• Title/Summary/Keyword: Material Fringe Constant

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Material Stress Fringe Constant Measurement of Specimen under Pure Bending Load by Use of Photoelastic Phase Shifting Method (광탄성 위상이동법을 이용한 순수굽힘보 시편의 재료 응력 프린지 상수 측정)

  • Liu, Guan Yong;Kim, Myung Soo;Baek, Tae Hyun
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.38 no.12
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    • pp.1387-1394
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    • 2014
  • In a photoelastic experiment, it is necessary to know the material stress fringe constant of the photoelastic specimen to determine the stresses from the measured isochromatic fringe orders. The material stress fringe constant can be obtained using a simple tension specimen and/or a circular disk under diametric compression. In these methods, there is generally a need to apply numerous loads to the specimen in response to the relationship of the fringe order. Then, the least squares method is used to obtain the material constant. In this paper, the fringe orders that appear on a four-point bending specimen are used to determine the fringe constant. This method requires four photoelastic fringes obtained from a circular polariscope by rotating the analyzer to 0, ${\pi}/4$, ${\pi}/2$, and $3{\pi}/4$ radians. Using the four-point bending specimen to determine the material stress fringe constant has an advantage because measurements can be made at different locations by applying a constant load. The stress fringe constant measured with this method is within the range suggested by the manufacturer of the photoelastic material.

The effect of splay elastic constant on the transmittance of fringe-field switching using a liquid crystal with positive dielectric anisotropy (유전율 이방성이 양인 액정을 사용한 FFS 모드에서의 스플레이 탄성상수에 따른 투과율 연구)

  • Kim, Tae-Hyun;Lee, Ji-Youn;Lee, Seung-Hee
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2005.07a
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    • pp.518-519
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    • 2005
  • We have studied the transmittance of fringe-filed switching(FFS) using a liquid crystal with positive dielectric anisotropy. Generally, FFS having positive dielectric anisotropy has less transmittance than FFS using negative dielectric anisotropy. FFS mode transmittance depends on horizontal director deformation, however fringe filed is composed of vertical and horizontal field. Vertical field in the middle of electrode suppresses the transmittance of FFS mode, especially when we use positive one. So, it is important to prevent the LC director from the effect of vertical field. We changed the splay elastic constant and checked the transmittance. The transmittance of FFS having positive dielectric anisotropy was improved. Less tilted LC directors improve the transmittance of FFS using positive dielectric anisotropy. We can improve the transmittance by using LC which have high splay elastic constant when another LC properties are equal.

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Development of Dynamic Photoelastic Experimental Hybrid Method for Propagating Cracks in Orthotropic Material (직교이방성체내의 진전 균열에 대한 동적 광탄성 실험 Hybrid 법 개발)

  • Shin, Dong-Chul;Hawong, Jai-Sug;Sung, Jong-Hyun
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.27 no.8
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    • pp.1273-1280
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    • 2003
  • In this paper, transparent dynamic photoelastic experimental hybrid method for propagating cracks in orthotropic material was developed. Using transparent dynamic photoelastic experimental hybrid method, we can obtain stress intensity factor and separate the stress components from only isochromatic fringe patterns without using isoclinics. When crack is propagated with constant velocity, the contours of stress components in the vicinity of crack tip in orthotropic material are similar to those of isotropic material or orthotropic material with stationary crack under the static load. Dynamic stress intensity factors are decreased as crack growths. It was certified that the dynamic photoelastic experimental hybrid method was very useful for the analysis of the dynamic fracture mechanics.

Dynamic Properties of Tiny Piezoelectric linear Motor by Applied Voltage (인가 전압에 따른 초소형 압전 리니어 모터의 동특성)

  • Yoo, Kyoung-Ho;Ko, Hyun-Phill;Kang, Chong-Yun;Kim, Hyun-Jai;Ko, Tae-Kuk;Yoon, Seok-Jin
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2005.07a
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    • pp.62-63
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    • 2005
  • Recently, a tiny piezoelectric linear motor using a vibration made of the transducer has been invented. The motor consists of a shaft, mobile element, and piezoelectric transducer using a piezoelectric radial mode bimorph disk. The fringe of the bimorph disk is fixed firmly which means this area has no degree of freedom. Therefore, the radial mode of the tranducer transfers to the flexurd mode. The mobile elements move along the shaft by the impact force generated by the flexurd mode of the piezoelectric transducer. The piezoelectric ceramic disks have thickness of 0.1 mm and diameter of 3.5 mm. The elastic disk is introduced between two disks of the ceramic, which has thickness of 0.1 mm and diameter of 3.8 mm. The fringe of the elastic disk is fixed by a brass cylinder which height is 1.2 mm. The Pyrex shaft is used which has diameter of 1 mm and height of 10 mm. The motors are operated at their resonant frequencies. The dynamic properties of the motor have been intensively measured and analyzed according to the applied voltage wave forms at the resonant frequencies. As the sawtooth and rectangular voltage waves are applied, the velocity, the thrust force, and the velocity dependence of the mobile position are measured. The dynamic characteristics are also analyzed within a period of each wave using laser vibrometer. The velocity of the mobile is moderately constant along the shaft. The better dynamic characteristics are obtained in the case of applying the rectangular wave.

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Splay Elastic Constants Dependent Electro-Optic Characteristics of the Fringe Field Switching (FFS) Mode using the Liquid Crystal with Positive Dielectric Anisotropy (양의 액정을 이용한 FFS모드에서 Splay Elastic Constant에 따른 전기-광학적 특성 연구)

  • Jung, Jun-Ho;Park, Ji-Woong;An, Young-Joo;Kim, Mi-Young;Lee, Hee-Kyu;Lee, Seung-Eun;Lee, Seung-Hee
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.469-470
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    • 2008
  • We have studied electro-optic characteristics as a function of splay elastic constants ($K_{11}$) in the fringe-field switching (FFS) mode using the LC with positive dielectric anisotropy. When $K_{11}$ is increased from 7.7pN to 11.7pN, a maximum transmittance is slightly increased and rising time become a little bit fast. However, operating voltage and threshold voltage is independent. In opposition to rising time, decay time is not affected by $K_{11}$. We already know that $K_{11}$ affects tilt angle of liquid crystals. Therefore, on the occasion of high $K_{11}$, liquid crystals are mainly affected by twist deformation because the higher $K_{11}$, the less tilt angle. In the FFS device, high $K_{11}$ is favorable to reduce tilt angle in on state and thus improve rising response time.

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Device and Circuit Performance Issues with Deeply Scaled High-K MOS Transistors

  • Rao, V. Ramgopal;Mohapatra, Nihar R.
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.4 no.1
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    • pp.52-62
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    • 2004
  • In this paper we look at the effect of Fringe-Enhanced-Barrier-lowering (FEBL) for high-K dielectric MOSFETs and the dependence of FEBL on various technological parameters (spacer dielectrics, overlap length, dielectric stack, S/D junction depth and dielectric thickness). We show that FEBL needs to be contained in order to maintain the performance advantage with scaled high-K dielectric MOSFETs. The degradation in high-K dielectric MOSFETs is also identified as due to the additional coupling between the drain-to-source that occurs through the gate insulator, when the gate dielectric constant is significantly higher than the silicon dielectric constant. The technology parameters required to minimize the coupling through the high-K dielectric are identified. It is also shown that gate dielectric stack with a low-K material as bottom layer (very thin $SiO_2$ or oxy-nitride) will be helpful in minimizing FEBL. The circuit performance issues with high-K MOS transistors are also analyzed in this paper. An optimum range of values for the dielectric constant has been identified from the delay and the energy dissipation point of view. The dependence of the optimum K for different technology generations has been discussed. Circuit models for the parasitic capacitances in high-K transistors, by incorporating the fringing effects, have been presented.

Construction and Calibration Test of a Transmission-type Circular Polariscope for Photoelastic Stress Measurement (광탄성 응력측정을 위한 투과형 원형편광기 제작 및 시험)

  • 백태현;김명수
    • Journal of the Korean Society for Precision Engineering
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    • v.21 no.3
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    • pp.38-43
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    • 2004
  • This paper describes the construction of a circular polariscope. Generally, a circular polariscope contains four optical elements and a light source. The first element following the light source is called the linear polarizer. It converts the ordinary light into plane-polarized light. The second element is a quarter wave plate which converts the plane-polarized light into circularly polarized light. Following the quarter wave plate, a specimen made of transparent photoelastic material is located in a loading device. The second quarter wave plate is set and the last element is the analyzer. These polarizing elements, two quarter wave plates and two linear polarizing filters, were purchased from the USA. Frames and other structures for holding polarizing filters were machined and assembled to be rotated. Light box, which includes four incandescent lamps and two sodium-vapor lamps, was made. In order to proof the function of the newly built polariscope, Tardy compensation test was applied to a rectangular shaped specimen made of poly-carbonate material (PSM 1). The error of the fringe constant, which was measured by the newly built polariscope, was within 4.4 percent compared to the standard value of this material. It is possible to make a good quality of polariscope if accurate polarizing filters will be used.

Analysis of Principal Stress Distribution Difference of Tensile Plate with Partial Through-hole (부분 관통 구멍이 있는 인장판의 주응력 분포 차이 해석)

  • Park, Sang Hyun;Kim, Young Chul;Kim, Myung Soo;Baek, Tae Hyun
    • Asia-pacific Journal of Multimedia Services Convergent with Art, Humanities, and Sociology
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    • v.7 no.2
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    • pp.437-444
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    • 2017
  • Stress concentrations around discontinuities, such as a hole in cross section of a structural member, have great importance because the most materials failure around the region may be occurred. Stress on the point applied by concentrated load reaches much larger value than the average stress in structural member. In this paper, stress analysis was performed for the plate with a partial through-hole to find the difference of the principal stress distribution. The difference between maximum principal stress and minimum principal stress in photoelasticity is equal to the value obtained by multiplying the isochromatic fringe order by the fringe constant of the material divided by the distance through which the light passes, that is, the thickness of the specimen. Since the difference of principal stress is proportional to the photoelastic fringe order, the distribution of the principal stress difference by the finite element analysis can be compared with the photoelasticity experimental result. ANSYS Workbench, that is the finite element software, is used to compute the differences of principal stresses at the specific points on the measured lines. The computation values obtained by ANSYS are compared with the experimental measurements by photoelasticity, and two results are comparable to each other. In addition, the stress concentration factor is obtained using the stress distribution analyzed from the variation of hole depth. Stress concentration factor is increasing, as the depth of hole increase.

A Study on the Development of the Dynamic Photoelastic Hybrid Method for Two Dissimilar Isotropic Bi-Materials (두 상이한 등방성 이종재료용 동적 광탄성 하이브리드법 개발에 관한 연구)

  • Sin, Dong-Cheol;Hwang, Jae-Seok;Gwon, O-Seong
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.25 no.3
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    • pp.434-442
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    • 2001
  • When the interfacial crack of two dissimilar isotropic bi-materials is propagated with constant velocity along the interface, stress and displacement components are derived in this research. The dynamic photoelastic experimental hybrid method for bimaterial is introduced. It is assured that stress components and dynamic photoelastic hybrid method developed in this research are valid. Separating method of stress component is introduced from only dynamic photoelastic fringe patterns. Crack propagating velocity of interfacial crack is 80∼85% (in case of aluminum, 24.3∼25.9%) of Rayleigh wave velocity of epoxy resin. The near-field stress components of crack-tip are similar with those of pure isotropic material under static or dynamic loading, but very near-field stress components of crack-tip are different from those.

Development of the Dynamic Photoelastic Hybrid Method for Propagating Interfacial Crack of Isotropic/Orthotropic Bi-materials (등방성/직교이방성 이종재료의 진전 계면균열에 대한 동적 광탄성 실험 하이브리드 법 개발)

  • Hwang, Jae-Seok;Sin, Dong-Cheol;Kim, Tae-Gyu
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.25 no.7
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    • pp.1055-1063
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    • 2001
  • When the interfacial crack of isotropic/orthotropic bi-materials is propagated with constant velocity along the interface, stress and displacement components are derived in this research. The dynamic photoelastic experimental hybrid method for the bimaterial is introduced. It is assured that stress components and dynamic photoelastic hybrid developed in this research are valid. Separating method of stress components is introduced from only dynamic photoelastic fringe patterns. Crack propagating velocity of interfacial crack is 69∼71% of Rayleigh wave velocity of epoxy resin. The near-field stress components of bonded interface of bimaterial are similar with those of pure isotopic material and two dissimilar isotropic bimaterials under static or dynamic loading, but very near-field stress components of bonded interface of bimaterial are different from those.