• Title/Summary/Keyword: Metal Pattern

Search Result 813, Processing Time 0.027 seconds

Kinetic Mechanism in the Absence of Metal of Hafnia alvei Aspartase in the Amination Direction

  • Ra, Im Jeong;Kim, Hyo Jun;Yun, Mun Yeong
    • Bulletin of the Korean Chemical Society
    • /
    • v.22 no.3
    • /
    • pp.288-292
    • /
    • 2001
  • The kinetic mechanism of Hafnia alvei aspartase in the amination direction has been determined in the absence of metal. The initial velocity pattern obtained by varying the concentration of fumarate at several fixed concentrations of NH4+ , shows an intersection on the left of the ordinate at pH 7.0, indicating that the kinetic mechanism is a sequential mechanism in which substrate inhibition by fumarate is observed. The dead-end inhibition pattern by varying the concentration of NH4+ at several fixed concentration of succinate shows an intersection on the left of the ordinate. These data are consistent with random addition of NH4+, or fumarate. The Haldane relationship gives a Keq of 1.18 ${\times}$10-3 M at pH 7.0, which is in agreement with the values obtained from the direct determination of reaction concentrations at equilibrium (6.0 $\pm0.2$ ${\times}$10-3 M).

Nonlinear harmonic resonances of spinning graphene platelets reinforced metal foams cylindrical shell with initial geometric imperfections in thermal environment

  • Yi-Wen Zhang;Gui-Lin She
    • Structural Engineering and Mechanics
    • /
    • v.88 no.5
    • /
    • pp.405-417
    • /
    • 2023
  • This paper reveals theoretical research to the nonlinear dynamic response and initial geometric imperfections sensitivity of the spinning graphene platelets reinforced metal foams (GPLRMF) cylindrical shell under different boundary conditions in thermal environment. For the theoretical research, with the framework of von-Karman geometric nonlinearity, the GPLRMF cylindrical shell model which involves Coriolis acceleration and centrifugal acceleration caused by spinning motion is assumed to undergo large deformations. The coupled governing equations of motion are deduced using Euler-Lagrange principle and then solved by a combination of Galerkin's technique and modified Lindstedt Poincare (MLP) model. Furthermore, the impacts of a set of parameters including spinning velocity, initial geometric imperfections, temperature variation, weight fraction of GPLs, GPLs distribution pattern, porosity distribution pattern, porosity coefficient and external excitation amplitude on the nonlinear harmonic resonances of the spinning GPLRMF cylindrical shells are presented.

A Design of Isotropic RFID Metal Tag Antenna with a PIFA Structure (PIFA구조를 가지는 등방성 RFID 메탈 태그 안테나)

  • Yun, Jung Mee;Chung, Jin Wook
    • The Journal of Korea Institute of Information, Electronics, and Communication Technology
    • /
    • v.2 no.2
    • /
    • pp.57-62
    • /
    • 2009
  • In this paper, we proposed the metal tag antenna of PIFA structure with an isotropic radiation pattern when tag attached the metal material. The antenna consist of antenna body, horizontal patch and ground, and inserted a substrate with high dielectric constant between the antenna body and ground in order to miniaturize the antenna size. The antenna body with symmetric structure is designed to produce an oppositely directed currents. The simulation shows the impedance bandwidth has 20 MHz (900 ~ 920 MHz) and the maximum radiation gain satisfy the -10 dBi and -15 dBi when the tag is in air and attach the metal material. Also, the proposed antenna operates with an isotropic radiation pattern due to satisfy the gain deviation lower than 6 dB, respectively.

  • PDF

Study of Manufacturing Jewelry Master Pattern by Using the DuraForm Rapid Prototyping Mold and the Low Melting Alloy (쾌속조형 듀라폼몰도와 저융점합금을 이용한 주얼리용 마스터패턴 제작에 관한 연구)

  • Joo, Young-Cheol;Song, Oh-Sung
    • Journal of Korea Foundry Society
    • /
    • v.22 no.5
    • /
    • pp.265-270
    • /
    • 2002
  • A novel jewelry master pattern manufacturing process which reduce manufacturing steps by employing a Duraform rapid prototyping mold and a low melting alloy has been suggested. The novel process follows the steps of 'jewelry 3D CAD design ${\rightarrow}$ Durafrom RP mold ${\rightarrow}$ low melting alloy master pattern' while the previous process follows more complicated steps of 'jewelry idea sketch ${\rightarrow}$ detailed drawing ${\rightarrow}$ wax carving ${\rightarrow}$ flask ${\rightarrow}$ silver master pattern.' An upper and a lower part of molds have been manufactured of Duraform powder, of which melting point is $190^{\circ}C$. A maser pattern was manufactured by pouring a low melting alloy of Pb-Sn-Bi-Cd, so called Woods Metal, of which melting point is $70^{\circ}C$, into the mold. The master pattern is a shape of a disk of 20mm diameter that contains various design factors. The variations of dimensions, surface roughness, surface pore ratio were measured by an optical microscope, a surface roughness profilometer, and a Rockwell hardness tester. The pattern made of were maeasured by an optical microscope, a surface roughness profilometer, and a Rockwell hardness tester. The pattern made of low melting alloy has sufficient surface hardness, and surface pore ratio to be used as the jewelry master pattern.

Cu Line Fabricated with Inkjet Printing Technology for Printed Circuit Board (잉크젯 인쇄 기술을 이용한 인쇄회로기판용 나노구리배선 개발)

  • Seo, Shang-Hoon;Lee, Ro-Woon;Yun, Kwan-Soo;Joung, Jae-Woo;Lee, Hee-Jo;Yook, Jong-Gwan
    • Proceedings of the KSME Conference
    • /
    • 2008.11a
    • /
    • pp.1806-1809
    • /
    • 2008
  • Study that form micro pattern by direct ink jet printing method is getting attention recently. Direct ink jet printing spout fine droplet including nano metal particle by force or air pressure. There is reason which ink jet printing method is profitable especially in a various micro-patterning technology. It can embody patterns directly without complex process such as mask manufacture or screen-printing for existent lithography. In this study, research of a technology that ejects fine droplet form of Pico liter and forms metal micro pattern was carried with inkjet head of piezoelectricity drive system. Droplet established pattern while ejecting consecutively and move on the surface at the fixed speed. Patterns formed in ink are mixed with organic solvent and polymer that act as binder. So added thermal hardening process after evaporate organic solvent at isothermal after printing. I executed high frequency special quality estimation of CPW transmission line to confirm electrical property of manufactured circuit board. We tried a large area printing to confirm application possibility of an ink jet technology.

  • PDF

Nondestructive Testing of Residual Stress on the Welded Part of Butt-welded A36 Plates Using Electronic Speckle Pattern Interferometry

  • Kim, Kyeongsuk;Jung, Hyunchul
    • Nuclear Engineering and Technology
    • /
    • v.48 no.1
    • /
    • pp.259-267
    • /
    • 2016
  • Most manufacturing processes, including welding, create residual stresses. Residual stresses can reduce material strength and cause fractures. For estimating the reliability and aging of a welded structure, residual stresses should be evaluated as precisely as possible. Optical techniques such as holographic interferometry, electronic speckle pattern interferometry (ESPI), Moire interferometry, and shearography are noncontact means of measuring residual stresses. Among optical techniques, ESPI is typically used as a nondestructive measurement technique of in-plane displacement, such as stress and strain, and out-of-plane displacement, such as vibration and bending. In this study, ESPI was used to measure the residual stress on the welded part of butt-welded American Society for Testing and Materials (ASTM) A36 specimens with $CO_2$ welding. Four types of specimens, base metal specimen (BSP), tensile specimen including welded part (TSP), compression specimen including welded part (CSP), and annealed tensile specimen including welded part (ATSP), were tested. BSP was used to obtain the elastic modulus of a base metal. TSP and CSP were used to compare residual stresses under tensile and compressive loading conditions. ATSP was used to confirm the effect of heat treatment. Residual stresses on the welded parts of specimens were obtained from the phase map images obtained by ESPI. The results confirmed that residual stresses of welded parts can be measured by ESPI.

A Study on Malodor Pattern Analysis Using Gas Sensor Array (가스센서 어레이를 이용한 악취 패턴분석에 대한 연구)

  • Choi, Jang-Sik;Jeon, Jin-Young;Byun, Hyung-Gi;Lim, Hea-Jin
    • Journal of Sensor Science and Technology
    • /
    • v.22 no.4
    • /
    • pp.286-291
    • /
    • 2013
  • This paper presents to analyze patterns from single and complex malodors using gas sensor array based on metal oxide semiconductors. The aim of research is to identify and discriminate single malodors such as $NH_3$, $CH_3SH$ and $H_2S$ and their mixtures according to concentration levels. Measurement system for analyzing patterns from malodors is constructed by an array of metal oxide semiconductor sensors which are available commercially together with associate electronics. The patterns from sensory system are analyzed by Principal Component Analysis (PCA) which is simple statistical pattern recognition technique. Throughout the experimental trails, we confirmed the experimental procedure for measurement system such as sensors calibration time and gas flow rate, and discriminated malodors using pattern analysis technique.

Reduction of Radio-Frequency Interference in Metal-Framed Smartphone Using EBG Structures (EBG 구조를 이용한 메탈 프레임 스마트폰 내의 전자파 간섭 저감)

  • Park, Hyun Ho
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
    • /
    • v.27 no.10
    • /
    • pp.945-948
    • /
    • 2016
  • Recent premium smartphones commonly employ a metal frame and this trend is currently spreading over mid-range smartphones. However, the metal frame becomes a good coupling path of electromagnetic noises emitted from digital components in smartphones and then increases radio-frequency interference(RFI) to RF antennas located at top and bottom sides of smartphones. This paper proposed a metal frame with EBG(Electromagnetic Band Gap) structure to reduce the noise coupling to antenna by suppressing surface wave on the metal frame. By simulation, it is confirmed that the proposed metal frame with $7{\times}6$ mushroom-type EBG array pattern with multi-via can reduce the noise coupling to RF antenna by about 20 dB.

Mechanical Machining of Prism Pattern (프리즘 패턴의 기계적 절삭 가공)

  • Yoo Y. E.;Hong S. M.;Je T. J.;Choi D. S.
    • Transactions of Materials Processing
    • /
    • v.15 no.1 s.82
    • /
    • pp.71-75
    • /
    • 2006
  • In recent, various shapes of pattern in micron or nano scale are adapted in many applications due to their good mechanical or optical properties. Light guide panel (LGP) of the LCD is one of important applications for micro pattern and micro prism shape is one of the typical patterns. The size of the surface patterns in most applications is decreasing to the order of micron or even under micron. On the other hand, the area to be patterned keeps enlarging. These two trends in patterned products require tooling micro patterns on large surface, which has still many technical problems to be solved mainly due to pattern size and the tooling area. In this study, we fabricated prism shape of patterns using diamond cutting tool on some metal core and plastic core like PMMA. Some cutting conditions were investigated including cutting force, cutting depth and speed for different core materials.

0.25um T-gate MESFET fabrication by using the size reduction of pattern in image reversal process (형상반전공정의 패턴형성시 선폭감소를 이용한 0.25um T-gate MESFET의 제작)

  • 양전욱;김봉렬;박철순;박형무
    • Journal of the Korean Institute of Telematics and Electronics A
    • /
    • v.32A no.1
    • /
    • pp.185-192
    • /
    • 1995
  • In this study, very fine photoresist pattern was examined using the image reversal process. And very fine photoriesist pattern (less than 0.2um) was obtsined by optimizing the exposure and reversal baking condition of photoresist. The produced pattern does not show the loss of thickness, and has a sparp negative edge profile. also, the ion implanted 0.25um T-shaped gate MESFET was fabricated using this resist pattern and the directional evaporation of gate metal. The fabricated MESFET has the maximum transconductance of 302 mS/mm, and the threshold voltage of -1.8V, and the drain saturation current of this MESFET was 191 mA/mm.

  • PDF