• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.339-339
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• 2007

Metal coating on ceramic powder has long been attracting interest for various applications such as superconductor where the brittle nature of high temperature ceramic superconductor was complemented by silver coating and metalloceramics where mechanical property improvement was achieved via electroless plating. More recently it has become of great interest in embedded passive device applications since metal coating on ceramic particles may result in the enhancement of the dielectric properties of ceramic-polymer composite capacitors. In our study, nickel ion-containing solution was used for coating commercial capacitor-grade $BaTiO_3$ powder. After filtering process, the powder was dried and heat-treated in 5% forming gas at $900^{\circ}C$. XRD and TEM were utilized for the observation of crystallization behavior and morphology of the particles. It was found that the nickel coating characteristics were strongly dependent on the several parameters and processing variables, such as starting $BaTiO_3$ particle size, nickel source, solution chemistry, coating temperature and time. In this paper, the effects of these variables on the coating characteristics will be presented in some detail.

• ETRI Journal
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• v.25 no.2
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• pp.65-72
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• 2003

To achieve cost and size reductions, we developed a low cost manufacturing technology for RF substrates and a high performance passive process technology for RF integrated passive devices (IPDs). The fabricated substrate is a conventional 6" Si wafer with a 25${\mu}m$ thick $SiO_2$ surface. This substrate showed a very good insertion loss of 0.03 dB/mm at 4 GHz, including the conductive metal loss, with a 50 ${\Omega}$ coplanar transmission line (W=50${\mu}m$, G=20${\mu}m$). Using benzo cyclo butene (BCB) interlayers and a 10 ${\mu}m$ Cu plating process, we made high Q rectangular and circular spiral inductors on Si that had record maximum quality factors of more than 100. The fabricated inductor library showed a maximum quality factor range of 30-120, depending on geometrical parameters and inductance values of 0.35-35 nH. We also fabricated small RF IPDs on a thick oxide Si substrate for use in handheld phone applications, such as antenna switch modules or front end modules, and high-speed wireless LAN applications. The chip sizes of the wafer-level-packaged RF IPDs and wire-bondable RF IPDs were 1.0-1.5$mm^2$ and 0.8-1.0$mm^2$, respectively. They showed very good insertion loss and RF performances. These substrate and passive process technologies will be widely utilized in hand-held RF modules and systems requiring low cost solutions and strict volumetric efficiencies.

• Progress in Superconductivity and Cryogenics
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• v.25 no.4
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• pp.24-27
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• 2023

Until now, many research activities have been conducted to commercialize high-temperature superconducting (HTS) wires for electric applications. Most of all researchers have focused on enhancing the piece length, critical current density, mechanical strength, and throughput of HTS wires. Recently, HTS magnet for generating high magnetic field shows degraded performance due to the deformation of HTS wire by high electro-magnetic force. The deformation can be derived from widthwise thickness non-uniformity of HTS wire mainly caused by wet processes such as electro-polishing of metal substrate and electro-plating of copper. Gradient sputtering process is designed to improve the thickness uniformity of HTS wire along the width direction. Copper stabilizing layer is deposited on HTS wire covered with specially designed mask. In order to evaluate the thickness uniformity of HTS wire after gradient sputtering process, the thickness distribution across the width is measured by using the optical microscope. The results show that the gradient deposition process is an effective method for improving the thickness uniformity of HTS wire.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.12
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• pp.1352-1355
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• 2004

We have applied front contact metallization of plated nickel and copper for high efficiency passivated emitter rear contact(PERC) solar cell. Ni is shown to be a suitable barrier to Cu diffusion as well as desirable contact metal to silicon. The plating technique is a preferred method for commercial solar cell fabrication because it is a room temperature process with high growth rates and good morphology. In this system, the electroless plated Ni is utilized as the contact to silicon and the plated Cu serves as the primary conductor layer instead of traditional solution that are based on Ti/Pd/Ag contact system. Experimental results are shown for over 20 % PERC cells with the Plated Ni/Cu contact system for good performance at low cost.

• Journal of Welding and Joining
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• v.12 no.4
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• pp.110-116
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• 1994

This paper has been researched bondability of electronics devices, such as lead frame and the thick film of Ag/Pd on an alumina substrate by different heat sources. To obtain the bonds with high quality, it is very important to consist of different materials. Therefore, this paper clarifies not only heat mechanism of micro parallel gap resistance bonding method and pulse heat tip bonding method but also investigates selection of heat sources with micro-electronic materials for bonding. Finally, it is realized fluxless bonding process with filler metal such as plating layers.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1994.11a
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• pp.206-209
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• 1994

This paper has been researched bondability of electronic devices, such as lead frame and thick film of Ag/Pd on an alumina substrate by different heat sources. To obtain the bonds with high quality, it is very important to control both the thermal distribution of the bonds and it stability, because electronics components is consist of different materials. Therefore, this paper clarifies not only heat mechanism of micro parallel gap resistance bonding method and pulse heat tip bonding method but also investigates selection of heat sources with micro-electronic materials for bonding. Finally, it is realzed fluxless bonding process with filler metal such as plating layers.

• Journal of Surface Science and Engineering
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• v.34 no.4
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• pp.337-341
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• 2001

TiN coating of high speed end mill is recently generalized. The study of coating layer using ion plating is mainly about the coating method and the why of the longer life of coated tools. In CNC machning process, metal cutting isn't carry out until the tools including the end-mill and so on are fractured. Namely, it is difficult precision processing when the cutting force of the cutting tool is near the limit the fracture cutting force. So, the estimate of the life by wear and fracture is important. Therefore, this study is about the method to estimate the capacity of the coating layer in relation to the tendency of cutting force and the influence of the cutting capacity of coated end-mill by the condition N2, Ar, temperature. The cutting length is in inverse proportion to the cutting force ratio. So, the life of the TiN coated end mill can be predicated by the ratio of the increase of the cutting force.

• Proceedings of the IEEK Conference
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• 2001.10a
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• pp.259-263
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• 2001

There are several steps such as slicing, lapping, chemical etching and mechanical polishing in the silicon wafer production process. The chemical etching step is necessary to remove damaged layer caused In the slicing and lapping steps. The typical etching liquor is the acid mixture comprising nitric acid, acetic acid and hydrofluoric acid. At present, the waste acid is treated by a neutralization method with a high alkali cost and balky solid residue. A solvent extraction method is applicable to separate and recover each acid. Acetic acid is first separated from the waste liquor using 2-ethlyhexyl alcohols as an extractant. Then, nitric acid is recovered using TBP(Tri-butyl phosphate) as an extractant. Finally hydrofluoric acid is separated with the TBP solvent extraction. The expected recovered acids in this process are 2㏖/l acetic acid, 6㏖/1 nitric acid and 6㏖/l hydrofluoric acid. The yields of this process are almost 100% for acetic acid and nitric acid. On the other hand, it is important to recover and reuse the metal values contained in various industrial wastes in a viewpoint of environmental preservation. Most of industrial products are made through the processes to separate impurities in raw materials, solid and liquid wastes being necessarily discharged as industrial wastes. Chemical methods such as solvent extraction, ion exchange and membrane, and physical methods such as heavy media separation, magnetic separation and electrostatic separation are considered as the methods for separation and recovery of the metal values from the wastes. Some examples of the application of solvent extraction to the treatment of wastes such as Ni-Co alloy scrap, Sm-Co alloy scrap, fly ash and flue dust, and liquid wastes such as plating solution, the rinse solution, etching solution and pickling solution are introduced.

• Journal of Korean Society of Environmental Engineers
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• v.37 no.4
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• pp.204-209
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• 2015

The effluent limit of nickel from electroplating wastewater has been strengthened from 5 mg/L to 3 mg/L from 2014. However, currently applied treatment process for nickel plating wastewater is unable to meet the effluent limit, most of the treatment concept conducted by treatment plant is dilution with other metal bearing wastewater. This can cause very significant impact to the environment of nickel contamination. With this connection, the feasibility test has been conducted with the use of electrolysis by using sacrificial electrodes. Experiments were conducted in synthetic and electroless nickel plating wastewater. Optimal condition of current density, pH were derived from the synthetic wastewater. It was found that the removal efficiency of nickel exceeded 94% at the operation condition of at pH 9 and the current density of $1{\sim}2mA/cm^2$. At this conditions, the iron sludge was generated very low amount. However, it was unsuccessful to meet the effluent limit by applying these treatment conditions to the real electroplating wastewater. This can be explained due to the matrix effect of other metals and anions contained real electroplating wastewater. From the result of further study, the optimal conditions for the real wastewater treatment were found out to be at pH 9, current density $6{\sim}7mA/cm^2$, for 5 minutes of operating time. At these conditions, 88% removal of nickel was achieved, which results the residual nickel concentration was below 3 mg/L.

• Corrosion Science and Technology
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• v.17 no.5
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• pp.231-241
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• 2018

Atmospheric corrosion is generally an electrochemical degradation process of metal. It can be caused by various corrosion factors of atmospheric component, weather, and air pollutants. Moisture, particles of sea salts, and sulfur dioxide are major factors in atmospheric corrosion. Galvanizing coating is one of the most efficient ways to protect iron from corrosion by zinc plating on the surface of the iron. Galvanized steels are being widely used in automobiles, building structures, roofing, and other industrial structures due to their high corrosion resistance compared to bare iron. Atmospheric corrosion of galvanized steel has shown complex corrosion behavior depending on coating process, coating thickness, atmospheric environment, and air pollutants. In addition, different types and kinds of corrosion products can be produced depending on the environment. Lifespan of galvanized steels is also affected by the environment. Therefore, the objective of this study was to determine the corrosion behavior of galvanized steel under atmospheric corrosion at six locations in Korea. When the exposure time was increased, content of zinc from GA surface decreased while contents of iron and oxygen tended to increase. On the other hand, content of iron was constant even after 36 months of exposure of GI.