• Title/Summary/Keyword: Mechanical Joining Process

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Design of a Stainless Steel Insert for Mechanical Joining of Long Fiber-reinforced Composite Structures (장섬유강화 복합재료 구조물의 기계적 접합을 위한 스테인레스 강 인서트 설계)

  • Lee, Sung-Woo;Chang, Seung-Hwan
    • Composites Research
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    • v.31 no.4
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    • pp.139-144
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    • 2018
  • Long Fiber-reinforced composites have advantages of excellent production efficiency and formability of complex shapes compared to conventional continuous fiber reinforced composite materials. However, if we need to make complicated composite shapes or to assemble parts made of different materials, a variety of joining methods are needed. In general, long fiber prepreg sheet (LFPS) contains mold release agent to facilitate demolding after thermoforming. Therefore, mechanical fastening is required in addition to the adhesive bonding to get proper joining strength. In this study, we proposed a stainless steel insert for co-cure bonding which cures LFPS and bonds the stainless steel insert through thermoforming process. The wing of the insert which is spread during the thermoforming process induces adhesion and mechanical wedging effect and serves as a hook to resist the pulling force. The burn-out method was used to confirm the unfolded state of the stainless steel insert wings inserted into the composite material. The static pull-out test was performed to quantitatively evaluate the joining strength. From these experimental results, the condition which guarantees the most appropriate joining strength was derived.

Investigations on electron beam weldability of AlZnMgCu0.5 alloys (AlZnMgCu0.5 합금의 Electron Beam 용접성에 관한 연구)

  • 배석천
    • Journal of Welding and Joining
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    • v.15 no.4
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    • pp.166-177
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    • 1997
  • The high strength AlZnMgCu0.5 alloy is a light metal with good age hardenability, and has a high tensile and yielding strength. Therefore, it can be used for structures requiring high speciple strength. Even though high strength AlZnMgCu alloy has good mechanical properties, it has a lot of problems in TIG and MIG welding processes. Since lots of high heat absorption is introduced into the weldment during TIG and MIG processes, the microstructural variation and hot cracks take place in heat affected zone. Therefore, the mechanical properties of high strength AlZnMgCu0.5 alloy can be degraded in weldment and heat affected zone. Welding process utilizing high density heat source such as electron beam should be developed to reduce pore and hot cracking, whichare usually accompanied by MIG and TIG welding processes. In this work, electron beam welding process were used with or without AlMg4.5Mn as filler material to avoid the degradation of mechanical properties. Mechanical and metallurgical characteristics were also studied in electron beam weldment and heat affected zone. Moreover hot cracking mechanism was also investigated.

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Characteristics of manual welding process on carbon steel repair welding using buttering bead (버터링 비드를 이용한 탄소강 보수용접에서 수동 용접 프로세스의 특성)

  • Song, Geun-Ho;Kim, In-Su;Lee, Myeong-Yeol
    • Proceedings of the KWS Conference
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    • 2007.11a
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    • pp.42-44
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    • 2007
  • Methods of repair welding are different to production welding for welding position, welding process, welding power source, heating methods. This study investigated proper the welding process used the welding process SMAW and GTAW in the weldment of inconel filler metals. Mechanical test showed that SMAW and GTAW process had higher mechanical properties than those of material specification. Both SMAW and GTAW welding process can appy the repair welding. In comparison, GTAW welding process had more higher mechanical properties in the weldment.

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Studies on the Improvement of Butt Welding Characteristic of Polyethylene Pipes (PE 이중벽관의 맞대기 융착 용접 강도 향상에 관한 연구)

  • An, Ju-Seon;Lee, Kyng-Won;Kim, Jae-Sung;Lee, Bo-Young
    • Journal of Welding and Joining
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    • v.29 no.1
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    • pp.85-89
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    • 2011
  • Waste water is disposed to sewage disposal plant by underground PE double wall pipes. Various processes have been introduced to join PE pipes, but most of these methods have many disadvantages such as costs, lack of reliability and difficulties in joining, etc. Recently butt welding has been paid much attention to joint PE pipes as this process has many advantages such as cost, safety and reliability. In this study, newly developed heat plate, a patent-pending heat plate with a groove, was used to butt-weld PE double wall pipes with different misalignment gaps to simulate real underground conditions, and the butt welding temperature of PE pipe was determined by thermal analysis (Thermal Gravimetric Analysis, Differential Scanning Calorimetry and Dynamic Mechanical Analysis). The resulting joining characteristics of double wall pipes were compared with those from a conventional heat plate, in terms of stiffness, flattening and leakage tests. The results from the stiffness and flattening test showed that there were no big differences between the butt-welded joints made from these two plates. From the leakage test, although PE pipes welded with a conventional heat plate did leak below the required test conditions (10 min. at 0.75kgf/cm2), the pipes welded with a patent-pending grooved heat plate did not show any leakage even at a pressure 1.5 times higher than the required conditions. It was noted that by utilizing a grooved heat plate more complete fusion at the pipe joints could be obtained, which in turn induced a high quality joints.

Fracture Mode Analysis with ISB Bonding Process Parameter for 3D Packaging (3차원 적층 패키지를 위한 ISB 본딩 공정의 파라미터에 따른 파괴모드 분석에 관한 연구)

  • Lee, Young-Kang;Lee, Jae-Hak;Song, Jun-Yeob;Kim, Hyoung-Joon
    • Journal of Welding and Joining
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    • v.31 no.6
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    • pp.77-83
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    • 2013
  • 3D packaging technology using TSV (Through Silicon Via)has been studied in the recent years to achieve higher performance, lower power consumption and smaller package size because electrical line is shorter electrical resistivity than any other packaging technology. To stack TSV chips vertically, reliable and robust bonding technology is required because mechanical stress and thermal stress cause fracture during the bonding process. Cu pillar/solder ${\mu}$-bump bonding process is usually to interconnect TSV chips vertically although it has weak shape to mechanical stress and thermal stress. In this study, we suggest Insert-Bump (ISB) bonding process newly to stack TSV chips. Through experiments, we tried to find optimal bonding conditions such as bonding temperature and bonding pressure. After ISB bonding, we observed microstructure of bump joint by SEM and then evaluated properties of bump joint by die shear test.

Mathematical Models for Optimal Bead Geometry for GMA Welding Process

  • Park, C.E.;Li, C.S.;Kim, I.S.
    • International Journal of Korean Welding Society
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    • v.3 no.1
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    • pp.8-16
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    • 2003
  • A major concern in Gas Metal Arc (GMA) welding process is the determination of welding process variables such as wire diameter, gas flow rate, welding speed, arc current and welding voltage and their effects on the desired weld bead dimensions and shape. To successfully accomplish this objective, 81 welded samples from mild steel AS 1204 flats adopting the bead-on-plate technique were employed in the experiment. The experimental results were used to develop a mathematical model to predict the magnitude of bead geometry as follows; weld bead width, weld bead height, weld bead penetration depth, weld penetration shape factor, weld reinforcement shape factor, weld bead total area, weld bead penetration area, weld bead reinforcement area, weld bead dilution, length of weld bead penetration boundary and length of weld bead reinforcement boundary, and to establish the relationships between weld process parameters and bead geomery. Multiple regression analysis was employed for investigating and modeling the GMA process and significance test techniques were applied for the interpretation of the experimental data.

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A study on the weldability of TMCP steel plates in underwater wet arc welding (TMCP강의 습식수중 아크 용접성에 관한 고찰)

  • 오세규;김민남
    • Journal of Welding and Joining
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    • v.5 no.4
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    • pp.28-35
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    • 1987
  • The feasibility of underwater wet arc welding process is experimentally investigated by using high titanium oxide type electrodes and TMCP steel plates as base metal. It is assertained the tis process may be put to practical use. Main results are summarized as follows; (1) Sound underwater weld can be obtained by skilled welding operator, if proper welding conditions are selected. (2) In underwater wet arc welding process, the mechanical properties of HAZ are depend upon welding condition and the optimum welding condition can obtained. (3) The maximum hardness in the HAZ of TMCP steel plates is increased significantly in this welding process.

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A Study of Spot Welding Process to Reduce Spatter with the Hollow Tip (팁 선단에 중공이 있는 전극을 이용한 스패터 저감 스폿 용접에 관한 연구)

  • Jun, Jung-Sang;Rhee, Se-Hun
    • Journal of Welding and Joining
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    • v.27 no.4
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    • pp.44-48
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    • 2009
  • In automotive company, a lot of researchers have investigated for the spatterless welding process during last two decades. A spatter influences on the product quality such as strength and surface states. In this paper, a hollow tip is proposed for spatterless process. An optimal size of electrode hole is obtained from a weldability evaluation of each hole diameter. Through the cross section analysis, a phenomenon that molten metal moves in the hole which located between two workpiece is observed, and this makes spatterless welding process even though current is higher. Finally, widely acceptable weld area in lobe curve is obtained by using hollow tip as compare with conventional no hollow tip. In this paper, spatterless resistance spot welding with improvement weldability and productivity is proposed by using hollow tip.

Fabrication of Solder Bump Pattern Using Thin Mold (박판 몰드를 이용한 솔더 범프 패턴의 형성 공정)

  • Nam, Dong-Jin;Lee, Jae-Hak;Yoo, Choong-Don
    • Journal of Welding and Joining
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    • v.25 no.2
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    • pp.76-81
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    • 2007
  • Solder bumps have been used to interconnect the chip and substrate, and the size of the solder bump decreases below $100{\mu}m$ to accommodate higher packaging density. In order to fabricate solder bumps, a mold to chip transfer process is suggested in this work. Since the thin stainless steel mold is not wet by the solder, the molten solder is forced to fill the mold cavities with ultrasonic vibration. The solders within the mold cavities are transferred to the Cu pads on the polyimide film through reflow soldering.