• Proceedings of the Membrane Society of Korea Conference
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• 1994.10a
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• pp.8-11
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• 1994

Disposal of hazardous ions in the aqueous streams is a significant industrial waste problem.. Waste streams from electronics, electroplating, and photographic industries contain metal ions such as copper, nickel, zinc, chromium(IV), cadmium, aluminum, silver, and gold, amongst others in various aqueous solutions such as sulfates, chlorides, fluorocarbons, and cyanides. Typical plating solutions having similar compositions are listed in Table 1. Spent process streams in catalyst manufacturing facilities also contain precious metals such as Ag, Pt, and Pd. Developing an effective recovery process of these metal ions for reuse is important.

• Journal of Surface Science and Engineering
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• v.44 no.6
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• pp.239-245
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• 2011

Magnesium alloys is the lightest by structural metals, but it is not good corrosion resistant because of pit, void. Particularly, AZ31B magnesium alloy sheets that have slag, scratch by rolling process indicate some defects. The objective of this research is to perform uniform plating on AZ31B by studying etching and zincate process. Especially, zincate treatment by zinc salt and pyrophosphate is the most important in the decoration plating. Dissolution of magnesium is reduced by the formation of uniform zinc conversion layer during strick and post process, which decreases defects for plating process.

• Journal of Powder Materials
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• v.29 no.6
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• pp.511-516
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• 2022

Electroless plating is widely utilized in engineering for the metallization of insulator substrates, including polymers, glass, and ceramics, without the need for the application of external potential. Homogeneous nucleation of metals requires the presence of Sn-Pd catalysts, which significantly reduce the activation energy of deposition. Therefore, rinsing conducted during Sn sensitization and Pd activation is a key variable for the formation of a uniform seed layer without the lack or excess of catalysts. Herein, we report the optimized rinsing process for the functionalization of Sn-Pd catalysts, which enables the uniform FeCo metallization of the glass fibers. Rinsing enables good deposition of the FeCo alloy because of the removal of excess catalysts from the glass fiber. Concurrently, excessive rinsing results in a complete removal of the Sn-Pd nucleus. Collectively, the comprehensive study of the proposed nanomaterial preparation and surface science show that the metallization of insulators is a promising technology for electronics, solar cells, catalysts, and mechanical parts.

• Journal of Advanced Navigation Technology
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• v.28 no.4
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• pp.544-551
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• 2024

In this study, the electrochemical polarization data required for the simulation of the plating process, simulation of plating conditions, and characterization of the plating layer were discussed. The electrochemical polarization data obtained by potentiodynamic polarization tests and potentiostat analysis of Ni and Cu were used to observe changes in the overvoltage distribution with the flow conditions of the plating solution. In the simulation of plating conditions, the current density distribution and plating thickness distribution were evaluated under different variables to analyze the influence of the location and number of contacts on the rack pins on the plating quality. Simulation results under variables such as anode geometry, interpole distance, auxiliary anode placement, and variation of substrate spacing were used to explore ways to improve plating thickness deviation. Additionally, plating layer characterization analyzed the thickness, adhesion, and delamination of the plating layer with and without buffer layer formation. The simulation results can be utilized as important basic data for improving the efficiency and quality of the plating process.

• Transactions on Electrical and Electronic Materials
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• v.6 no.5
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• pp.225-228
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• 2005

In this work, we studied the optimized copper thickness in Cu ECP (Electrochemical Plating). In order to select an optimized Cu ECP thickness, we examined Cu ECP bulge (bump, hump or over-plating amount), Cu CMP dishing and electrical properties of via hole and line trench over dual damascene patterned wafers split into different ECP Cu thickness. In the aspect of bump and dishing, the bulge increased according as target plating thickness decreased. Dishing of edge was larger than center of wafer. Also in case of electrical property, metal line resistance distribution became broad gradually according as Cu ECP thickness decreased. In conclusion, at least $20\%$ reduced Cu ECP thickness from current baseline; $0.8\;{\mu}m$ and $1.0\;{\mu}m$ are suitable to be adopted as newly optimized Cu ECP thickness for local and intermediate layer.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.65 no.3
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• pp.445-451
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• 2016

General fuse elements of solution for fast acting operation characteristics made using silver or silver alloy, those are not able to dominate cost competition to the advanced global leaders that have not only high technology but competitive price. In this study, the method that compose the fuse elements manufactured solution of fast acting operation characteristics by using precision multi-layer thin film plating and helical cutting process from low-priced copper metal. Furthermore, in order to move rated current line of fuse due to the heat loses, the manufacture construction method of fixed resistor is introduced, and then Ni-P plating layer and Sn plating layer are introduced multiply for controling fine opening time characteristics. So this study can establish the high productive and low-priced production method.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.26 no.4
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• pp.357-364
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• 2017

Metal casting is a process in which molten metal or liquid metal is poured into a mold made of sand, metal, or ceramic. The mold contains a cavity of the desired shape to form geometrically complex parts. The casting process is used to create complex shapes that are difficult to make using conventional manufacturing practices. For the optimal casting process design of sleeve parts, various analyses were performed in this study using commercial finite element analysis software. The simulation was focused on the behaviors of molten metal during the mold filling and solidification stages for the precision and sand casting products. This study developed high-life sleeve parts for the sink roll of continuous hot-dip galvanizing equipment by applying a wear-resistant alloy casting process.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.1
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• pp.15-20
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• 2015

I developed a high-quality metal door with a hologram-pattern design using a high-speed electroforming process. In this study, the major processes were master production, conducting grant, nickel-sulfamate acid electroforming, ablation treatment, and final dressing. The processing system was provided with a nickel sulfamate pole, and a rotary-pole PP-plating jig in a circular tank. This approach could reduce defects and errors, as much as possible, by its use of a hologram pattern to create the master of a metal door. The thin-sheet metal-creation process for the door built-in metal pattern using electroforming with hologram was successful.

• 한국생물공학회:학술대회논문집
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• 2000.04a
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• pp.357-360
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• 2000

Biosorption process is an economic and potential process for metal sequestering from the water. The oxidized Undaria pinnatifida by nitric acid had high uptake capacity for heavy metals of 4 - 6 meq / g dry mass. For the application of oxidized Undaria pinnatifida, recovery of metal in plating wastewater was studied. The uptake capacity of the oxidized Undaria pinnatifida was high compared to the ion exchanger IR-120 plus. The treatment efficiency of chromium and copper in the wastewater was 85% In batch. Activated carbon was used to assist the recovery of water by removing organic matters of the wastewater.

• Journal of Surface Science and Engineering
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• v.37 no.5
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• pp.289-295
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• 2004

A dense palladium-nikel (Pd-Ni) alloy composite membrane has been fabricated on microporous nickel support mixed with submicron/micron nickel powder instead of mesoporous stainless steel support. Plasma treatment process is introduced as pre-treatment process instead of HCI activation. Pd-Ni alloy composite membrane prepared by electro plating was fairly a uniform and dense surface morphology. The membrane was characterized by permeation experiments with hydrogen and nitrogen gases at temperature 773 K and pressure 2.2 psi. The results showed that hydrogen ($H_2$) permeance was 27 ml/$\textrm{cm}^2$ㆍatmㆍmin and hydrogen/ nitrogen ($_H2$$N_2$) selectivity was 8 at 773 K.