• Journal of the Korean Vacuum Society
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• v.19 no.4
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• pp.307-313
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• 2010

One-dimensional cubic phase silicon carbide nanowires (${\beta}$-SiC NWs) were efficiently synthesized by thermal chemical vapor deposition (TCVD) with mixtures containing Si powders and nickel chloride hexahydrate $(NiCl_2{\cdot}6H_2O)$ in an alumina boat with a carbon source of methane $(CH_4)$ gas. SEM images are shown that the growth temperature (T) of $1,300^{\circ}C$ is not enough to synthesize the SiC NWs owing to insufficient thermal energy for melting down a Si powder and decomposing the methane gas. However, the SiC NWs could be synthesized at T>$1,300^{\circ}C$ and the most efficient temperature for growth of SiC NWs is T=$1,400^{\circ}C$. The synthesized SiC NWs have the diameter with an average range between 50~150 nm. Raman spectra clearly revealed that the synthesized SiC NWs are forming of a cubic phase (${\beta}$-SiC). Two distinct peaks at 795 and $970 cm^{-1}$ in Raman spectra of the synthesized SiC NWs at T=$1,400^{\circ}C$ represent the TO and LO mode of the bulk ${\beta}$-SiC, respectively. XRD spectra are also supported to the Raman spectra resulting in the strongest (111) peaks at $2{\Theta}=35.7^{\circ}$, which is the (111) plane peak position of 3C-SiC. Moreover, the gas flow rate of 300 sccm for methane is the optimal condition for synthesis of a large amount of ${\beta}$-SiC NW without producing the amorphous carbon structure shown at a high methane flow rate of 800 sccm. TEM images are shown two kinds of the synthesized ${\beta}$-SiC NWs structures. One is shown the defect-free ${\beta}$-SiC NWs with a (111) interplane distance of 0.25 nm, and the other is the stacking-faulted ${\beta}$-SiC NWs. Also, TEM images exhibited that two distinct SiC NWs are uniformly covered with $SiO_2$ layer with a thickness of less 2 nm.

• Journal of Energy Engineering
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• v.17 no.1
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• pp.8-14
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• 2008

The effects of calcium type catalysts addition on the thermal decomposition of low density polyethylene (LDPE) and ethylene vinyl acetate (EVA) resin have been studied in a thermal analyze. (TGA, DSC) and a small batch reactor. The calcium type catalysts tested were calcinated dolomite, lime, and calcinated oyster shell. As the results of TGA experiments, pyrolysis starting temperature for LDPE varied in the range of $330{\sim}360^{\circ}C$ according to heating rate, but EVA resin had the 1st pyrolysis temperature range of $300{\sim}400^{\circ}C$ and the 2nd pyrolysis temperature range of $425{\sim}525^{\circ}C$. The calcinated dolomite enhanced the pyrolysis rate in LDPE pyrolysis reaction, while the calcium type catalysts reduced the pyrolysis rate in EVA pyrolysis reaction. In the DSC experiments, addition of calcium type catalysts reduced the melting point, but did not affect to the heat of fusin. Calcinated dolomite reduced 20% of the heat of pyrolysis reaction. In the batch system experiments, the mixing of calcinated dolomite and lime enhanced the yield of fuel oil, but did not affect to the distribution of carbon numbers.

• Transactions of the Korean hydrogen and new energy society
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• v.16 no.2
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• pp.122-129
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• 2005

The characteristics of hydrogen storage have been investigated in the Ti-Cr-Mo and Ti-Cr-V ternary alloys with bcc structure. The alloys were melted by arc furnace and remelted 4-5 times for homogeneity. The lattice parameters, microstructures and phases of the alloys were examined by SEM, EDX and XRD, and the Pressure-Composition isotherms of the alloys were measured. From these data the relationship of the maximum and effective hydrogen storage capacities vs. chemical composition, lattice parameter and the radius of tetrahedral site were analyzed and discussed. The results showed that all of these alloy, in the range of the this study, had mainly bcc solid solutions with small amount of Ti segregation due to a lower melting point of Ti compared with other elements. Lattice parameters of the alloys were very near to the atomic average values of lattice parameters of the constituent elements. It was also found that maximum hydrogen storage capacities of the Ti-Cr-Mo alloys increased with increasing Ti content and the radius of tetrahedral site but the effective hydrogen storage capacities decreased after showing the maximum. The hydrogen storage capacities of the Ti-Cr-V alloys were almost same even though the V contens were quite different from alloy to alloy and this could be attributed to the almost same Ti/Cr ratio of the alloys. The maximum effective hydrogen storage capacity of the Ti-Cr-Mo alloys was revealed at Ti content of about 40${\sim}$50 at% and radius of tetrahedral site of 0.43${\sim}$0.45 nm. The Ti-Cr-V alloys showed the hydrogen storage capacities of 3.0 wt% and effective hydrogen storage capacities of 1.5 wt%.

• Journal of the Korean Recycled Construction Resources Institute
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• v.7 no.1
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• pp.60-68
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• 2012

In this study, the manufacturing process of micro capsulized PCM (phase changing material) for thermal storage performance of latent heat was investigated to save energy during the use of buildings: i.e. use of melamine-type resin as the micro-capsule material and paraffin wax as the inner material that are together used in concrete walls. For the manufacturing process of the micro-capsulized PCM, the amount of SDS addition as surfactant was the key variable and the resulting thermal storage performance depended on the SDS amount. With increasing amount of SDS, the micro capsulation became much easier while the capsule surface became harder. The micro capsules became uniform at an optimum SDS addition. The addition of SDS also affected the thermal capacity: with increasing SDS amount, the heat storage and release tendency at melting point was more clearly manifested. The current investigation is part of a study under progress to explore the use of PCM in concrete walls to save building maintenance cost and energy.

• Journal of Conservation Science
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• v.27 no.3
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• pp.301-312
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• 2011

Epoxy resin has superior durability and adhesive strength and proper physical strength so that it is used to diversity materials for multi-purposes. However epoxy resin is hardly removed after hardening specially once it is applied to artefacts, it is difficult to remove them under re-conservation. This paper is an experimental study on removing epoxy resin applied to iron objects using Nd:YAG laser cleaning system. Tests conducted in this study investigated how increasing laser energy and pulses would give effect on samples. The samples were prepared in a way that epoxy resin, itself pure and one which was mixed with pigment and they were applied to iron coupons and corroded iron coupons respectively. As a result of experiment, pure epoxy resin applied to corroded iron coupons was ablated at high laser energy but epoxy resin applied to iron coupons and mixing with pigment were not ablated but discolored and bubbled due to laser-induced heat generation. Results of FT-IR showed no component alteration of shifted resins and no residues on the surfaces ablated by laser irradiation. From SEM-EDS for removed surfaces, the debris from epoxy resin and melting iron was observed. Therefore, this study demonstrated the possibilities and limitations for laser cleaning to remove epoxy resin from iron objects.

• Design & Manufacturing
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• v.13 no.4
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• pp.10-16
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• 2019

Semiconductor chip is bonded to the substrate by melting solder bumps. In general, the chip bonding is applied by a Reflow process or a Thermo-Compression(TC) bonding process. In this paper, we introduce a Laser Assisted Thermo-Compression bonding (LATCB) process to improve the anxiety of the existing process(Reflow, TC bonding). In the LATCB process, the chip is bonded to the substrate by irradiating a laser with a uniform energy density in the same area as the chip to melt only the solder bumps and press the chip with a Transparent Compression Module (TCM). The TCM consists of a fused silica header for penetrating the laser and pressurizing the chip, and a piezoelectric actuator (P.A.) coupled to both ends of the header for micro displacement control of the header. In addition, TCM is a structure that can pressurize the chip and deliver it to the chip and solder bumps without losing the energy of the laser. Fused silica, which is brittle, is vulnerable to deformation, so the header may be damaged when an external force is applied for pressurization or a displacement differenced is caused by piezoelectric actuators at both ends. On the other hand, in order to avoid interference between the header and the adjacent chip when pressing the chip using the TCM, the header has a notch at the bottom, and breakage due to stress concentration of the notch is expected. In this study, the thickness and notch length that the header does not break when the external force (500 N) is applied to both ends of the header are optimized using structural analysis and Coulomb-Mohr failure theory. In addition, the maximum displacement difference of the P.A.s at both ends where no break occurred in the header was derived. As a result, the thickness of the header is 11 mm, and the maximum displacement difference between both ends is 8 um.

• Transactions of the Korean hydrogen and new energy society
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• v.9 no.1
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• pp.16-24
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• 1998

Recently Zr-based $AB_2$ type hydrogen absorbing alloy has received much attention as a negative electrode material for the Ni-MH batteries because of its high capacity. In this study $ZrV_{0.1}Mn_{0.7}Ni_{1.2}$ alloy was chosen and the effects of heat treatment and a partial substitution of the Mo in Mn site on the various electrode properties were investigated. The alloys was prepared by arc melting (as-cast sample). Some of them were heat treated at $1,100^{\circ}C$ for 4 hours. After this they were differentiated by the different cooling rates of slow cooling and quenching. Various electrode characteristics such as activation process, high rate dischargeability and self discharge characteristic were investigated with the three types of electrodes. It was found that heat treated alloys resulted in an increase in plateau flatness of P-C isotherms however both discharge capacity and high rate capability were decreased. And the partial substitution of Mo for Mn in $ZrV_{0.1}Mn_{0.7}Ni_{1.2}$ alloy improved the self-discharge characteristic without the loss of discharge capacity (300mAh/g).

• Solar Energy
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• v.11 no.2
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• pp.41-50
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• 1991

Heat transfer phenomena and temperature characteristics in heat storage and release process in the heat storage system using PCM(Phase Change material) were studied experimentally. The melting points of Octacosane paraffin($C_{28}H_{58}$) and sodium pyrophosphate decahydrate ($Na_4P_2O_7{\cdot}10H_2O$) used for phase change materials are $62^{\circ}C$ and $79^{\circ}C$ respectively. Experiments were performed in order to investigate temperature distributions, the heat storage quantity and the release quantity on octacosane paraffin and sodium pyrophosphate decahydrate for heat storage and release in the heat storage system. Furthermore the comparison of these characteristics between paraffin and $Na_4P_2O_7{\cdot}10H_2O$ were evaluated. In case of the paraffin, temperature slowly increased at early heat storage process by natural convection, while temperature of $Na_4P_2O_7{\cdot}10H_2O$ rapidly increased the dominant role played by conduction at early heat storage processing Also, during the heat storage and release process in case of the paraffin, it was observed that the variation of temperature of the neighborhood of wall and center in the top and bottom of the tube exhibited a great difference, however in $Na_4P_2O_7{\cdot}10H_2O$, it was observed that the variation of temperature exhibited a little difference. And heat storage quantity of each PCM of identity mass in heat storage process was shown that $Na_4P_2O_7{\cdot}10H_2O$ exhibited more by 16 percents than paraffin.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.22 no.2
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• pp.73-77
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• 2012

Co-(0.8 wt%) and Ce-(0.4 wt%) doped cubic zirconia ($ZrO_2$ : $Y_2O_3$ = 80 : 20, 70 : 30, 60 : 40, 50 : 50 wt%) single crystals grown by a skull melting method were heat-treated in $N_2$ at $1000^{\circ}C$ for 5 hrs. The orange, yellowish brown and brown colored as-grown single crystals were changed into either brownish red, yellow and green color after the heat treatment. Before and after the heat treatment, the YSZ (yttria-stabilized zirconia) single crystals were cut for wafer form (${\phi}6.5mm{\times}t2mm$). The optical and structural properties were examined by UV-VIS spectrophotometer and X-ray diffraction. Absorption by $Ce^{3+}(^2F_{5/2,7/2}(4f){\rightarrow}^2T_g(5d^1))$, $Co^{2+}(^4A_2(^4F){\rightarrow}^4T_1(^4F)$ or $^4T_1(^4P))$ and $Co^{3+}$, change of ionization energy and lattice parameter were confirmed.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.163-169
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• 2019

Sn-Pb solder alloys in electronics rapidly has been replaced to Pb free solder alloys because of various environmental regulations such as restriction of hazardous substances directive (RoHS), European Union waste electrical, waste electrical and electronic equipment (WEEE), registration evaluation authorization and of chemicals (REACH) etc. Because Sn58%Bi (in wt.%) solder alloy has low melting point and higher mechanical properties than that of Sn-Pb solder, it has been studied to manufacture electronic components. However, the reliability of Sn58%Bi solder could be lowered because of the brittleness of Bi element included in the solder alloy. Therefore, we observed the microstructures of Sn58%Bi composite solders with various contents of Sn-decorated multiwalled carbon nanotube (Sn-MWCNT) particles and evaluated bonding strength of the FR-4 components assembled with Sn58%Bi composite solder. Also, microstructures and bonding strengths of the Sn58%Bi composite solder joints were evaluated with the number of reflows from 1 to 7 times, respectively. Bonding strengths and fracture energies of the Sn58%Bi composite solder joints were measured by die shear test. Microstructures and fracture modes were observed with scanning electron microscope (SEM). Microstructures in the Sn58%Bi composite solder joints were finer than that of only Sn58%Bi solder joint. Bonding strength and fracture energy of Sn58%Bi composite solder including 0.1 wt.% of Sn-decorated MWCNT particles increased up to 20.4% and 15.4% at 5 times in reflow, respectively.