• Title/Summary/Keyword: Material Removal Model

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Finite element study on the effect of abutment length and material on implant bone interface against dynamic loading

  • Mishra, Manish;Ozawa, Shogo;Masuda, Tatsuhiko;Yoshioka, Fumi;Tanaka, Yoshinobu
    • The Journal of Advanced Prosthodontics
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    • v.3 no.3
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    • pp.140-144
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    • 2011
  • PURPOSE. Finite element study on the effect of abutment length and material on implant bone interface against dynamic loading. MATERIALS AND METHODS. Two dimensional finite element models of cylinderical implant, abutments and bone made by titanium or polyoxymethylene were simulated with the aid of Marc/Mentat software. Each model represented bone, implant and titanium or polyoxymethylene abutment. Model 1: Implant with 3 mm titanium abutment, Model 2: Implant with 2 mm polyoxymethylene resilient material abutment, Model 3: Implant with 3 mm polyoxymethylene resilient material abutment and Model 4: Implant with 4 mm polyoxymethylene resilient material abutment. A vertical load of 11 N was applied with a frequency of 2 cycles/sec. The stress distribution pattern and displacement at the junction of cortical bone and implant was recorded. RESULTS. When Model 2, 3 and 4 are compared with Model 1, they showed narrowing of stress distribution pattern in the cortical bone as the height of the polyoxymethylene resilient material abutment increases. Model 2, 3 and 4 showed slightly less but similar displacement when compared to Model 1. CONCLUSION. Within the limitation of this study, we conclude that introduction of different height resilient material abutment with different heights i.e. 2 mm, 3 mm and 4 mm polyoxymethylene, does not bring about significant change in stress distribution pattern and displacement as compared to 3 mm Ti abutment. Clinically, with the application of resilient material abutment there is no significant change in stress distribution around implant-bone interface.

A Statistical Study of CMP Process in Various Scales (CMP 프로세스의 통계적인 다규모 모델링 연구)

  • 석종원
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.27 no.12
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    • pp.2110-2117
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    • 2003
  • A physics-based material removal model in various scales is described and a feature scale simulation for a chemical mechanical polishing (CMP) process is performed in this work. Three different scales are considered in this model, i.e., abrasive particle scale, asperity scale and wafer scale. The abrasive particle and the asperity scales are combined together and then homogenized to result in force balance conditions to be satisfied in the wafer scale using an extended Greenwood-Williamson and Whitehouse-Archard statistical model that takes into consideration the joint distribution of asperity heights and asperity tip radii. The final computation is made to evaluate the material removal rate in wafer scale and a computer simulation is performed for detailed surface profile variations on a representative feature. The results show the dependence of the material removal rate on the joint distribution, applied external pressure, relative velocity, and other operating conditions and design parameters.

Process Modeling of Flexible Robotic Grinding

  • Wang, Jianjun;Sun, Yunquan;Gan, zhongxue;Kazerounian, Kazem
    • 제어로봇시스템학회:학술대회논문집
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    • 2003.10a
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    • pp.700-705
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    • 2003
  • In this paper, an extended process model is proposed for the application of flexible belt grinding equipment as utilized in robotic grinding. The analytical and experimental results corresponding to grinding force, material removal rate (MRR) and contact area in the robotic grinding shows the difference between the conventional grinding and the flexible robotic grinding. The process model representing the relationship between the material removal and the normal force acting at the contact area has been applied to robotic programming and control. The application of the developed model in blade grinding demonstrates the effectiveness of proposed process model.

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Application of hybrid material, modified sericite and pine needle extract, for blue-green algae removal in the lake

  • Choi, Hee-Jeong
    • Environmental Engineering Research
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    • v.23 no.4
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    • pp.364-373
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    • 2018
  • The present study assessed the efficient removal of nutrients and Chlorophyll-a (Chl-a) by using methyl esterified sericite (MES) and pine needle extracts (PNE), a low cost and abundant green hybrid material from nature. For this purpose, the optimal conditions were investigated, such as the pH, temperature, MES and PNE ratio, and MES-PNE dose. In addition, a Microcystis aeruginosa control using MES-PNE was also analyzed with various inhibition models. The removal of the nutrient and Chl-a onto MES-PNE was optimized for over 95% removal as follows: 2-2.5 for the MES-PNE ratio, 7-8 pH and a $22-25^{\circ}C$ temperature. In this respect, approximately 1.52-2.20 g/L of MES-PNE was required to remove each 1 g of dry weight/L of Chl-a. Total phosphorus (TP) has a greater influence on the increase in Chl-a than total nitrogen (TN) according to the correlation between TN, TP and Chl-a. Moreover, the Luong model was the best model for fitting the biodegradation kinetics data from Chl-a on MES-PNE from lake water. The novel hybrid material MES-PNE was very effective at removing TN, TP and Chl-a from the lake and can be applied in the field.

An Analysis on the Material Removal Mechanism of Chemical-Mechanical Polishing Process Part II: Dynamic Simulation (화학-기계적 연마 공정의 물질제거 메커니즘 해석 Part II: 동적 시뮬레이션)

  • Seok, Jong-Won;Oh, Seung-Hee
    • Journal of the Semiconductor & Display Technology
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    • v.6 no.3
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    • pp.1-6
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    • 2007
  • The integrated thermal-chemical-mechanical (TCM) material removal model presented in the companion paper is dynamically simulated in this work. The model is applied to a Cu CMP process for the simulation and the results of the three individual ingredients composing the model are presented separately first. These results are then incorporated to calculate the total material removal rate (MRR) of the Cu CMP. It is shown that the non-linear trend of MRR with respect to the applied mechanical power (i.e., non-Prestonian behavior), which is not well explained with the models established in principle on conventional contact mechanics, may be due to the chemical reaction(s) varying non-linearly with the temperature in the wafer.

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An Analysis on the Material Removal Mechanism of Chemical-Mechanical Polishing Process Part I: Coupled Integrated Material Removal Modeling (화학-기계적 연마 공정의 물질제거 메커니즘 해석 Part I: 연성 통합 모델링)

  • Seok, Jong-Won;Oh, Seung-Hee;Seok, Jong-Hyuk
    • Journal of the Semiconductor & Display Technology
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    • v.6 no.2 s.19
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    • pp.35-40
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    • 2007
  • An integrated material removal model considering thermal, chemical and contact mechanical effects in CMP process is proposed. These effects are highly coupled together in the current modeling effort. The contact mechanics is employed in the model incorporated with the heat transfer and chemical reaction mechanisms. The mechanical abrasion actions happening due to the mechanical contacts between the wafer and abrasive particles in the slurry and between the wafer and pad asperities cause friction and consequently generate heats, which mainly acts as the heat source accelerating chemical reaction(s) between the wafer and slurry chemical(s). The proposed model may be a help in understanding multi-physical interactions in CMP process occurring among the wafer, pad and various consumables such as slurry.

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Study on Within-Wafer Non-uniformity Using Finite Element Method (CMP 공정에서의 웨이퍼 연마 불균일성에 대한 유한요소해석 연구)

  • Yang, Woo Yul;Sung, In-Ha
    • Tribology and Lubricants
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    • v.28 no.6
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    • pp.272-277
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    • 2012
  • Finite element analysis was carried out using wafer-scale and particle-scale models to understand the mechanism of the fast removal rate(edge effect) at wafer edges in the chemical-mechanical polishing process. This is the first to report that a particle-scale model can explain the edge effect well in terms of stress distribution and magnitude. The results also revealed that the mechanism could not be fully understood by using the wafer-scale model, which has been used in many previous studies. The wafer-scale model neither gives the stress magnitude that is sufficient to remove material nor indicates the coincidence between the stress distribution and the removal rate along a wafer surface.

Exceptional removal capacity of clenbuterol from aqueous solution by mechano-synthesized [Cu (INA)2]-MOF via ball-mill

  • Marinah Mohd, Ariffin;Usman, Armaya'u;Saw Hong, Loh;Wan Mohd Afiq Wan Mohd, Khalik;Hanis Mohd, Yusoff
    • Membrane and Water Treatment
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    • v.13 no.6
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    • pp.321-335
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    • 2022
  • Copper-based Metal-organic framework (MOF) namely ([Cu (INA)2]-MOF) is synthesized by ball milling and characterized using scanning electron microscopy (SEM) for the topography, microstructure, and elemental evidence determination, powdered X-ray diffraction (XRD) for the crystallinity measurement, thermogravimetric (TG) analysis was performed to determine the thermal stability of the material, and Fourier transformed infrared (FTIR) spectroscopy for functional groups identification. The use of [Cu (INA)2]-MOF as hazardous removal material of β-agonists as persistent hazardous micro-pollutants in our environmental water is first reported in this study. The removal efficiency of the Cu-MOF is successfully determined to be 97.7% within 40 minutes, and the MOF has established an exceptional removal capacity of 835 mg L-1 with 95 % percent removal on Clenbuterol (CLB) even after the 5th consecutive cycle. The Langmuir model of the adsorption isotherms was shown to be more favourable, while the pseudo-second-order model was found to be favoured in the kinetics. The reaction was exothermic and spontaneous from a thermodynamic standpoint, and the higher temperatures were unfavourable for the adsorption study of the CLB. As a result, the studied MOF have shown promising properties as possible adsorbents for the removal of CLB in wastewater.

Design optimization in hard turning of E19 alloy steel by analysing surface roughness, tool vibration and productivity

  • Azizi, Mohamed Walid;Keblouti, Ouahid;Boulanouar, Lakhdar;Yallese, Mohamed Athmane
    • Structural Engineering and Mechanics
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    • v.73 no.5
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    • pp.501-513
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    • 2020
  • In the present work, the optimization of machining parameters to achieve the desired technological parameters such as surface roughness, tool radial vibration and material removal rate have been carried out using response surface methodology (RSM). The hard turning of EN19 alloy steel with coated carbide (GC3015) cutting tools was studied. The main problem faced in manufacturer of hard and high precision components is the selection of optimum combination of cutting parameters for achieving required quality of surface finish with maximum production rate. This problem can be solved by development of mathematical model and execution of experiments by RSM. A face centred central composite design (FCCD), which comes under the RSM approach, with cutting parameters (cutting speed, feed rate and depth of cut) was used for statistical analysis. A second-order regression model were developed to correlate the cutting parameters with surface roughness, tool vibration and material removal rate. Consequently, numerical and graphical optimization were performed to obtain the most appropriate cutting parameters to produce the lowest surface roughness with minimal tool vibration and maximum material removal rate using desirability function approach. Finally, confirmation experiments were performed to verify the pertinence of the developed mathematical models.

Experimental design approach for ultra-fast nickel removal by novel bio-nanocomposite material

  • Ince, Olcay K.;Aydogdu, Burcu;Alp, Hevidar;Ince, Muharrem
    • Advances in nano research
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    • v.10 no.1
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    • pp.77-90
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    • 2021
  • In the present study, novel chitosan coated magnetic magnetite (Fe3O4) nanoparticles were successfully biosynthesized from mushroom, Agaricus campestris, extract. The obtained bio-nanocomposite material was used to investigate ultra-fast and highly efficient for removal of Ni2+ ions in a fixed-bed column. Chitosan was treated as polyelectrolyte complex with Fe3O4 nanoparticles and a Fungal Bio-Nanocomposite Material (FBNM) was derived. The FBNM was characterized by using X-Ray Diffractometer (XRD), Scanning Electron Microscopy-Energy Dispersive X-Ray Spectroscopy (SEM-EDS), Fourier Transform Infrared spectra (FTIR) and Thermogravimetric Analysis (TGA) techniques and under varied experimental conditions. The influence of some important operating conditions including pH, flow rate and initial Ni2+ concentration on the uptake of Ni2+ solution was also optimized using a synthetic water sample. A Central Composite Design (CCD) combined with Response Surface Modeling (RSM) was carried out to maximize Ni2+ removal using FBNM for adsorption process. A regression model was derived using CCD to predict the responses and analysis of variance (ANOVA) and lack of fit test was used to check model adequacy. It was observed that the quadratic model, which was controlled and proposed, was originated from experimental design data. The FBNM maximum adsorption capacity was determined as 59.8 mg g-1. Finally, developed method was applied to soft drinks to determine Ni2+ levels. Reusability of FBNM was tested, and the adsorption and desorption capacities were not affected after eight cycles. The paper suggests that the FBNM is a promising recyclable nanoadsorbent for the removal of Ni2+ from various soft drinks.