• Title/Summary/Keyword: Metal Forming

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Composition and Structure of Marine Benthic Community Regarding Conditions of Chronic Barbour Pollution

  • Fadeeva, N.P.;Bezverbnaja, I.P.;Tazaki, Kazue;Watanabe, Hiroaki;Fadeev, V.I.
    • Ocean and Polar Research
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    • v.25 no.1
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    • pp.21-30
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    • 2003
  • Seasonal fluctuations of physico-chemical and biological aspects of the environment were studied in Vladivostok harbour (Golden Horn Bay, the East Sea/Sea of Japan). The benthic community structure was described with a focus on size-spectra (bacteria, meio- and macrofauna) related with the chemical environment and chemical fluxes in sediment and to reveal their possible ecological role in the process of bioremediation of the environment. Samples from two sites with different concentrations of heavy metals (Fe, Zn, Cu, Pb, Mn, Cr, Ni Cd, Co) and petroleum hydrocarbon were assessed by a number of methods. These included plate counts of culturable bacteria, observation through a scanning electron (SEM) and transmission electron microscope (TEM). These approaches were complemented with microscopic assessments of the diversity of the benthic community. The specific communities had a limited number of species, tolerant to abnormally high levels of toxic compounds. The dominant species were presented by several sho.1-lived small polychaetes (Capitella capitata) and nematodes (Oncholaimium ramosum). The highest population density was recorded in microbenthos, in various diatoms, various physiological groups of bacteria which participate in biomineralization: marine heterotrophic bacteria, which oxidized oil, black oil in addition to groups resistant to heavy metals. They have the entire set of mechanisms for neutralizing the negative effect of those compounds, forming the detrital food web and biogeochemical circulation of material in sediments, which results in the biological self-recycling of sea basins. Macro- and meiobenthic organisms were more sensitive to a greater extent of $H_2S$ and petroleum hydrocarbons than to metal content, but the within-site rankings were the same as those achieved for microbiological analyses.

Control of Manganese Nodule Characteristics by Volcanic Activity in the NE Equatorial Pacific (북동 태평양 KR1 광구의 망간단괴 산출특성)

  • Kim, Wonnyon;Yang, Seung Jin;Chi, Sang-Bum;Lee, Hyun-Bok
    • Ocean and Polar Research
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    • v.36 no.4
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    • pp.373-381
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    • 2014
  • Korea contract Mn-nodule field in the NE equatorial Pacific is composed of seven sectors with average water depths of 4,513-5,025 m. Of the various factors controlling the properties of Mn-nodule, it seems that water depth is likely connected to the chemical composition and occurrence of nodules. To test whether such an assumption held in each sector, we reviewed previous research data accumulated since 1994 for one of the northern sectors (hereafter KR1) where there are stark contrasts in water depth. High-resolution seabed mapping clearly separates a northern part (KR1N) from a deeper southern part (KR1S), cutting across in the middle of the KR1. In addition, significant volcanic activities forming numerous seamounts are distinctive especially in KR1N. In terms of nodule occurrence, manganese nodules in KR1S are comparatively larger (2-4 cm) with a discoidal shape, while those in KR1N are generally small (<2 cm) with poly-lobate and irregular shapes. Nodules in KR1N also have lower Co, Cu, Mn and Ni, and higher Fe contents. The spatial separation in nodule characteristics might be caused by volcanic activities in KR1N rather than water depth contrast. During the formation of the seamounts in KR1N, rock fragments and volcanic ashes as new nuclei of the nodules would have been continuously generated. As a result, the nodules could not grow larger than 2 cm and display the shapes of a newbie (i.e., irregular and poly-lobate shapes). Moreover, significant Fe supply from volcanic activities probably decreases the Mn/Fe ratio, which may lead to the KR1 nodules being misinterpreted as a hydrogenic in origin compared to other sectors where a high Mn/Fe ratio is present.

Nucleation and growth mechanism of nitride films deposited on glass by unbalanced magnetron sputtering

  • Jung, Min J.;Nam, Kyung H.;Han, Jeon G.
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2001.06a
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    • pp.14-14
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    • 2001
  • Nitride films such as TiN, CrN etc. deposited on glass by PVD processes have been developed for many industrial applications. These nitride films deposited on glass were widely used for not only decorative and optical coatings but also wear and corrosion resistance coatings employed as dies and molds made of glass for the example of lens forming molds. However, the major problem of nitride coatings on glass by PVD process is non-uniform film owing to pin-hole and micro crack. It is estimated that nonuniform coating is influenced by a different surface energy between metal nitrides and glass due to binding states. In this work, therefore, for the evaluation of nucleation and growth mechanism of nitride films on glass TiN and CrN film were synthesized on glass with various nitrogen partial pressure by unbalanced magnetron sputtering. Prior to deposition, for the examination of relationship between surface energy and film microstructure plasma pre-treatment process was carried out with various argon to hydrogen flow rate and substrate bias voltage, duty cycle and frequency by using pulsed DC power supply. Surface energy owing to the different plasma pre-treatment was calculated by the measurement of wetting angle and surface conditions of glass were investigated by X-ray Photoelectron Spectroscopy(XPS) and Atomic Force Microscope(AFM). The microstructure change of nitride films on glass with increase of film thickness were analyzed by X-Ray Diffraction(XRD) and Scanning Electron Microscopy(SEM).

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Investigation of Vanadium-based Thin Interlayer for Cu Diffusion Barrier

  • Han, Dong-Seok;Park, Jong-Wan;Mun, Dae-Yong;Park, Jae-Hyeong;Mun, Yeon-Geon;Kim, Ung-Seon;Sin, Sae-Yeong
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2011.05a
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    • pp.41.2-41.2
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    • 2011
  • Recently, scaling down of ULSI (Ultra Large Scale Integration) circuit of CMOS (Complementary Metal Oxide Semiconductor) based electronic devices become much faster speed and smaller size than ever before. However, very narrow interconnect line width causes some drawbacks. For example, deposition of conformal and thin barrier is not easy moreover metallization process needs deposition of diffusion barrier and glue layer. Therefore, there is not enough space for copper filling process. In order to overcome these negative effects, simple process of copper metallization is required. In this research, Cu-V thin alloy film was formed by using RF magnetron sputter deposition system. Cu-V alloy film was deposited on the plane $SiO_2$/Si bi-layer substrate with smooth and uniform surface. Cu-V film thickness was about 50 nm. Cu-V layer was deposited at RT, 100, 150, 200, and $250^{\circ}C$. XRD, AFM, Hall measurement system, and XPS were used to analyze Cu-V thin film. For the barrier formation, Cu-V film was annealed at 200, 300, 400, 500, and $600^{\circ}C$ (1 hour). As a result, V-based thin interlayer between Cu-V film and $SiO_2$ dielectric layer was formed by itself with annealing. Thin interlayer was confirmed by TEM (Transmission Electron Microscope) analysis. Barrier thermal stability was tested with I-V (for measuring leakage current) and XRD analysis after 300, 400, 500, 600, and $700^{\circ}C$ (12 hour) annealing. With this research, over $500^{\circ}C$ annealed barrier has large leakage current. However V-based diffusion barrier annealed at $400^{\circ}C$ has good thermal stability. Thus, thermal stability of vanadium-based thin interlayer as diffusion barrier is good for copper interconnection.

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Deposition of copper dots with new copper precursors (새로운 Copper 전구체를 이용한 구리점 증착)

  • Kang, Sang-Woo;Seong, Dae-Jin;Shin, Yong-Hyoen;Rhee, Shi-Woo;Yun, Ju-Young
    • Journal of the Korean Vacuum Society
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    • v.15 no.5
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    • pp.485-492
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    • 2006
  • Two new copper(I) complexes with organic ligands, $[Cu^I(hfac)]_2(DVTMSO)$ and $[Cu^I(hfac)]_2(HD)$ (hfac=hexafluoroacetylacetonate, DVTMSO=1,2-divinylte-tramethyl-disiloxane, HD=1,5-hexadiene) were synthesized and used for copper metal-organic chemical vapor deposition. In these compounds, two Cu(hfac) fragments are bonded by one neutral ligand forming unusual structure with respect to other Cu(I) complexes. The compounds exhibited relatively high volatility and stability when compared to other copper(I) precursors. By using the reported compounds as precursors, a continuous Cu layer was not formed but the Cu islands were only observed. And the shape and size of Cu islands are significantly changed as a function of the substrate temperature.

An adaptive fuzzy control for closed-die ring-rolling process ("Ring 생산 Control System의 퍼지 적응제어")

  • 이용현
    • 제어로봇시스템학회:학술대회논문집
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    • 1996.10b
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    • pp.1476-1479
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    • 1996
  • The ring rolling process is one of the best known ring production method. The present model based control system was designed for rings with rectangle cross-section yet. An Adaptive Fuzzy Control for Closed-Die Ring-Rolling was developed in order to enhance the flexibility of the radial-axial ring rolling machine and to produce the rings with highly complex cross-section profile, roller bearing rings. A fuzzy method was implemented because of its simple application and to utilize the known process knowledge. The quality of the control system was estimated by die filling grad, which is strong dependent on the rising time of the controller. The rolling process parameters were also varied to determine their influence on filling of the ring profile. Die filling met the requirement of the industry.

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Characteristics of electrodes using V-Ti based hydrogen storage alloys (V-Ti계 수소저장합금의 전극특성)

  • 김주완;이성만;백홍구
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.7 no.2
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    • pp.284-291
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    • 1997
  • The electrode characteristics of two kinds of metal hydride electrodes using V-Ti (V-rich) based alloy were studied, in which one electrode was prepared by sintering the mixture of V-Ti alloy and Ni powders by a rapid thermal annealing technique and the other one was prepared using V-Ti-Ni ternary alloy, The discharge capacities of all electrodes during the charge-discharge cycling were completely deteriorated within 10 cycles. It appeared that the deterioration of the electrodes was caused by the dissolution of V in the near-surface region into the electrolyte and the formation of $TiO_2$ layer on the alloy particle surface. This degradation mechanism was supported by the facts that V is main hydride forming element and $TiO_2$ has very low electrical conductivity and hydrogen diffusivity.

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Adsorption Characteristics and Structure of 4,4'-Bis(mercaptomethyl)biphenyl on Silver by Surface-enhanced Raman Scattering and Density Functional Theory Calculations

  • Eom, So Young;Lee, Yu Ran;Kim, Hong Lae;Kwon, Chan Ho
    • Bulletin of the Korean Chemical Society
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    • v.35 no.3
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    • pp.875-880
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    • 2014
  • Adsorption of 4,4'-bis(mercaptomethyl)biphenyl (44BMBP) on silver nanoparticles has been investigated by surface-enhanced Raman scattering (SERS) spectroscopy. In addition, the Raman spectra of 44BMBP in solid state and in basic condition have been obtained for comparative study to elicit the characteristics of adsorption. The observed Raman and SERS spectra were analyzed comparing with the normal modes and vibrational frequencies from density functional theory (DFT) calculations performed for the feasible structures of 44BMBP molecule. On the basis of excellent agreement between the calculated and the experimental results, the molecule is found to have both the cis- and trans-forms for the mercaptomethyl groups in the solid state as well as in the basic condition. In contrast, the molecule is found to be chemisorbed on the silver surface by forming two Ag-S linkages only in the cis-form but not in the trans-form due to the steric interruption, which indicates the parallel orientation of molecules on the surface. Particularly, the spectral features in the SERS spectra such as the absence of the C-H stretching band and enhancement for the out-of-plane skeletal modes are confirmatory for the parallel geometry through ${\pi}$ interaction between the phenyl rings and the metal surface, based on the electromagnetic surface selection rule.

Custom Design Making an Application of Patterns of Gold Crown of the Three States Era (삼국시대 금관의 문양을 응용한 복식디자인)

  • Yang, Ji-Na;Lee, Dong-A;Lee, Sang-Eun
    • Journal of the Korea Fashion and Costume Design Association
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    • v.9 no.1
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    • pp.13-22
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    • 2007
  • As the world has been forming the global village and the cultures of each country are exchanged, the unique cultural specialty of each country high been merged with the generality in the world. The increasing interest on the oriental world and the globalization recently brings the fusion form of oriental and occidental cultures. In such a global trend, it is our challenge to find out the traditional beauty and the design factors of Korea for the new challenge and development of Korean fashion and to develop the most Korean and global design by interpreting them in a modem sense. It is the Era of the Three States when an of official hat among the personal ornaments of Korea was firstly described on the literature, including the literature of ancient China and Chronicles of Three States and Heritage of Three States of Korea. Those literatures clarified that the people in Goguryeo Baekje, Silla and Gaya decorated themselves with gold, silver and jade. Furthermore, since various kinds of ornaments have been excavated, they shown the development of metal craft in the Era of Three States. This study aim to exploit the design motives among the gold crown elements among the ornaments during the Era of Three States, interpret them in a modem expression, develop the textile design using the Adobe photoshop and suggest the application approaches by applying them to the clothing design.

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Development of SiC Composite Solder with Low CTE as Filling Material for Molten Metal TSV Filling (용융 금속 TSV 충전을 위한 저열팽창계수 SiC 복합 충전 솔더의 개발)

  • Ko, Young-Ki;Ko, Yong-Ho;Bang, Jung-Hwan;Lee, Chang-Woo
    • Journal of Welding and Joining
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    • v.32 no.3
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    • pp.68-73
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    • 2014
  • Among through silicon via (TSV) technologies, for replacing Cu filling method, the method of molten solder filling has been proposed to reduce filling cost and filling time. However, because Sn alloy which has a high coefficient of thermal expansion (CTE) than Cu, CTE mismatch between Si and molten solder induced higher thermal stress than Cu filling method. This thermal stress can deteriorate reliability of TSV by forming defects like void, crack and so on. Therefore, we fabricated SiC composite filling material which had a low CTE for reducing thermal stress in TSV. To add SiC nano particles to molten solder, ball-typed SiC clusters, which were formed with Sn powders and SiC nano particles by ball mill process, put into molten Sn and then, nano particle-dispersed SiC composite filling material was produced. In the case of 1 wt.% of SiC particle, the CTE showed a lowest value which was a $14.8ppm/^{\circ}C$ and this value was lower than CTE of Cu. Up to 1 wt.% of SiC particle, Young's modulus increased as wt.% of SiC particle increased. And also, we observed cross-sectioned TSV which was filled with 1 wt.% of SiC particle and we confirmed a possibility of SiC composite material as a TSV filling material.