• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part 1
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• pp.47-48
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• 2006

Oridinal thermal spray process has developed into two ways, namely, temperature dominated represented by plasma spraying, and velocity dominated represented by HVOF. It is common for both that the particle materials sprayed are basically in melted or half melted condition. New process has developed recently, that is, Cold Spray and Aerosol Deposition. Particle's heating is limited in CS lower than half of the material's melting point. Moreover, exactly no heating is loaded in AD process. Through the investigation on common feature for these three spraying processes, potential of new material process - Particle Deposition, PD - is considered and proposed.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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• pp.125-126
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• 2005

Recently semiconductor devices are required more smaller scale and more powerful performance. For smaller scale of device, multilayer structure is proposed. And, for the higher performance, interconnection material is change to copper, because copper has high EM(Electro-migration)and low resistivity. Then copper CMP process is a great role in a multilayer formation of semiconductor. Copper process is different from aluminum process. ECP process is one of the copper processes. In this paper, we focused on the defects tendency by copper thickness which filled using ECP process. we observed hump high and dishing. Conclusively, hump hight reduced at copper thickness increased Also dishing reduced.

• 대한기계학회논문집A
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• 제21권9호
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• pp.1400-1413
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• 1997

Semi-solid forging(SSF) process of A356 aluminium alloy has been studied to assess the effect of process variables on the component integrity. Semi-solid material(SSM) was fabricated by mechanical and electro-magnetic stirring process. The fabricated SSM by using mechanical stirring process has been carried out on cooling rate of 0.022.deg. C/sec 0.0094.deg. C/sec and stirring speed n=600, 1000 rpm, respectively. The fabricated SSM by using electro-magnetic stirring process is supplied by Pechiney. The holding time and temperature in the semi-solid state before forging also affects the globular microstructure of alloy. Therefore, the influence of these two parameters is discussed in terms of the microstructure of alloy. The SSF process has been conducted with three different die temperatures($T_{die}$=250.deg. C, 300.deg. C, 350.deg. C) and two kinds of gate types(straight gate and orifice gate). This paper is to investigate the influence of gate shapes of die on filling phenomena in SSF process more deeply. The mechanical properties of forged components were also investigated for variation of process conditions such as die temperature, gate shape and SSM.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.987-992
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• 2005

Manufacturing companies should perform process planning and its evaluation concurrently with new product developments so that they can be highly competitive in the modern market. Process planners should make decisions in the manner of concurrent and collaborative engineering in order to reduce the manufacturing preparation time and cost when developing new products. Automated generation of analysis models from the integrated database, which contains process and material information, reduces time to prepare analyses and makes the models reliable. In this research, we developed a web-based system for concurrent and collaborative system for production flow analysis, using web, database, and simulation technology. An integrated database is designed to automatically generate analysis models from process and material plans without reworking the data. This system enables process planners to evaluate their decision fast and share their opinions with others easily. With this system, it is possible to save time and cost for assembly process and material planning, and reliability of process plans can be improved

• 소성∙가공
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• 제18권7호
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• pp.556-564
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• 2009

Flexible forming process for sheet material using reconfigurable die is introduced based on numerical simulation. In general, this flexible forming process using the reconfigurable die has been utilized for manufacturing of curved thick plates used for hull structures, architectural structures and so on. In this study, numerical simulation of sheet metal forming process is carried out by using flexible dies model instead of conventional matched die set. The numerical simulation and experimental verification for sheet metal forming process using a flexible forming machine that is more suitable for thick plate forming process are carried out to confirm the appropriateness of the simulation process. As an elastic cushion, urethane pads are utilized using hyperelastic material model in the simulation for smoothing the forming surface which is discrete due to characteristics of the flexile die. In the flexible forming process for sheet metal, effect of a blank holder is also investigated according to blank holding methods. Formability in view of occurrence of dimples is compared with regard to the various punch sizes. Consequently, it is confirmed that the flexible forming for sheet material using urethane pad has enough capability and feasibility for manufacturing of smoothly curved surface instead of conventional die forming method.

• 설비공학논문집
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• 제9권3호
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• pp.354-363
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• 1997

The purpose of the present work is to show the best thermal storage material and the sensitivity of the parameters on the thermal performance by experimentally investigating the effects of the parameters on the thermal performance of the spherical capsule system using paraffins superior to the commercial one. The paraffins were n-Tetradecane and the mixture of n-Tetradecane 40% and n-Hexadecane 60%. The experimental parameters were the Reynolds number of 8, 12, and 16 and the inlet temperature of-7, -4, -1, and $2^{\circ}C$. The charging and the discharing time, the dimensionless thermal storage amount, and the averge heat transfer coefficient in the tank were obtained by utilizing the local temperature variation in the tank. The local charging and discharging time in the tank was axially and radially different a lot. The effects of the inlet temperature on the charging and the discharging time were larger during the charging process than during the discharging process, but the effects of the Reynolds number on the charging and the discharging time were in reverse order. The paraffins were better by 11~72% than the water with the inorganic material in the charging time aspect, but no difference in the discharging time aspect. The effects of the Reynolds number on the dimensionless thermal storage amount were smaller than the effects of the inlet temperature during the charging process, but in reverse order during the discharging process within the working range of the experimental parameters. The effects of the inlet temperature and the Reynolds number on the average heat transfer coefficient were larger during the discharging process than during the charging process. The average heat transfer coefficient for the paraffins was larger by 40% maximum than that for the commercial material during the charing and the discharging process.

• 한국결정성장학회지
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• 제14권4호
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• pp.145-150
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• 2004

We have investigated the structural, electrical and optical properties of Al-doped ZnO (AZO) thin films grown on glass substrate by pulsed DC magnetron sputtering as functions of pulse frequency and substrate temperature. A highly c-axis oriented AZO thin film is grown in perpendicular to the substrate when pulse frequency of 30 kHz and substrate temperature of $400^{\circ}C$ was applied. Under this optimized growth condition, the resistivity of AZO thin films exhibited $7.40\times 10^{-4}\Omega \textrm{cm}$. This indicated that the decrease of film resistivity resulted from the improvement of film crystallinity. The optical transmittance spectra of the films showed a very high transmittance of 85∼90 % in the visible wavelength region and exhibited the absorption edge of about 350 nm. The results show the potential application for transparent conductivity oxide (TCO) thin films.

• Transactions on Electrical and Electronic Materials
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• 제14권1호
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• pp.1-8
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• 2013

The present approach shows the use of nano-silica/nano-alumina in polyurethane (PU) matrix, which lead to significant improvements in the mechanical and thermal properties of the nano-composite. It is observed that with incorporation of 1% of nano-alumina into the PU matrix, there is an improvement in the tensile strength of around 50%, and for nano-silica the improvement is around 41%, at the same concentration. The morphological data shows that above 3% of the nano particles there are agglomerations in the nanocomposite. Again with the absorption of moisture, there is a decrease in the thermal and mechanical properties of the PU resin, but in this research work it is observed that with the incorporation of the nano particles, in the presence of absorbed moisture there is an improvement in mechanical and thermal properties of the composite, over that of the PU matrix.

• International Journal of Concrete Structures and Materials
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• 제8권4호
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• pp.309-313
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• 2014

The volume fraction of the coarse aggregate in the conventional plastic concrete is controlled relatively low to ensure a required workability. In this paper, a new type of coarse aggregate interlocking concrete with strength ranging from C30 to C80 was prepared with scattering-filling aggregate process. The strength of concrete prepared with this method increases obviously whereas the shrinkage decreases significantly, the cement dosage in the concrete decreased 20 % at the same time. The microhardness of the ITZ between the cement paste and scattering-filling aggregate is higher than that of the original aggregate, the ITZ become narrower and tighter also. The interlocking and more even distribution of the coarse aggregate and the water absorption of the addition of extra amount of coarse aggregates contribute to the strength and performance improvement of the concrete prepared with scattering-filling aggregate process.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집 Vol.14 No.1
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• pp.558-561
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• 2001

Vanadium oxide ($VO_x$) thin films are very good candidate material for uncooled infrared (IR) detectors due to their high temperature coefficient of resistance (TCR) at room temperature. But, the deposition of $VO_x$ thin films showing good electrical properties is very difficult in micro bolometer fabrication process using sacrificial layer removal because of its low process temperature and thickness of thin films less than $1000{\AA}$. This paper presents a new fabrication process of $VO_x$ thin films having high TCR and low resistance. Through sandwich structure of $VO_{x}(100{\AA})/V(80{\AA})/VO_{x}(500{\AA})$ by sputter method and post-annealing at oxygen ambient, we have achieved high TCR more than $-2%/^{\circ}C$ and low resistance less than $10K\Omega$ at room temperature.