• 공업화학
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• 제17권6호
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• pp.614-618
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• 2006

슁글 중 함유된 아스팔트 성분의 재활용 기술의 개발은 슁글의 처리 비용의 감소와 경제적인 측면에서 매우 중요하다고 할 수 있다. 본 연구에서는 아스팔트 슁글을 도로 포장용 아스콘으로 재활용하기 위한 기초적인 연구를 수행하였다. 이를 위하여 순수한 아스팔트분과 재활용된 아스팔트 혼합물의 열적 특성, 점성 그리고 침입도를 측정하였다. 연구 결과 다음과 같은 몇 가지 결론을 얻을 수 있었다. DSC 분석에 의하면 처리 조건에 관계없이 분리된 슁글의 열적 특성은 유사한 결과를 보였다. 또한 슁글에서 분리된 아스팔트분의 멜팅은 $170^{\circ}C$ 부근에서 발생하였다. 분리된 아스팔트분을 중량비로 1~5% 까지 혼합한 후에 침입도를 측정한 결과 도로 포장용 아스팔트분의 기준에 적합한 것을 확인 할 수 있었다.

• Applied Microscopy
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• 제7권1호
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• pp.45-49
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• 1977

용탕의 온도는 탄소의 비율을 높이기 위하여 $1500^{\circ}C$ 이하로 해야 하며, 주입온도는 $1460^{\circ}C$ 내외가 적당하다. 주조상태에서 소지의 침상석출물은 orthorhombic $(Fe,\;Mn)_3C$로 판명되었다. 냉간압연비는 클수록 결정이 미세화되고 또한 경도도 증가하였다. 표면탈탄이 얼어 나면 표면층에 martensite가 형성되어 성형하기가 어려우므로 argon 분위기를 쓰는 것이 좋았다. 두께 1 mm 판재의 경우 수인처리 온도가 $950^{\circ}C$ 이하일 때 탄화물 stringer 가 나타났고, $1020^{\circ}C$ 에서 30 분간 가열했을 때 탄화물이 의 소지에 고용되었다. C 함량이 클수록 인장강도와 연신률이 증가하였다. Ni, Cr 및 V 을 미량 첨가했을 때 인장강도 및 연신률이 커졌으며 또한 굽힘성도 좋았다.

• 한국전기전자재료학회논문지
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• 제14권8호
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• pp.652-657
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• 2001

Vanadate glasses containing 10~20mol% glass former, P$_2$O$_{5}$ were prepared by melting the batch in platinum crucible and quenching on the copper plate. Li$_2$O-P$_2$O$_{5}$-V$_2$O$_{5}$ glass-ceramics having LiV$_3$O$_{8}$ were obtained by heat-treatment of this glass in crystallization temperature. The glass-ceramics showed singnificantly good capacity and long cycles life according to heating condition. In this paper, we described electrochemical properties during crystallization process and found the best crystallizaton condition of Li$_2$O-P$_2$O$_{5}$-V$_2$O$_{5}$ glass as cathode material. Li$_2$O-P$_2$O$_{5}$-V$_2$O$_{5}$ glass-ceramics heat-treated at 233$^{\circ}C$ for 3 hors showed good rechargeable capacity of 220mAh/g in the cycling range between 2.0 and 3.9V.en 2.0 and 3.9V.

• 대한화학회지
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• 제62권5호
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• pp.352-357
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• 2018

Celecoxib (4-[5-(4-methylphenyl)-3-(trifluoromethyl)-1H-pyrazol-1-yl]benzenesulfonamide) is a cyclooxygenase-2 inhibitor used in the treatment of arthritis, acute pain, and dysmenorrhoea. Celecoxib is a Biopharmaceutics Classification System (BCS) class II compound whose oral bioavailability is highly limited owing to its poor aqueous solubility. Several polymorphs of celecoxib have been identified as Form I, Form II, and Form III with melting points of about $162.8^{\circ}C$, $161.5^{\circ}C$, and $160.8^{\circ}C$, respectively. Form IV was generated from the precipitated suspension in the presence of HPMC (Hydroxypropyl methylcellulose) and Polysorbate 80. A rapid rate of dissolution is useful because the rate of dissolution of a drug typically increases its bioavailability. The aim of this study was to investigate the possibility of production of new crystal form of celecoxib that has higher solubility than Form III. New crystal form of celecoxib (Form A) has been isolated by recrystallization and characterized by differential scanning calorimetry (DSC), thermogravimetric (TG) analysis and powder X-ray diffractometry (PXRD). Form A was dissolved faster than Form III. At 30 minutes, the dissolution of Form A was 97.3%, whereas the dissolution of Form III was 82.2% (p < 0.1). After storage of three months at $20^{\circ}C$, in 24% RH (Relative Humidity), the crystal form was not transformed.

• 한국주조공학회지
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• 제28권6호
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• pp.282-287
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• 2008

The effect of CaO mold on the formation of reaction layer was investigated. CaO mold was prepared by mixing of Colloidal silica($NALCO^{(R)}$ 1130) and an $ZrO_2$, CaO at room temperature. The dried at $20{\pm}3^{\circ}C$, 75% humidity for 12hrs. Sample was prepared from the Cp-Ti(grade-2) and melted by high frequence induction melting system in the vacuum condition. The react ion layer of Ti was confirmed by optical microscopy, microhardness(Hv) and X-ray diffraction. Thickness of reaction layer using the CaO stabilized ZrO2 was thinner than the CaO added ZrO2. And thickness of reaction layer were decreased with decreasing pH of slurry. CaO addition in the slurry could not controlled reaction between molten Ti and investment mold. On the other hand, the CaO chemical bonded ZrO2 by stabilization treatment could controlled reaction between molten Ti and investment mold.

• 한국세라믹학회지
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• 제53권6호
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• pp.682-688
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• 2016

In $TiO_2$-CuO systems, low-temperature sinterability was investigated by a conventional sintering method. Sintering temperatures were set at under $950^{\circ}C$, at which the volume diffusion is inactive. The temperatures are less than the melting point of Ag ($961^{\circ}C$), which is often used as an internal conductor in low-temperature co-fired ceramic technology. To optimize the amount of CuO dopant, various dopant contents were added. The optimum level for enhanced densification was 2 wt% CuO. Excess dopants were segregated to the grain boundaries. The segregated dopants supplied a high diffusion path, by which grain boundary diffusion improved. At lower temperatures in the solid state region, grain boundary diffusion was the principal mass transport mechanism for densification. The enhanced grain boundary diffusion, therefore, improved densification. In this regard, the results of this study prove that the sintering mechanism was the same as that of activated sintering.

• 한국초전도저온공학회:학술대회논문집
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• 한국초전도저온공학회 2003년도 추계학술대회 논문집
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• pp.106-108
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• 2003

We fabricated Ni and Ni-W alloys for use as a substrate in YBCO coated conductor applications and evaluated the effect of W in Ni on texture, microstructure and surface morphology, and hardness of substrate. Pure Ni, Ni-2 at.％W, and Ni-5at.％W alloy substrates were prepared by plasma arc melting, cold rolling, and the recrystallization heat treatment at various temperature (700- 130$0^{\circ}C$). It was observed that Ni-W alloy substrates had stronger cube texture and maintained it at higher annealing temperature, compared to pure Ni substrate : The full-width at half- maximums of in-plane texture was 13.40$^{\circ}$ for Ni substrate and 4.42$^{\circ}$-5.57$^{\circ}$ for Ni-W substrate annealed at 100$0^{\circ}C$. In addition, it was observed that the Ni-W substrate had smaller grain size, shallower boundary depth, and higher hardness, compared to those of pure Ni substrate.

• 한국주조공학회지
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• 제25권6호
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• pp.233-239
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• 2005

Contact material is widely used in the field of electrical parts. Ag-CdO has a good wear resistance and stable contact resistance. We studied a lifetime of Ag-CdO material because of getting better properties of Ag-CdO using Post-oxidation. The experimental procedure were melting using high frequency induction, heat treatment, rolling and internal oxidation. And we experimented on difference process, Post-oxidaion. Then we tested a lifetime and analysed. We obtained the optimizing oxidation temperature was $750^{\circ}C$. Using Pre-oxidation, coarse oxide and depleted oxidation layer existed but finer oxides were existed and depleted oxidation layer was not using Post-oxidation. In Post-oxidation, The density was 10 $g/cm^{3}$, the hardness was Hv 80 and the adhesive strength was 9000N. The specimen of Post-oxidation had better lifetime properties than that of Pre-oxidation. We predicted that the lifetime of Post-oxidation specimen is more longer twice than that of Pre-oxidation one.

• 한국주조공학회지
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• 제20권2호
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• pp.116-121
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• 2000

Interfacial reaction and mechanical properties between Sn-Zn-X ternary alloys(X : 3wt.%In, 4wt.%Bi) and Cu-substrate were studied. Cu/solder joints were subjected to aging treatments for up to 50days to see interfacial reaction at $100^{\circ}C$ and then were examined changes of microstructure and interfacial compound by optical microscopy, SEM and EDS. Cu/solder joints were aged to 30days and then loaded to failure at cross head speed of 0.3 mm $min^{-1}$ to measure tensile strength. According to the results of the solderability test, additions of In and Bi in the Sn-9wt.%Zn solder improve the wetting characteristics of the alloy and lower the melting temperature. Through the EDS and XRD analysis of Cu/Sn-9wt.%Zn solder joint, it was concluded that the intermetallic compound was the ${\gamma}-Cu_5Zn_8$ phase. Cu-Zn intermetallics at Cu/solder interfaces played an important role in both the microstructure evolution and failure of solder joints. Cu/solder joint strength was decreased by aging treatment, and those phenomenon was closely related to the thickening of intermetallic layer at Cu/solder joints.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2005년도 춘계학술대회 논문집
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• pp.321-324
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• 2005

The main purpose of the present study has been placed on investigating the effects of controlled rolling and cooling on the microstructures and mechanical properties of C-Si-Mn-V steels for cold forming. The steels were manufactured in vacuum induction melting(VIM) furnace and casted to 1.1ton Ingots and the ingots were forged to $\Box150$ billet. The forged billets were reheated in walking beam furnace and rolled to coil, the stocks were rolled by Controlled Rolling and Cooling Technology (CRCT), so rolled at low temperature by water spraying applied in rolling stage and acceleratly cooled before coiling. Rolled coils were cold drawed to the degree of $27\%$ of area reduction without heat treatment. Microstructual observation, tensile test, compression test and charpy impact tests were conducted. The mechanical properties of the steels were changed by area reduction of cold drawing and it is founded that there are optimum level of cold drawing to minimize compression stress for these steels. From the result of this study, it is conformed that mechanical properties and microstructure of C-Si-Mn-V steels for cold forming were enhanced by accelerated cooling and founded optimum level of cold drawing.