• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Journal of Powder Materials
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• v.24 no.3
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• pp.187-194
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• 2017

Selective laser melting (SLM) can produce a layer of a metal powder and then fabricate a three-dimensional structure by a layer-by-layer method. Each layer consists of several lines of molten metal. Laser parameters and thermal properties of the materials affect the geometric characteristics of the melt pool such as its height, depth, and width. The geometrical characteristics of the melt pool are determined herein by optical microscopy and three-dimensional bulk structures are fabricated to investigate the relationship between them. Powders of the commercially available Fe-based tool steel AISI H13 and Ni-based superalloy Inconel 738LC are used to investigate the effect of material properties. Only the scan speed is controlled to change the laser parameters. The laser power and hatch space are maintained throughout the study. Laser of a higher energy density is seen to melt a wider and deeper range of powder and substrate; however, it does not correspond with the most highly densified three-dimensional structure. H13 shows the highest density at a laser scan speed of 200 mm/s whereas Inconel 738LC shows the highest density at 600 mm/s.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.9 no.5
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• pp.1125-1129
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• 2008

Polypropylene (PP)/corn starch master batch(starch-MB) blends with different PP compositions of 90, 80, 70, and 60 wt% were prepared by melt compounding at $200^{\circ}C$, using lab scale Brabender mixer. The chemical structures, thermal properties and non-isothermal crystallization behavior of the PP/starch-MB blends were investigated by FT-infrared spectrometry (FT-IR), differential scanning calorimetry (DSC), and thermogravimetric analyzer (TGA). The fabrication of the PP/starch-MB blend was confirmed by the existence of hydroxy group in FT-IR spectrum. There was no district change in melting temperature and melting enthalpy, and TGA curve indicates a decrease in degradation temperature with starch-MB content. The non-isothermal crystallization process was analyzed using by Avrami equation. The Avrami exponents were in the range of 2.71-3.97 for PP and 1.48-1.99 for PP/starch-MB blonds. The activation energies calculated by Kissinger method were 233 kJ/mol for PP, 484 kJ/mol for PP90, 541 kJ/mol for PP80, 553 kJ/mol for PP70, and 422 kJ/mol for PP60.

• Analytical Science and Technology
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• v.5 no.3
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• pp.319-325
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• 1992

Plasma are melting method was used in making Mo-1.17 Ti-0.18 Zr-0.06 C ingot having over 99% of the theoretical density. Oxygen content herewith, decreased from the origin of 830ppm to 40ppm. After cold rolling of Mo alloy by 50%, the recrystallization behaviors were studied in the temperature range from $800^{\circ}C$ to $2100^{\circ}C$ for 1 hr isochronical holding time and also at $1400^{\circ}C$, $1500^{\circ}C$, $1600^{\circ}C$ for varying isothermal holding time 0 to 108000sec. The complete recrystallization temperature of Mo was $1400^{\circ}C$ but that of Mo alloy was $1700^{\circ}C$. 50%-1 hr recrystallization temperature of Mo alloy sheet was about $1500^{\circ}C$ and when compared to Mo there was an increase of over $300^{\circ}C$. The activation energy of recrystallization of Mo alloy sheet was 508kJ/mol.

• Transactions of Materials Processing
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• v.19 no.5
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• pp.311-319
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• 2010

Rare earth metal Ce has a relatively low melting point and high specific gravity. Because of its significantly high affinity to oxygen, nitrogen and sulfur, it is highly usable as a steel refining agent. However, because Ce compound has relatively high specific gravity, it is difficult to be separated from molten steel through floatation, and it degrades the purity of molten steel, or may clog the nozzle in continuous casting. Such problem may be solved by using an appropriate deoxidation agent together with Ce and settling molten steel sufficiently after refining. Thus a fundamental study in the formation behavior of non-metallic inclusion in Ce added Hyper Duplex STS melts was investigated. The addition amount of Ce, melt temperature were considered as experimental variables. A main non-metallic inclusion in mother alloy is 51(wt%MnO) - 27.6(wt%SiO$_2$)- 10.9(wt%$Cr_2O_3$). Non-metallic inclusion was dramatically decreased and the particle size was fined as the amount of Ce increased. Moreover (%MnO) and (%SiO$_2$) of non-metallic inclusion were decreased. But (%$Al_2O_3$)were relatively increased. The number of non-metallic inclusion were decreased and the large particle size were increased by increasing the temperature of molten steel.

• Polymer(Korea)
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• v.33 no.2
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• pp.183-188
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• 2009

Structural rearrangements of uni-axially deformed polyethylenes containing 1-octene comonomer and HDPE upon heating were investigated by time-resolved small and wide angle X-ray scattering techniques. During heating, structural changes including crystal transformation and lamellar rearrangement noted were very different depending on the comonomer contents. At low comonomer content below 2 wt%, inverse martensitic transformation of crystal lattice from monoclinic to orthorhombic cell and the rearrangement of broken lamellar units into more ordered and perfect lamellar stacks were noted with the temperature increase. At high contents above 9.5 wt%, however, polyethylene copolymers showed neither the crystal transformation nor lamellar rearrangement that can be attributed to low crystallinity and high content of branch units.

• Journal of Korea Foundry Society
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• v.14 no.6
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• pp.520-529
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• 1994

This study describes the influence of the trace amount of sulphur on the nucleation behavior of graphite crystals in high purity Fe-C-Si alloys prepared by levitation melting method. Detailed microstructural analyses of high purity(HP) and sulphur added(HP＋S) samples showed that the nucleation of graphite crystals was prevented by sulphur. With decreasing the sulphur content, the shape of graphite crystals tended to spherulitic, and below 2ppm S, that of graphite crystals was only nodular. The critical cooling rate for the nucleation of griphite crystals was calculated as $1.5{\times}10^3k/s$. It is obvious from this work that residual C-C clusters act as an effective nucleation site for graphite crystals and one of the important role of nodularizing elements is to act as scavenger which removes harmful impurities from the solution.

• 한국연소학회:학술대회논문집
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• 2014.11a
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• pp.21-24
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• 2014

In the entrained-flow coal gasifier, coal ash turns into a molten slag most of which deposits onto the wall to form liquid and solid layers. Critical viscosity refers to the viscosity at the interface of the two layers. The slag layers play an important role in protecting the wall from physical/chemical attack from the hot syngas and in continuously discharging the ash to the slag tap at the bottom of the gasifier. For coal with high ash melting point and slag viscosity, CaO-based flux is added to coal to lower the viscosity. This study evaulates the effect of critical viscosity temperature and ash/flux ratio on the slag behavior using numerical modelling in a commercial gasifier. The changes in the slag layer thickness, heat transfer rate, surface temperature and velocity profiles were analyzed to understand the underlying mechanism of slag flow and heat transfer.

• Proceedings of the Polymer Society of Korea Conference
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• 2006.10a
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• pp.345-345
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• 2006

It is well known that poly(glutamate)s with long n-alkyl side chains form thermotropic liquid crystalline state by melting of the side-chain crystallites and also poly(glutamate)s such as poly(${\gamma}-benzyl\;L-glutamate$ )(PBLG), poly(${\gamma}-n-alkyl\;L-glutamate$), etc. in solvent form the isotropic, biphasic and liquid crystalline phases which contains cholesteric and columnar liquid crystalline forms depending on the polypeptide concentration. Although there is no diffusion study for PBLG in liquid crystalline state, because it is difficult to observed $^{1}H$ spectrum of PBLG in liquid crystalline state for its very short $^{1}H\;T_{2}$. In this study, the diffusional behavior of rodlike PBLG in concentrated solution is successfully elucidated as studied by the field-gradient $^{1}H$ NMR methods.