• 한국세라믹학회지
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• 제37권3호
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• pp.201-204
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• 2000

Thermal shock resistance of 80Al2O3-20Al composite and monolithic alumina ceramics was compared. Fracture strength was measured by using a 4-pont bending test after quenching. Thermal stresses of the ceramics and ceramic-metal composites were calculated using a finite element analysis. The bending strength of the Al2O3 ceramics decreased catastropically after quenching from 20$0^{\circ}C$ to $0^{\circ}C$. The bending strength of the composite also decreased after quenching from 200~2$25^{\circ}C$, but the strength reduction was much smaller than for Al2O3. The maximum thermal stress occured in the monolithic alumina ceramics when exposed to a temperature difference of 20$0^{\circ}C$ was 0.758 GPa. The same amount of stress occured in the Al2O3-Al composite when the temperature difference of 205$^{\circ}C$ used.

• 마이크로전자및패키징학회지
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• 제23권4호
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• pp.35-41
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• 2016

고출력 LED 조명용 패키지를 제조함에 있어서 발열은 LED의 광출력과 수명에 매우 중요한 영향을 주는 인자로 알려져 있다. 본 연구에서는 가로등용 고출력 LED 패키지를 개발함에 있어서 효과적인 방열을 하기 위하여 방열효과가 상대적으로 우수한 구조인 chip-on-a-heat sink 구조를 가지는 세라믹-메탈 기반의 패키지를 제조하였다. 열확산 기능을 하는 heat sink 기판소재는 알루미늄 합금을, LED 어레이 회로를 형성하는 절연막으로는 저온동시소성용 glass-ceramics을 사용하였다. 특히 열처리 시 가장 이슈가 되는 세라믹-금속 하이브리드 패키지 기판의 휨을 억제하기 위한 수단으로서, glass-ceramic 절연막을 부분 코팅함으로써 휨현상을 용이하게 줄일 수 있게 되었다. 또한, LED 패키지의 방열특성의 향상 즉 열저항도 기존의 MCPCB 패키지나 전면 코팅형 절연막 패키지에 비해 훨씬 낮아지는 효과를 얻었을 뿐 아니라, 세라믹 코팅소재의 절감효과도 볼 수 있게 되었다.

• 대한기계학회논문집A
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• 제21권7호
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• pp.1042-1049
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• 1997

LMFBR(Liquid Metal Fast Breeder Reactor) vessel is operated under the high temperatures of 500-550.deg. C. Thus, transient thermal loads were severe enough to cause inelastic deformation due to creep-fatigue and plasticity. For reduction of such inelastic deformations, Y-piece structure in the form of a thermal sleeve is used in LMFBR vessel under repeated start-up, service and shut-down conditions. Therefore, a systematic method for inelastic analysis is needed for design of the Y-piece structure subjected to such loading conditions. In the present investigation, finite element analysis of heat transfer and inelastic thermal stress were carried out for the Y-piece structure in LMFBR vessel under service conditions. For such analysis, ABAQUS program was employed based on the elasto-plastic and Chaboche viscoplastic constitutive equations. Based on numerical data obtained from the analysis, creep-fatigue damage estimation according to ASME Code Case N-47 was made and compared to each other. Finally, it was found out that the numerical predictio of damage level due to creep based on Chaboche unified viscoplastic constitutive equation was relatively better compared to elasto-plastic constitutive formulation.

• Journal of Welding and Joining
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• 제30권3호
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• pp.38-43
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• 2012

In this study, active metal brazing methods for $ZrO_2$ and Ti alloy were discussed. To get a successful metal-ceramic bonding, various factors (melting temperature, corrosion, sag resistance, thermal expansion coefficient etc. of base materilas and filler metal) should be considered. Moreover, in order to clarify bonding between the metal and ceramic, the mechanism of the interfacial structure of the joints should be identified. The driving force for the formation of metal and ceramic interfaces is the reduction of the free energy which occurs when their contact becomes complete. Interfacial bonding depends on the material combinations and the bonding processes. This study describes the bonding between ceramic and metal in an active metal brazing.

• 마이크로전자및패키징학회지
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• 제27권4호
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• pp.25-37
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• 2020

본 연구에서는 그래핀 소재의 전기전도성 및 자기적 특성을 향상시키기 위해 산화그래핀 표면상의 산소를 포함한 기능기와 열처리 환원공정을 이용하여 환원그래핀과 금속소재를 하리브리드화 하였다. 산화 그래핀 표면의 -OH, -COOH 등의 산소 포함 기능기들을 열처리 환원시킴과 동시에 금속이온을 기능기와의 이온교환법에 의해 치환 합성하는 연구를 진행하였다. 하이브리드 소재 합성에 사용된 금속은 Fe, Ag, Ni, Zn, Fe/Ag이며 SEM, TEM 및 EDS를 통해 환원 그래핀 표면 위에 균일한 크기의 금속 입자가 비교적 구형 잘 분산되었음을 확인하였다. 그래핀 표면상의 금속입자들은 모두 산화물 형태의 구조를 가지고 있었다. 하이브리드 소재의 전기적 특성을 확인하기 위해 rGO-metal hybrid 시료를 PET film에 dip-coating 방법으로 후막 필름을 형성시킨 후 면저항을 측정하였고, SEM을 통해 시편의 두께를 측정하여 비저항을 계산한 결과, 비저항의 범위는 2.14×10-5 ~ 3.5×10-3 ohm/cm범위에 있음을 확인하였다.

• 한국자동차공학회논문집
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• 제6권3호
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• pp.1-10
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• 1998

In this paper, we investigated the improvement of characteristics of knock, emission and fuel consumption rate by optimizing the location and size of water transfer holes in cylinder head gasket without change of engine water jacket design itself. The cooling system was modified in the direction of reducing the metal temperature in the head and increasing the metal temperature in the block. The optimization of water transfer holes in cylinder head gasket was obtained by "flow visualization test". The water transfer holes were concentrated in front side of the engine in order to reduce thermal boundary layer in the water jacket of No. 2 and No. 3 combustion changer in the cylinder head, which would have a large knock intensity, and increase thermal boundary layer in the water jacket of the cylinder block. When the modified coolant flow pattern was applied as proposed in this paper, the knock characteristic was improved. The spark timing was advanced up to 2$^{\circ}$ in low and middle speed range at a full load. In addition, HC emission at MBT was reduced by 5.2%, and the fuel consumption rate was decreased up to 1% in the driving condition of 2400 rpm and 250 KPa. However, since this coolant flow pattern mentioned in this paper might deteriorate the performance of vehicle cooling system due to the coolant flow rate reduction, a properly optimized point should be obtained. obtained.

• Nuclear Engineering and Technology
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• 제55권10호
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• pp.3860-3865
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• 2023

A metallic microcell UO₂ pellet has a microstructure where a metal wall is connected to overcome the low thermal conductivity of the UO₂ fuel pellet. It has been verified that metallic microcell fuel pellets provide an impressive reduction of the fuel centerline temperature through a Halden irradiation test. However, it is difficult to predict the effective thermal conductivity of these pellets and researchers have had to rely on measurement and use of the finite element method. In this study, we designed a unit microcell model using a thermal resistance circuit to calculate the effective thermal conductivity on the basis of the microstructure characteristics by using the aspect ratio and compared the results with those of reported metallic UO₂ microcell pellets. In particular, using the thermal conductivity calculated by our model, the fuel centerline temperature of Cr microcell pellets on the 5th day of the Halden irradiation test was predicted within 6% error from the measured value.

• Archives of Metallurgy and Materials
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• 제64권2호
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• pp.591-595
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• 2019

In this study, an oxide reduction process and a reduction-sintering process were employed to synthesize a thermoelectric alloy from three thermoelectric composite oxide powders, and the thermoelectric properties were investigated as a function of the milling duration. Fine grain sizes were analyzed by via X-ray diffraction and scanning electron microscopy, to investigate the influence of the milling duration on the synthesized samples. It was found that microstructural changes, the Seebeck coefficient, and the electrical resistivity of the compounds were highly dependent on the sample milling duration. Additionally, the carrier concentration considerably increased in the samples milled for 6 h; this was attributed to the formation of antisite defects introduced by the accumulated thermal energy. Moreover, the highest value of ZT (=1.05) was achieved at 373K by the 6-h milled samples. The temperature at which the ZT value maximized varied according to the milling duration, which implies that the milling duration of the three thermoelectric composite oxide powders should be carefully optimized for their effective application.

• Journal of Welding and Joining
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• 제6권1호
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• pp.21-27
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• 1988

This paper describes weldability of dissimilar metal plates with YAG laser for the use of a small-size electronic spring parts. Effects of welding conditions, combination of plates, thickness of upper plate are examined in relation to welding strength and microstructure of welded region. The obtained results are summarized as follows. Welding defects such as cavity and crack showed a tendency to easily occur in the case where 1) pulse duration is short, 2) laser power is high, 3) PBS plate with high thermal diffusivity is used for lower plate. Among these defects, the occurrence of cavity cased a drop of welding strength. This results from the reduction of welding area between upper and lower plates. In SK-5/SUS304 plates (thickness: 0.2/0.4mm/, welding strength was the highest in welding conditions: laser power is 30J/pulse, pulse duration 9ms, amount of defocus +2mm.

• 마이크로전자및패키징학회지
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• 제6권4호
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• pp.23-33
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• 1999

유한요소법을 이용한 IGBT 3상 풀브릿지 모듈의 열.응력 해석을 수행하였다. 패키지 재료에 의한 영향을 살피고자 AIN과 $A1_2O_3$절연기판을 사용한 경우를 비교하였으며, 적층구조의 규격을 변화시켜 열해석 및 열응력 해석결과를 비교하였다. 열해석 경계조건 설정에 따른 차이를 비교하기 위하여 등가열전달계수 경계조건(FHTCC)과 일정온도 경계조건(CTC)으로 나누어 해석하였다. 절연기판 면적의 증가는 열저항 감소에 거의 기여하지 못하였으나 열응력 감소에는 상당한 효과를 보였는데, 기판면적이 3배 넓어지면 열저항 감소분은 $A1_2O_3$ 절연기판 모듈에서 8.9%정도, AIN 절연기판 모듈에선 1.5% 정도 감소하는데 그쳤으나 열응력은 최고 60%의 감소를 보였다. 또한 솔더의 두께가 증가할수록 열저항은 증가하였으나, 열응력은 감소 또는 일정하게 유지함을 확인하였다. 각 모듈에서 최대응력값은 모두 절연기판과 접촉된 상, 하부 Cu pad에서 발생하였으며 모듈 패키지 가장자리 부분보다는 중앙부의 응력값이 높았다.