• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2002.10b
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• pp.433-434
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• 2002

Chemical mechanical polishing refers to a process by which silicon and partially-processed integrated circuits (IC's) built on silicon substrates are polished to produce planar surfaces for the continued manufacturing of IC's. Chemical mechanical polishing is done by pressing the silicon wafer, face down, onto a rotating platen that is covered by a rough polyurethane pad. During rotation, the pad is flooded with a slurry that contains nanoscale particles. The pad deforms and the roughness of the surface entrains the slurry into the interface. The asperities contact the wafer and the surface is polished in a three-body abrasion process. The contact of the wafer with the 'soft' pad produces a unique elastohydrodynamic situation in which a suction force is imposed at the interface. This added force is non-uniform and can be on the order of the applied pressure on the wafer. We have measured the magnitude and spatial distribution of this suction force. This force will be described within the context of a model of the sliding of hard surfaces on soft substrates.

• Tribology and Lubricants
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• v.37 no.6
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• pp.213-223
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• 2021

Electrochemical mechanical planarization (ECMP) was developed to overcome the shortcomings of conventional chemical mechanical planarization (CMP). Because ECMP technology utilizes electrochemical reactions, it can have a higher efficiency than CMP even under low pressure conditions. Therefore, there is an advantage in that it is possible to reduce dicing and erosions, which are physical defects in semiconductor CMP. This paper summarizes the papers on ECMP published from 2003 to 2021 and analyzes research trends in ECMP technology. First, the material removal mechanisms and the configuration of the ECMP machine are dealt with, and then ECMP research trends are reviewed. For ECMP research trends, electrolyte, processing variables and pads, tribology, modeling, and application studies are investigated. In the past, research on ECMP was focused on basic research for the development of electrolytes, but it has recently developed into research on tribology and process variables and on new processing systems and applications. However, there is still a need to increase the processing efficiency, and to this end, the development of a hybrid ECMP processing method using another energy source is required. In addition, ECMP systems that can respond to the developing metal 3D printing technology must be researched, and ECMP equipment technology using CNC and robot technology must be developed.

• Structural Engineering and Mechanics
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• v.49 no.5
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• pp.645-660
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• 2014

This paper presents the design and project of an innovative concept for a Single Point Incremental Forming (SPIF) Machine. Nowadays, equipment currently available for conducting SPIF result mostly from the adaptation of conventional CNC machine tools that results in a limited range of applications in terms of materials and geometries. There is also a limited market supply of equipment dedicated to Incremental Sheet Forming (ISF), that are costly considering low batches, making it unattractive for industry. Other factors impairing a quicker spread of SPIF are large forming times and poor geometrical accuracy of parts. The following sections will depict the development of a new equipment, designed to overcome some of the limitations of machines currently used, allowing the development of a sounding basis for further studies on the particular features of this process. The equipment here described possesses six-degrees-of freedom for the tool, for the sake of improved flexibility in terms of achievable tool-paths and an extra stiffness provided by a parallel kinematics scheme. A brief state of the art about the existing SPIF machines is provided to support the project's guidelines.

• International Journal of Precision Engineering and Manufacturing
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• v.9 no.2
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• pp.8-10
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• 2008

Chemical mechanical polishing (CMP) is a very precise planarization technique where a wafer is polished by a slurry-coated pad. A slurry is dropped on the rotating pad surface and is supplied between the wafer and the pad. This research aims at reducing the slurry consumption and removing waste particles quickly from the wafer. To study the roles of grooves, slurry flows were simulated using the volume of fluid method (two-phase model for air and slurry) for pads with no grooves, and for pads with circular grooves.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.115-120
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• 2008

In this study, effects of surface roughness on adhesive strength of heat-resistant adhesive RTV88 were examined. Sandblast was used to generate rough surfaces on aluminum adherends, and then tensile-shear tests of Al/RTV88 single lap joints were performed. The shear strength was shown to be affected by the surface roughness. Effective area, peel failure area, and cohesive failure area were introduced to explain the effects of surface roughness on the adhesive strength. An empirical relation for the failure force was proposed based on these parameters and verified by the test results.

• Transactions of Materials Processing
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• v.14 no.6 s.78
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• pp.509-513
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• 2005

This paper is concerned with manufacturing technology of thin foil tensile specimen using CIP(Cold Isostatic Press) and measurement of precision mechanical properties using micro tensile testing. We can get a burr free micro metallic thin foil specimen using this technology. For testing mechanical property of this micro thin foil, we use a nano scale material testing machine that was developed by KITECH. In this paper, micro tensile specimens of nickel and copper thin foil are fabricated with CIP and precision mechanical properties of these materials could be measured. We will expect precision mechanical property of micro/nano material and component.

• Steel and Composite Structures
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• v.35 no.6
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• pp.753-763
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• 2020

In this article, the influence of fuzzified uncertain composite elastic properties on non-linear deformation behaviour of the composite structure is investigated under external mechanical loadings (uniform and sinusoidal distributed loading) including the different end boundaries. In this regard, the composite model has been derived considering the fuzzified elastic properties (through a triangular fuzzy function, α cut) and the large geometrical distortion (Green-Lagrange strain) in the framework of the higher-order mid-plane kinematics. The results are obtained using the fuzzified nonlinear finite element model via in-house developed computer code (MATLAB). Initially, the model accuracy has been established and explored later to show the dominating elastic parameter affect the deflection due to the inclusion of fuzzified properties by solving a set of new numerical examples.

• Journal of Mechanical Science and Technology
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• v.17 no.8
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• pp.1120-1132
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• 2003

A problem of a circular elastic inhomogeneity interacting with a crack under uniform loadings (mechanical tension and heat flux at infinity) is solved. The singular. integral equations for edge and temperature dislocation distribution functions are constructed and solved numeric-ally, to obtain the stress intensity factors. The effects of the material property ratio on the stress intensity factor (SIF) are investigated. The computed SIFs are used to predict the kink angle of the crack when the crack grows.

• Korean Journal of Materials Research
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• v.30 no.12
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• pp.650-654
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• 2020

A combination of Polycarbonate (PC) material and Polymethylmethacrylate (PMMA), fabricated using an injection molding machine, has been investigated to determine its advantages, as studied in Ref. 1). This paper aims to investigate the optimization of PMMA/PC blend for both tensile yield strength and impact strength. Furthermore, interaction effects of process conditions on mechanical properties including tensile yield strength and impact strength of PMMA/PC blend by injection molding process are interpreted in this study. Tensile and impact specimens are designed following ASTM, type V, and are fabricated by injection molding process. The processing conditions such as melt temperature, mold temperature, packing pressure, and cooling time are applied; each factor has three levels. As a result, in comparison with optimization of separated responses, mechanical properties of PMMA/PC are found to decrease when optimizing both tensile and impact strengths simultaneously. The melt temperature is found to be the most significant interaction parameter with the mold temperature and packing pressure. In addition, there is more interaction between the mold temperature and cooling time. This investigation provides a useful understanding of the control of injection molding processing of polymer blends in optical application.

• Elastomers and Composites
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• v.51 no.4
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• pp.275-279
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• 2016

Additive manufacturing or 3D printing is a new manufacturing process and its application is getting growth. However, the product qualities such as mechanical strength, dimensional accuracy, and surface quality are low compared with conventional manufacturing process such as molding and machining. In this study not only mechanical characteristics of polymer sandwich panel having three dimensional core layer but also mechanical characteristics of core layer itself were analyzed. The shape of three dimensional core layer was pyramidal kagome structure. This core layer was fabricated by two different methods, injection molding with PP resin and material jetting type 3D printing with acrylic photo curable resin. The material for face sheets in the polymer sandwich panel was PP. Maximum load, stiffness, and elongation at break were examined for core layers fabricated by two different methods and also assembled polymer sandwich panels. 3D printed core showed brittle behavior, but the brittleness decreased in polymer sandwich panel containing 3D printed core. The availability of 3D printed article for the three dimensional core layer of polymer sandwich panel was verified.