• Journal of Powder Materials
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• v.18 no.5
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• pp.423-429
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• 2011

Thermoelectric-thick films were fabricated by using a screen printing process of n and p-type bismuth-telluride-based pastes. The screen-printed thick films have approximately 30 ${\mu}m$ in thickness and show rough surfaces yielding an empty gap between an electrode and the thick film. The gap might result in an increase of an electrical resistivity of the fabricated thick-film-type thermoelectric module. In this study, we suggest a conductive metal coating onto the surfaces of the screen-printed paste in order to reduce the contact resistance in the module. As a result, the electrical resistivity of the thermoelectric module having a gold coating layer was significantly reduced up to 30% compared to that of a module without any metal coating. This result indicates that an introduction of conductive metal layers is effective to decrease the contact resistivity of a thick-film-typed thermoelectric module processed by screen printing.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2017.05a
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• pp.124-125
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• 2017

In this study, the shielding effectiveness of the Zn-Al arc thermal metal film coated cement-mortar mixed with copper powder by reflection, absorption, multi-reflection loss in 2.25~2.65 GHz was reviewed. By enhancing the mixing ratio of copper powder, the shielding effectiveness by absorption and multi-reflection loss was increased, but shielding rate(%) based on 80 dB showed below 20%. The Zn-Al arc thermal metal film coated on specimen, the shielding rate increased 3.5 times by reflection loss.

• Journal of the Korean Graphic Arts Communication Society
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• v.29 no.3
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• pp.133-142
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• 2011

We produce a photosensitive convex plate to research a Nickel metal relief printing plate using galvanic process. A Method for preparing DLC convex plate that is metalized on Nickel metal relief printing plate using CVD(Chemical Vapor Deposition) process and $N_2DLC$-convex plate that is DLC metalized thin film layer of $N_2$ plasma surface treatment are comprised. DLC thin film layers on Nickel surface are fragile. The results of the research indicate that the coefficient of friction on DLC metalized thin film layer is relatively low than Nickel surface and the durability of Nickel surface coated DLC metalized thin film layer is superior to Nickel surface. A relative evaluation of three form plate wetting properties using varnish liquid-drop plate indicates superior printing aptitudes for $N_2DLC$, DLC, Nichel plate order as above.

• Korean Journal of Optics and Photonics
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• v.12 no.5
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• pp.406-413
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• 2001

We report theoretical and experimental results for the wavelength and polarization selectivity of a fiber-to-planar waveguide coupler made of a side polished single mode fiber covered with a planer waveguide incorporating a thin metal film. A simple but exact approach to obtain the modal properties of multilayer planar waveguide with a thin metal film is described. The device was modeled into equivalent 1 dimensional structure and its behaviour was analyzed based on coupled mode theory. The effects of metal film thickness and refractive index of superstrate on the device properties were measured and explained.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.1
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• pp.15-20
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• 2004

The interfacial layer between the oxide film and the metal film according to RTP annealing temperature of metal film has been studied. Two types of oxides, BPSG and PETEOS, were used as a bottom layer under multi-layered metal films. We observed the interface between oxide and metal films using SEM (scanning electron microscopy), TEM (transmission electron microscopy), AES (auger electron spectroscopy). Bonding failure was occurred by interfacial reaction between the BPSG oxide and the multi-layered metal films above $650^{\circ}C$ RTP anneal. The phosphorus accumulation layer was observed at interface between BPSG oxide and metal films by AES and TEM measurements. On the other hand, bonding was always good in the sample using PETEOS oxide as a bottom layer. We have known that adhesion between BPSG and multi-layered metal films was improved when the sample was annealed below $650^{\circ}C$.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.318.2-318.2
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• 2014

The high contact resistance is still one of the major issues to be resolved in CdS/CdTe thin film solar cells. CdTe/Metal Schottky contact induced a high contact resistance in CdS/CdTe solar cells. It has been reported that the work function of CdTe thin film is more than 5.7 eV. There has not been a suitable back contact metal, because CdTe thin film has a high work function. In a few decades, some buffer layer was reported to improve a back contact problem. Buffer layers which are Te, $Sb_2Te_3$, $Cu_2Te$, ZnTe:Cu and so on was inserted between CdTe and metal electrode. A formed buffer layers made a tunnel junction. Hole carriers which was excited in CdTe film by light absorption was transported from CdTe to back metal electrode. In this report, we reported the variation of solar cell performance with different buffer layer at the back contact of CdTe thin film solar cell.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.90-90
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• 2011

Transparent conducting oxide (TCO) films have been intensively utilized in the electric applications, such as, displays, lightings and solar cells due to the good electric conductivity with an excellent transmittance of the visible light. We, herein present an excellent Al-doped ZnO film (AZO), which has been fabricated by co-sputtering method. An as-deposited AZO film had an optical transmittance of 84.78% at 550 nm and a resistivity of $7.8{\times}10^{-3}{\Omega}cm$. A rapid annealing process significantly improved the optical transmittance and electrical resistivity of the AZO film to 99.67% and $1{\times}10^{-3}{\Omega}cm$, respectively. The fabricated AZO film was fabricated for a metal-semiconductor-metal (MSM) structure. The AZO film-embedding MSM device was highly responsive to a UV light.

• Korean Journal of Materials Research
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• v.29 no.11
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• pp.715-719
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• 2019

Molybdenum is a low-resistivity transition metal that can be applied to silicon devices using Si-metal electrode structures and thin film solar cell electrodes. We investigate the deposition of metal Mo thin film by plasma-enhanced atomic layer deposition (PE-ALD). $Mo(CO)_6$ and $H_2$ plasma are used as precursor. $H_2$ plasma is induced between ALD cycles for reduction of $Mo(CO)_6$ and Mo film is deposited on Si substrate at $300^{\circ}C$. Through variation of PE-ALD conditions such as precursor pulse time, plasma pulse time and plasma power, we find that these conditions result in low resistivity. The resistivity is affected by Mo pulse time. We can find the reason through analyzing XPS data according to Mo pulse time. The thickness uniformity is affected by plasma power. The lowest resistivity is $176{\mu}{\Omega}{\cdot}cm$ at $Mo(CO)_6$ pulse time 3s. The thickness uniformity of metal Mo thin film deposited by PE-ALD shows a value of less than 3% below the plasma power of 200 W.

• The Journal of Korean Academy of Prosthodontics
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• v.25 no.1
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• pp.303-316
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• 1987

The purpose f this study was to evaluate the effect of resin film thickness on the tensile bond strength and to compare the tensile bond strengths of 4 differently treated metal surfaces. For the experiment, seventy metal specimens were cast with Verabond and divided into I, II, III, groups. The metal specimens in group I were electrolytically etched and cemented with Panavia under finger pressure. Cement film thickness was regulated with metal spacers. The metal specimens in Group II were treated by 4 methods, such as electrolytic etching method, salt-roughened method, EZ-oxisor method , chemical etching method and cemented with Panavia. In group III, electrolytically etched metal specimens were cemented with Hy-Bond. The etched surface of metal specimens and the cement film thickness were examined under the scanning electron microscope. Results were as follows; 1. The tensile bond strength showed no significant difference between $30{\mu}m,\;80{\mu}m,\;130{\mu}m$ film thicknessspecimens. 2. There was no significant difference in the tensile bond strength between the 4 differently treated metal specimens. 3. The tensile bond strength showed significant difference between Panavia and Hy-Bond. 4. Scanning electron microscope photograph revealed that tile interdendritic eutectic was removed in electrolytically etched metal surfaces hilt even dendritic arm was removed in Chemically etched metal surfaces. 5. The metal surfaces which were air-abraded with $50{\mu}m$ aluminum oxide showed roughness and small crack on scanning electron microscope photograph.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2011.11a
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• pp.554-557
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• 2011

One of the issues that occurs in development of a combustor using Metal Powder as a fuel is an alumina slag processing. A water film formed inside the combustor is expected to be able to solve this issue. The experiments about the formation of a water film were carried out as a preliminary study. As the tangential velocity of water jet is increasing, the angle derivation from horizontal is decreasing for the test model. Results of the experiments showed that the thin water film on the inner surface appeared at the velocity of 10~15 m/s.