attract interest because of their excellent mechanical, thermal, and electrical properties. However, two critical issues have limited their commercialization. Uniform distribution of carbon nanomaterials in metallic matrices is difficult, and the interfaces between the nanomaterials and matrices are weak. Microscope-based analysis was recently used to quantitatively examine these microstructural features and investigate their contributions to the composites' mechanical, thermal, and electrical properties. The impacts of the microstructure on these properties are discussed in the first section of this review. In the second section, the various microscopic techniques used to study the distribution of carbon nanomaterials in metallic matrices and their interfaces are described.

METALLIC INTERFACES IN HARSH CHEMO-MECHANICAL ENVIRONMENTS

  • Yildiz, Bilge;Nikiforova, Anna;Yip, Sidney
    • Nuclear Engineering and Technology
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    • v.41 no.1
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    • pp.21-38
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    • 2009
  • The use of multi scale modeling concepts and simulation techniques to study the destabilization of an ultrathin layer of oxide interface between a metal substrate and the surrounding environment is considered. Of particular interest are chemo-mechanical behavior of this interface in the context of a molecular-level description of stress corrosion cracking. Motivated by our previous molecular dynamics simulations of unit processes in materials strength and toughness, we examine the challenges of dealing with chemical reactivity on an equal footing with mechanical deformation, (a) understanding electron transfer processes using first-principles methods, (b) modeling cation transport and associated charged defect migration kinetics, and (c) simulation of pit nucleation and intergranular deformation to initiate the breakdown of the oxide interlayer. These problems illustrate a level of multi-scale complexity that would be practically impossible to attack by other means; they also point to a perspective framework that could guide future research in the broad computational science community.

XPS Study of MoO3 Interlayer Between Aluminum Electrode and Inkjet-Printed Zinc Tin Oxide for Thin-Film Transistor

  • Choi, Woon-Seop
    • Transactions on Electrical and Electronic Materials
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    • v.12 no.6
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    • pp.267-270
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    • 2011
  • In the process of inkjet-printed zinc tin oxide thin-film transistor, the effect of metallic interlayer underneath of source and drain electrode was investigated. The reason for the improved electrical properties with thin molybdenum oxide ($MoO_3$) layer was due to the chemically intermixed state of metallic interlayer, aluminum source and drain, and oxide semiconductor together. The atomic configuration of three Mo $3d_3$ and $3d_5$ doublets, three different Al 2p core levels, two Sn $3d_5$, and four different types of oxygen O 1s in the interfaces among those layers was confirmed by X-ray photospectroscopy.

Theoretical Investigation of the Metallic Spacer-Layer Formation of Fe/Si Multilayered Films

  • Rhee, J.Y.;Kudryavtsev, Y.V.;Kim, K.W.;Lee, Y.P.
    • Journal of Korean Vacuum Science & Technology
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    • v.6 no.2
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    • pp.76-78
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    • 2002
  • We have carried out the first-principle electronic structure calculations to investigate the spacer layer formation of Fe/Si multilayered films (MLF) and compared with the results obtained by optical spectroscopy. The computer-simulated spectra based on various structural models of MLF showed that neither FeSi$_2$ nor B2O-phase FeSi, which are semiconducting, could be considered as the spacer layers in the Fe/Si MLF for the strong antiferromagnetic coupling. The optical properties of the spacer extracted from the effective optical response of the MLF strongly support its metallic nature. The optical conductivity spectra of various phases of Fe-Si compounds were calculated and compared with the extracted optical properties of the spacer. From the above theoretical investigations it is concluded that a E2-phase metallic FeSi compound is spontaneously formed at the interfaces during deposition.

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Charge Transport at the Interfaces between Carbon Nanotube and Wetting Metal Leads Mediated via Topological Defects

  • Ko, Kwan Ho;Kim, Han Seul;Kim, Hu Sung;Kim, Yong-Hoon
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.179.2-179.2
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    • 2014
  • Carbon nanotubes (CNT)-metal contacts play an important role in nanoelectronics applications such as field-effect transistor (FET) devices. Using Al and (10,0) CNT, we have recently showed that the CNT-metal contacts mediated via topological defects within CNT exhibits intrinsically low contact resistance, thanks to the preservation of the sp2 bonding network at the metal-CNT contacts.[1] It is well-established that metals with good wetting property such as Pd consistently yield good contacts to both metallic and semiconducting CNTs. In this work, the electronic and charge transport properties of the interfaces between capped CNT and Pd will be investigated based on first-principles computations and compared with previous results obtained for the Al electrodes.

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Interfacial Microstructures between Ag Wiring Layers and Various Substrates (Ag 인쇄배선과 이종재료기판과의 접합계면)

  • Kim, Keun-Soo;Suganuma, Katsuaki;Huh, Seok-Hwan
    • Journal of Welding and Joining
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    • v.29 no.5
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    • pp.90-94
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    • 2011
  • Ag metallic particles from nano-scale to submicron-scale are combined with organic solvent to provide fine circuits and interconnection. Ink-jet printing with Ag nano particle inks demonstrated the potentials of the new printed electronics technology. The bonding at the interface between the Ag wiring layer and the various substrates is very important. In this study, the details of interfaces in Ag wiring are investigated primarily by microstructure observation. By adjusting the materials and sintering conditions, nicely formed interfaces between Ag wiring and Cu, Au or organic substrates are achieved. In contrast, transmission electron microscope (TEM) image clearly shows interface debonding between Ag wiring and Sn substrate. Sn oxides are formed on the surface of the Sn plating. The formation of these is a root cause of the interface debonding.

A study on the Fracture Mechanical Strength Evaluation in Joint Interface of Ceramics and Metal (세라믹스/금속 접합계면에서의 파괴력학적 강도평가에 관한 연구)

  • 최병기
    • Journal of the Korean Society of Safety
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    • v.11 no.3
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    • pp.20-24
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    • 1996
  • Indentation fracture method and 4-point bending test are carried out to measure the residual stresses and the bending strength, and to investigate the mechanism of fracture mechanics in the bonded interface of ceramic and metal. The results obtained are as follows ; 1) The fracture patterns of bonded materials shows that the delamlnatlon fracture of Interfaces is stablely developed from the interfaces of ceramic/active metallic bonded materials at the specimen center, and the fracture is unstablely generated through a refraction on the middle ceramic. 2) Distribution of residual stresses is quantitatively investigated on the ceramic side of bonded materials. 3) It Is found that the residual stresses of interface vertical direction are concentrated on the bonded interface at the ceramic side.

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The Mechanical Properties and Biocompatibility of Functionally Graded Coatings(FGC) of Hydroxyapatite(HA) and Metallic Powders - Functionally Gradient Coatings of Thermal Spray in Air- (Hydroxyapatite (HA)와 금속 분말 경사 코팅의 기계적 특성 및 생체 적합성 - 대기 열용사 경사코팅 -)

  • Kim, Eun-Hye;Kim, Yu-Chan;Han, Seung-hee;Yang, Seok-Jo;Park, Jin-Woo;Seok, Hyun-Kwang
    • Korean Journal of Metals and Materials
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    • v.47 no.1
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    • pp.13-20
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    • 2009
  • This work presents functionally graded coatings (FGC) of hydroxyapatite (HA) and metallic powders on Ti-6Al-4V implants using plasma spray coating method. HA has been the most frequently used coating material due to its excellent compatibility with human bones. However, because of the abrupt changes in thermomechanical properties between HA and the metallic implant across an interface, and residual stress induced on cooling from coating temperture to room temperature, debonding at the interface occurs in use sometimes. In this work, FGC of HA and Ti or Ti-alloy powders is made to mitigate the abrupt property changes at the interface and the effect of FGC on residual stress release is investigated by evaluating the mechanical bond strength between the implant and the HA coating layers. Thermal annealing is done after coating in order to crystallize the HA coating layer which tends to have amorphous structure during thermal spray coating. The effects of types and compositional ratio of metallic powders in FGC and annealing conditions on the bond strength are also evaluated by strength tests and the microstructure analysis of coating layers and interfaces. Finally, biocompatibility of the coating layers are tested under ISO 10993-5.