• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.41 no.2
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• pp.55-63
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• 2009

This study was performed to evaluate the heavy metal contents in various packaging board. Domestic and foreign OCC (old corrugated containers) and old duplex boards were used as raw materials. Tests were made for the printed and unprinted parts of the sample. Heavy metal contents of old food packaging boards made from virgin pulp fibers were also evaluated. The contents of heavy metals including lead (Pb), cadmium (Cd), barium (Ba), arsenic (As), antimony (Sb), selenium (Se), and mercury (Hg) were determined using ICP-AES (Inductively Coupled Plasma - Atomic Emission Spectrometer), and CV-AAS (Cold vapor-atomic absorption spectrometer) after digesting the samples in a microwave oven. The contents of heavy metals contained in domestic packaging board were higher than those in overseas samples, and OCC showed higher contents of heavy metals than old duplex boards. Printed parts gave greater heavy metal contents than unprinted parts. Results indicate that recycling of paper and paperboard products increases the heavy metal contamination of the paper packaging products and this derives mostly from the heavy metals contained in printing inks. Recycling processes that decrease heavy metals in recycled fibers and new printing inks that contains less heavy metals should be developed to solve the problem associated with the heavy metals in packaging paper products.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.10a
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• pp.425-426
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• 2006

• Journal of the Korean Graphic Arts Communication Society
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• v.9 no.1
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• pp.45-51
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• 1991

Commercially available paper stickers, electrostatic stickers, and metal sticker generally involve process of printing on the substrate and die-cutting to peel the sticker off the release paper. Using plastisol ink and multi-layer screen printing technique, a process of non die-cutting sticker with same image on both sides was developed. It was also possible to prevent color mixing phenomena at image edge part by printing narrow lines of black ink along the borderline.

• Journal of Power System Engineering
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• v.9 no.4
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• pp.162-167
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• 2005

The purpose of this paper is to improve the hysteresis characteristics of a stack type piezoelectric actuator using system identification and tracking control. Recently, several printing methods that are cost less and faster than previous semiconductor processes have been developed for the production of electric paper and RFID(Radio Frequency IDentification). The system proposed in this study prints by spraying the molten metal. And this system consist of a nozzle, heating furnace, operating actuator and an XYZ 3-axis stage. As an operating system, the piezoelectric(PZT) actuator is a very useful tool for position control of the metal printing system. However, the PZT actuator has a hysteresis nonlinearity due to the ferroelectric characteristics of the PZT element. This hysteresis causes problem position control characteristics in the system and deteriorates the performance of the system. In this study, an investigation was conducted to improve the hysteresis characteristics of the PZT actuator that has an output displacement for the input voltage. In order to reduce the hysteresis nonlinearity of the PZT actuator, this proposed a inverse hysteresis model and a mathematic modeling method that can express the geometric relationship between voltage and displacement. In addition, system identification and PID control methods were examined. Also, it was confirmed that the proposed control strategy gives good tracking performance.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.5
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• pp.89-96
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• 2007

Inkjet printing has become one of the most attractive manufacturing techniques in industry. Especially inkjet printing technology will soon be part of the PCB (Printed Circuit Board) fabrication processes. Traditional printing on PCB includes screen printing and photolithography. These technologies involve high costs, time-consuming procedures and several process steps. However, by inkjet technology manufacturing time and production costs can be reduced, and procedures can be more efficient. PCB manufacturers therefore willingly accept this inkjet technology to the PCB industry, and are quickly shifting from conventional to inkjet printing. To produce the printed circuit board by the inkjet technology, it must be harmonized with conductive nano ink, printing process, system, and inkjet printhead. In this study, micro patterning of conductive line has been investigated using the piezoelectric printhead driven by a bipolar voltage signal is used to dispense 20-40 ${\mu}m$ diameter droplets and silver nano ink which consists of 1 to 50 nm silver particles that are homogeneously suspended in an organic carrier. To fabricate a conductive line used in PCB with high precision, a printed line width was calculated and compared with printing results.

• Proceedings of the KIEE Conference
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• 2007.11a
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• pp.98-99
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• 2007

This study has successfully demonstrated the direct fabrication of polymer resistors using ink-jet printing technology as an alternative patterning to traditional photolithography. The polymer resistors were fabricated just by two layer processes using a ink-jet printer (DMP-2800, Fujifilm Dimatix). First, resistive materials was patterned by a ink-jet printing with the desired width and length. Next, resistor fabrication was completed by printing metal contact pads on the both sides of the polymer resistor. We used poly (3,4-ethylene dioxythiophene) poly(styrenesulfonate)(PEDOT:PSS) for the resistor material and a nano-sized silver colloid for the metal contact pads. We characterized the electrical properties of PEDOT:PSS by measuring sheet resistance and specific resistance on a glass substrate. From analysis of the measured resistances, the electrical resistances of the polymer resistors linearly increased as a function of printed width and length of resistors. The accuracy of the fabricated polymer resistor showed about $0.6{\sim}2.5%$ error for the same dimensions.

• Transactions of the Korean Society of Pressure Vessels and Piping
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• v.17 no.2
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• pp.75-82
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• 2021

The 3D printing technology is one of the fourth industrial revolution technology that drives innovation in the manufacturing process, and should be applied to nuclear industry for various purposes according to the manufacturing trend change. In nuclear industry, it can be applied to manufacture obsolete items and new designed parts in advanced reactors or small modular reactors (SMRs), replacing the traditional manufacturing technologies. A gate valve body was manufactured, which was obsolete in nuclear power plant, using DED(Directed Energy Deposition) metal 3D printing technology after restoring design characteristics including 3D design drawing by reverse engineering. The 3D printed valve body was assembled with commercial parts such as seat-ring, disk, stem, and actuator for performance test. For the valve assembly, including 3D printed valve body, several tests were performed, including pressure test, end-loading test, and seismic test according to KEPIC MGG and KEPIC MFC. In the pressure test, hydraulic pressure of 391kgf/cm² was applied to 3D printed valve body, and no leak was detected. Also the 3D printed valve assembly was performed well in end-loading and seismic tests.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.675-676
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• 2011

• Korean Journal of Materials Research
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• v.17 no.9
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• pp.453-457
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• 2007

Interest in use of ink-jet printing for pattern-on-demand fabrication of metal interconnects without complicated and wasteful etching process has been on rapid increase. However, ink-jet printing is a wet process and needs an additional thermal treatment such as an annealing process. Since a metal ink is a suspension containing metal nanoparticles and organic capping molecules to prevent aggregation of them, the microstructure of an ink-jet printed metal interconnect 'as dried' can be characterized as a stack of loosely packed nanoparticles. Therefore, during being treated thermally, an inkjet-printed interconnect is likely to evolve a characteristic microstructure, different from that of the conventionally vacuum-deposited metal films. Microstructure characteristics can significantly affect the corresponding electrical and mechanical properties. The characteristics of change in microstructure and electrical resistivity of inkjet-printed silver (Ag) films when annealed isothermally at a temperature between 170 and $240^{\circ}C$ were analyzed. The change in electrical resistivity was described using the first-order exponential decay kinetics. The corresponding activation energy of 0.44 eV was explained in terms of a thermally-activated mechanism, i.e., migration of point defects such as vacancy-oxygen pairs, rather than microstructure evolution such as grain growth or change in porosity.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.28 no.6
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• pp.250-255
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• 2018

The CoCrMo as-built alloys prepared by 3D-printing process are studied on tensile strength, wear resistance, crystal structure and microstructure after complex heat-treatment including HIP. In this study, HIP treatment for removing micropores, ambient heat-treatment for formation of metal carbides, and solution heat-treatment for homogenization of the created metal carbides were tried and characterized for applying to artificial joint. The complex heat-treatment effects of the CoCrMo as-built alloys prepared by 3D-printing process were owing to the densification during HIP, formation of metal carbides and homogenization of the created metal carbides. The effects of the complex heat-treatment were confirmed by XRD, FE-SEM and EDS.