• Steel and Composite Structures
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• 제28권6호
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• pp.671-679
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• 2018

The paper is devoted to the stability analysis of a simply supported five layer sandwich beam. The beam consists of five layers: two metal faces, the metal foam core and two binding layers between faces and the core. The main goal is to elaborate a mathematical and numerical model of this beam. The beam is subjected to an axial compression. The nonlinear hypothesis of deformation of the cross section of the beam is formulated. Based on the Hamilton's principle the system of four stability equations is obtained. This system is approximately solved. Applying the Bubnov-Galerkin's method gives an ordinary differential equation of motion. The equation is then numerically processed. The equilibrium paths for a static and dynamic load are derived and the influence of the binding layers is considered. The main goal of the paper is an analytical description including the influence of binding layers on stability, especially on critical load, static and dynamic paths. Analytical solutions, in particular mathematical model are verified numerically and the results are compared with those obtained in experiments.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 영호남학술대회 논문집
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• pp.273-278
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• 2000

In order to study effects of interface layers between PZT films and electrodes for MFM(Metal-Ferroelectric-Metal) structure capacitors, we have fabricated the capacitors with the Pt/PZT/interface-layer/Pt/$TiO_2/SiO_2/Si$ structure. $PT(PbTiO_3)$ interface layers were formed by sol-gel deposition and PbO, $ZrO_2$ and $TiO_2$ thin layers were deposited by reactive sputtering. $TiO_2$ interface layers result in the finest grains of PZT films compared to $PbO_2$ and $ZrO_2$ layers. On the other hand, PT interface layers result in improved morphology of PZT films and do not significantly change ferroelectric properties. It is also observed that seed layers at the middle and top of PZT films do not give significant effects on grain size but the PT seed layer at the interface between the bottom electrode and the PZT films results in the small grain size.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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• pp.787-790
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• 2009

High contrast red, green and blue organic light-emitting diodes were fabricated using inorganic metal multi layer composed of thin Al, KCl and thick Al and then were compared to optical and electrical characteristics with the attached polarizer and conventional OLEDs. Ambient light reflection of OLED using inorganic metal layer, polarizer and conventional metal layer were 29.2, 31.1 and 82.5% respectively. Optical characteristics of OLEDs using inorganic metal layer were max luminescence of 13040 cd/m2 and luminous efficiency of 2.12 cd/A at 8V whereas OLEDs using polarizer has 8456 cd/m2 and 1.43 cd/A at 8V each. OLEDs including inorganic metal multi layers show significant technical advantages in achieving high performance of OLED display with improved contrast ratio of 251:1, specifically in Red OLED.

• 한국전기전자재료학회논문지
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• 제20권9호
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• pp.802-807
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• 2007

We have developed red phosphorescent top emission organic light-emitting diodes with transparent metal cathodes deposited by using thermal evaporation technique. Phosphorescent guest molecule, BtpIr(acac), was doped in host CBP for the red phosphorescent emission, Ca/Ag, Ba/Ag, and Mg/Ag double layers were used as cathode materials of top emission devices, which were composed of glass/Ni/2TNATA(15 nm)/${\alpha}$-NPD(35 nm)/CBP:BtpIr(acac)(40 nm, 10%)/BCP(5 nm)/$Alq_3$(5 nm)/cathodes. The optical transparencies of these metal cathodes strongly depend on underlying Ca, Ba, and Mg layers. These layers also strongly affect the electrical conduction and emission properties of the red phosphorescent top emission devices.

• Transactions on Electrical and Electronic Materials
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• 제18권1호
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• pp.13-15
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• 2017

Low emissivity glass for high transparency in the visible range and low emissivity in the IR (infrared) range was fabricated and investigated. The multilayers were have been fabricated, and consisted of two outer oxide layers and a middle layer of Ag as a metal layer. Oxide layers were formed by rf sputtering and metal layers were formed using by an evaporator at room temperature. SiInZnO (SIZO) film was used as an oxide layer. The OMO (oxide-metaloxide) structures of SIZO/Ag/SIZO were analyzed by using transmittance, AFM (atomic force microscopye), and XRD (X-ray diffraction). The OMO multilayer structure was designed to investigate the effect of Ag layer thickness on the optical property of the OMO structure.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권1호
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• pp.332-335
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• 2007

Electron injection improvement in OLED organic layers can be obtained by their doping or using alkaline-earth or alkali metals as electron injection layers (EIL). Common handling problems can be solved by an innovative metal dispensing technology to ensure controlled and reliable metal layers for OLED. Thickness and deposition rate of EIL during the process have been explored to optimize device performances.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2002년도 ITC-CSCC -1
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• pp.365-368
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• 2002

We investigated the influence of RTP annealing of multi-layered metal films deposited on oxides layer. Two types of oxides, BPSG and P-7205, were used as a bottom layer under multi-layered metal film. The bonding was not good in metal/BPSG/Si samples because adhesion between metal layer and BPSG oxide layer was poor by interfacial reaction during RTP annealing above 650$^{\circ}C$. On the other hand bonding was always good in metal/ P-TEOS /Si samples regardless of annealing temperature. We observed the interface between oxide and metal layers using AES and TEM. The phosphorus and oxygen profile in interface between metal and oxide layers were different in metal/BPSG/Si and metal/P-TEOS/Si samples. We have known that the properties of interface was improved in metal/BPSG/Si samples when the sample was annealed below 650$^{\circ}C$.

• Journal of Welding and Joining
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• 제15권6호
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• pp.96-104
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• 1997

The present study was aimed to correlate the microstructure and the hardness as well as the wear resistance of the metal-ceramic particulated composite layer on the pure Al plate. The composite layers were constructed by the addition of TiC particles on the surface of Al-Cu alloyed layers by PTA overlaying process. Initially, the Al-Cu alloyed layers were achieved by the deposition of Al-(25 ~ 48%) Cu alloys on the pure Al plate by TIG process. It was revealed that TiC particles were uniformly dispersed without any reaction with matrix in the composite layer. The volume fraction of TiC particles (TiC V F) increased from 12% to 55% with increasing the number of pass of composite layer. Hardnesses of (Al-48%Cu + TiC (3&4layers)) composite layer were Hv450 and Hv560, respectively, due to the increase of TiC V/F. Hardnesses of (Al-Cu + TiC) composite layers decreased gradually with insreasing temperature from 100$^{\circ}$C to 400$^{\circ}$C, and hardnesses at 400$^{\circ}$C were then reached to 1/5 - 1/10 of room temperature hardness depending on the construction of composite layers. The Specific wear of (Al + Tic) layer and Al-48%Cu alloyed layer decreased to 1/10 of the of pure Al, while the specific wear of (Al-48%Cu + TiC (4 layers)) composite layer exhibited 1/15 of that of steel such as SS400 and STS304.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집
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• pp.18-21
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• 2002

As the mask design rules get smaller, the probability of the process failure becomes higher due to the narrow overlay margin between the contact and metal interconnect layers. To obtain the minimum process margin, a tabbing and cutting method is applied with the rule based optical proximity correction to the metal layer, so that the protection to bridge problems caused by the insufficient space margin between the metal layers can be accomplished. The side-lobe phenomenon from the attenuated phase shift mask with the tight design nile is analyzed through the aerial image simulation for test patterns with variation of the process parameters such as numerical aperture, transmission rate, and partial coherence. The corrected patterns are finally generated by the rules extracted from the side-lobe simulation.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2002년도 하계종합학술대회 논문집(2)
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• pp.209-212
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• 2002

As the mask design rules get smaller, the probability of the process failure becomes higher doc to the narrow overlay margin between the contact and metal interconnect layers. To obtain the minimum process margin, a tabbing and cutting method Is applied with the rule based optical\ulcorner proximity correction to the metal layer, so that the protection to bridge problems caused by the insufficient space margin between the metal layers can be accomplished. The side-lobe phenomenon from the attenuated phase shift mask with the tight design rule is analyzed through the aerial image simulation for test patterns with variation of the process parameters such as numerical aperture, transmission rate, and partial coherence. The corrected patterns are finally generated by the rules extracted from the side-lobe simulation.