• Macromolecular Research
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• v.8 no.2
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• pp.66-72
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• 2000

Cis-Polybutadiene (cis-PBD) and the three polyethylenes (PE's) having different branch content were mixed to investigate crystallinity, thermodynamic interaction parameter(c), and diluents effect. Crys-tallinty of PE's decreased with increasing content of amorphous cis-PBD because of a decrease in both the degree of annealing and kinetics of diffusion of the crystallizable polymer content. The thermodynamic interaction parameter(c) for the three blend systems approximately equals to zero near the melting point. These systems were determined to be miscible on a molecular scale near or above the crystalline melting point of the crystalline PE's. From the measurement of T$\sub$m/ vs. T$\sub$c/ behavior, all the three blends showed a straight line for a plot of T$\sub$m/ vs. T$\sub$c/. This result means that the melting behavior of PE is mainly due to a diluent effect of cis-PBD component.

• Journal of Powder Materials
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• v.16 no.6
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• pp.431-437
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• 2009

Various inorganic fillers improve the thermal conductivity and physical properties of organic products. Alumina has been used a representative filler in the heat radiation sheet for the heat radiation of electric device. The high filling rate of alumina increases the thermal conductivity and properties of products. We successfully developed the spherical alumina by flame fusion process using the oxygen burner with LPG fuel. In the high temperature flame (2500$\sim$3000$^{\circ}C$) of oxygen burner, sprayed powders were melting and then rotated by carrier gas. This surface melting and rotation process made spherical alumina. Especially effects of chemical composition and particle size of stating materials on the melting behavior of starting materials in the flame and spheroidization ratio were investigated. As a result, spheroidization ratio of boehmite and aluminum hydroxide with endothermic reaction of dehydration process was lower than that of the sintered alumina without dehydration reaction.

• Transactions on Electrical and Electronic Materials
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• v.16 no.6
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• pp.342-345
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• 2015

The n -type Hf_0.25Zr_0.25Ti_0.5NiSn_0.998Sb_0.002 Half-Heusler (HH) alloy composition was prepared by using the induction melting method in addition to the mechanical grinding, annealing, and spark plasma sintering processes. Analysis of X-ray diffraction (XRD) results indicated the formation of a pure phase HH structured compound. The electrical and thermal properties at temperatures ranging from room temperature to 718 K were investigated. The electrical conductivity increased with increasing temperatures and demonstrated nondegenerate semiconducting behavior, and a large reduction in the thermal conductivity to the value of 2.5 W/mK at room temperature was observed. With the power factor and thermal conductivity, the dimensionless figure of merit was increased with temperature and measured at 0.94 at 718 K for the compound synthesized by the induction melting process.

• Proceedings of the Materials Research Society of Korea Conference
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• 1992.05a
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• pp.16-16
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• 1992

We have studied the effect of platinum addition on the supercon ducting properties of YB $a_2$C $u_3$$O_{7-x}$ (123) compound and elucidated the mechanism of fine dispersion of $Y_2$BaCu $O_{5}$(211) particles in YB $a_2$C $u_3$$O_{7-x}$ superconductor prepared by melting method from the metallurgical point of view. In this study, BaCu $O_2$ and CuO-rich phase unreacted during the peritecitc reaction markedly decreased by the 211 powder addition. The 211 particle of Pt-fee sintered samples exhibited 8~10$\mu$m in size, but in 1wt%Pt-added sample, 211 particles were finely dispersed in 123 matrix and the size of 211 particle was about 1~2$\mu$m. And, the critical temperature( $T_{c. zero}$) of Pt doped samples was 91.5K and the transport critical current density ( $J_{c}$) of Pt-doped samples was much more than 10$^4$A/$\textrm{cm}^2$. The high $J_{c}$ and fine dispersion of 211 particles of Pt doped YB $a_2$C $u_3$$O_{7-x}$ superconductor are attributed to $Ba_4$CuP $t_2$ $O_{8}$ compounds formed during the partial melting, which were considered als nucleation sites of 211 particles, rather than Pt inself.han Pt inself.

• Journal of the Korean Solar Energy Society
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• v.33 no.1
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• pp.73-78
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• 2013

Hexadecane and exfoliated graphite nanoplate (xGnP)composite was prepared as a shape-stabilized phase change material (SSPCM) in a vacuum to develope thermal energy storage. The Hexadecane as an organic phase change material (PCM) is very stable against phase separation of PCM and has a melting point at $18^{\circ}C$ that is under the thermally comfortable temperature range in buildings. The xGnP is a porous carbon nanotube material with high thermal conductivity. Scanning electron microscope (SEM) and Fourier transformation infrared spectrophotometer (FT-IR)were used to confirm the chemical and physical stability of Hexadecane/xGnP SSPCM. In addition, thermal properties were determined by Deferential scanning calorimeter(DSC) and Thermogravimetric analysis (TGA). The specific heat of Hexadecane/xGnPSSPCM was $10.0J/g{\cdot}K$ at $21.8^{\circ}C$. The melting temperature range of melting and freezing were found to be $16-25^{\circ}C$ and $17-12^{\circ}C$. At this time, the laten heats of melting and freezing were 96.4J/g and 94.8J/g. The Hexadecane was impregnated into xGnP as much about 48.8% of Hexadecane/xGnP SSPCM's mass fraction.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.1-10
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• 2022

Recently, semiconductor devices have been used in many fields owing to various applications of mobile electronics, wearable and flexible devices and substrates. During the semiconductor chip bonding process, the mismatch of coefficient of therm al expansion (CTE) between the substrate and the solder, and the excessive heat applied to the entire substrate and components affect the performance and reliability of the device. These problems can cause warpage and deterioration of long-term reliability of the electronic packages. In order to improve these issues, many studies on low-melting temperature solders, which is capable of performing a low-temperature process, have been actively conducted. Among the various low-melting temperature solders, such as Sn-Bi and Sn-In, Sn-58Bi solder is attracting attention as a promising low-temperature solder because of its advantages such as high yield strength, moderate mechanical property, and low cost. However, due to the high brittleness of Bi, improvement of the Sn-Bi solder is needed. In this review paper, recent research trends to improve the mechanical properties of Sn-Bi solder by adding trace elements or particles were introduced and compared.

• Proceedings of the Korean Society of Dyers and Finishers Conference
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• 2010.03a
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• pp.167-168
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• 2010

Non coating type Low melting yarn(L/M PET) not to use the polyurethane resin causing some problems was knitting and evaluated its dyeing characteristics, heat setting properties and flame-retardant properties without flame retardant agent or flame retardant fabric. In order to investigate the dyeing property of fabric of L/M PET, the dyeing of L/M PET was experimented at each different dyeing temperature. Higher exhaustion yield was achieved at lower temperature of L/M PET compared to regular PET. According to result of the study for the heat setting properties of L/M fiber, the K/S value of dyed L/M fiber increased as much as the heat setting temperature did. The experiment for the light fastness reached similar result to dyed PET. However washing fastness in L/M fiber showed lower grade compared with regular PET. flame-retardant efficiency of L/M PET without flame retardant agent or flame retardant fabric measured by $45^{\circ}$ burn test and Contact burn test. The flame?retardant performance of the sample was carried out according to the Korea Fire-fighting Standard.[KOFEIS 1001].

• Resources Recycling
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• v.21 no.5
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• pp.58-64
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• 2012

Ti button type ingots were prepared by recycling of Ti turning scraps using vacuum arc melting process for production of consumable arc electrode. The behavior of impurities such as Fe, W, O, and N in the Ti button ingots was investigated and the properties of the Ti button ingots were also evaluated. In the case of oxygen gaseous impurity, the oxygen layers on the surface of the Ti turning scraps were easily removed by the first vacuum arc melting. On the other hand, the solute oxygen in the Ti turning scraps was not removed by the next melting. In the case of Fe, major impurity in the Ti turning scraps, the removal degree in the final Ti button ingot refined by vacuum arc melting for 20 minutes was approximately 43 %, which is due to the vapor pressure difference between Ti and Fe. As a result, the Ti button ingots with ASTM grade 3 could be obtained by multiple vacuum arc melting from the Ti turning scraps. Therefore, it was confirmed that the preparation of consumable electrode for vacuum arc remelting could be possible by recycling of Ti turning scraps.

• International Journal of Highway Engineering
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• v.5 no.2 s.16
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• pp.1-14
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• 2003

This study is a fundamental research for developing self-deicing function of snow-melting asphalt concrete for roadway pavement. The objective of this study is to develop technology of making self-snow-melting asphalt pavement and evaluate properties of the asphalt concrete containing deicers. Asphalt concrete with deicers and CRM was produced by dry process. The $\alpha$-deicer, CRM and F-deicer were used for sand asphalt mixtures of thin-layer pavement on the existing pavement. The $\alpha$-deicer, $\beta$-deicer, CRM A, CRM B and C were used for 13mm dense-graded mixtures on surface course. Penetration grade of 60-80 asphalt was used for asphalt mixtures. Marshall mix-design, indirect tensile strength, freezing and thawing test, analysis of extracted water were carried out to evaluate performance of self deicing function of asphalt mixtures. The study result showed that snow-melting asphalt mixtures had not only good mechanical characteristics and good snow-melting function, but also chemically safe in environmental point of view.

• Macromolecular Research
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• v.8 no.6
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• pp.261-267
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• 2000

It is well known that poly(cyclohexylene dimethylene terephthalate) (PCT) is used as the engineering plastics with high melting temperature and fast crystallization rate compared with poly(butylene terephthalate)(PBT). However, poor thermal stability of PCT has limited its practical application due to the drastic decrease of molecular weight during the processing temperature. In order to improve the thermal stability of PCT homopolymer, the copolymer of PCT and PBT was synthesized and the thermal properties of the copolymer have been studied. P(CT/BT) copolymer was obtained by condensation polymerization of DMT, CHDM, and 1,4-butanediol. The chemical structure and composition of the copolymer was investigated by FTIR and NMR analysis. The thermal behavior of copolymer was studied using DSC and it was found that the crystallization-melting behavior of the copolymer was observed for the whole composition range. TGA analysis exhibited that P(CT/BT) copolymer is more stable at the initial stage of thermal decomposition compared with PCT and PBT homopolymers.