• Journal of Environmental Health Sciences
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• v.33 no.6
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• pp.506-512
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• 2007

This study was conducted to describe the exposure levels of welding fumes by the type of manufacturers, work process, welding type and the size of manufacturers, and to find out the trend of chronological changes of airborne welding fume levels. The subjects of this study were 509 manufacturers, consisting of 11 types of manufacturers, 3 work processes, 7 welding types, in Busan from January, 1997 to December, 2005. Airborne concentration of welding fume was determined by manual of National Institute for Occupational Safety and Health (NIOSH), and the data were analyzed by using SPSS 10.0 for Windows program. The mean concentration of airborne welding fume in all manufacturers was $1.29\;mg/m^3$ (Range: $0.01{\sim}3.00\;mg/m^3)$. The level of welding fume was the highest, as $1.96\;mg/m^3$, for manufactures of motor vehicles, trailers and semi-trailers, which was lower than $5.0\;mg/m^3$ of 8 hr-TWA in Korean permissible exposure limit for welding fume. There was a significant difference in the mean levels of welding fumes by work process, showing the highest in welding workshop ($1.39\;mg/m^3$), followed by pipeline welding workshop ($1.26\;mg/m^3$) and engineering workshop ($1.20\;mg/m^3$). Among welding types, the mean level of welding fume was the highest in the type of $CO_2$ & arc welding, as $1.46\;mg/m^3$, followed by $CO_2$ welding ($1.40\;mg/m^3$), shielded metal arc welding ($1.31\;mg/m^3$), spot welding ($1.27\;mg/m^3$), and so on. The highest mean level of welding fume was $1.58\;mg/m^3$ in work process of pipe line welding workshop for the manufacturers of basic iron and steel, and $2.27\;mg/m^3$ in the type of arc welding for the manufactures building ship and boats. By the size of manufacturers, the mean concentration of welding fume for manufactures in small scale with less than 50 workers was the highest as $1.45\;mg/m^3$ (Range: $0.07{\sim}3.00\;mg/m^3)$. The mean level of welding fume was the highest as $1.39\;mg/m^3$ both in 1997 and in 2005, showing a trend of fluctuating periodically within a range of $1.10{\sim}1.39\;mg/m^3$. The above results suggested that more effective control program for work environment producing welding fumes should be developed and applied since there were significant variations in welding fume levels by the type of manufacturers, work processes, welding types, the size of manufactures, and by year.

• Journal of Food Hygiene and Safety
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• v.25 no.4
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• pp.333-340
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• 2010

This study was conducted to evaluate the microbial contamination levels in the processing company of Nuroong-ji. Microbial contamination levels were examined for sanitary indication bacteria such as aerobic plate count, coliforms and fungi, and pathogenic bacteria such as Escherchia coli O157:H7, Salmonella spp., Staphylococcus aureus, and Listeria monocytogenes. Contamination levels were detected differently according to handling materials and purposing work-space. The equipments and raw materials were not seriously contaminated but there were necessary to attend the cross-contamination. A high contamination level was detected at the process where the interference of the employees was relatively higher than the other process. Standardization of the roasting process (l20~$170^{\circ}C$, about 10 min) could be necessary to control the microbial organism effectively on Nuroong-ji manufacturing process. At small/medium size foodstuff manufacturers, it is the most important to improve the recognition level of individual hygiene but also expand a hygiene facility.

• Clean Technology
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• v.29 no.4
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• pp.255-261
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• 2023

Power semiconductors are semiconductors used for power conversion, transformation, distribution, and control. Recently, the global demand for high-voltage power semiconductors is increasing across various industrial fields, and optimization research on high-voltage IGBT components is urgently needed in these industries. For high-voltage IGBT development, setting the resistance value of the wafer and optimizing key unit processes are major variables in the electrical characteristics of the finished chip. Furthermore, the securing process and optimization of the technology to support high breakdown voltage is also important. Etching is a process of transferring the pattern of the mask circuit in the photolithography process to the wafer and removing unnecessary parts at the bottom of the photoresist film. Ion implantation is a process of injecting impurities along with thermal diffusion technology into the wafer substrate during the semiconductor manufacturing process. This process helps achieve a certain conductivity. In this study, dry etching and wet etching were controlled during field ring etching, which is an important process for forming a ring structure that supports the 3.3 kV breakdown voltage of IGBT, in order to analyze four conditions and form a stable body junction depth to secure the breakdown voltage. The field ring ion implantation process was optimized based on the TEG design by dividing it into four conditions. The wet etching 1-step method was advantageous in terms of process and work efficiency, and the ring pattern ion implantation conditions showed a doping concentration of 9.0E13 and an energy of 120 keV. The p-ion implantation conditions were optimized at a doping concentration of 6.5E13 and an energy of 80 keV, and the p+ ion implantation conditions were optimized at a doping concentration of 3.0E15 and an energy of 160 keV.

• Journal of Institute of Control, Robotics and Systems
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• v.20 no.2
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• pp.218-222
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• 2014

In this paper, we introduce an autonomous calibration method for a 2D laser displacement sensor (e.g. laser vision sensor and laser range finder) by matching a single point on a flat structure. Many arc welding robots install a 2D laser displacement sensor to expand their application by recognizing their environment (e.g. base metal and seam). In such systems, sensing data should be transformed to the robot's coordinates, and the geometric relation (i.e. rotation and translation) between the robot's coordinates and sensor coordinates should be known for the transformation. Calibration means the inference process of geometric relation between the sensor and robot. Generally, the matching of more than 3 points is required to infer the geometric relation. However, we introduce a novel method to calibrate using only 1 point matching and use a specific flat structure (i.e. circular hole) which enables us to find the geometric relation with a single point matching. We make the rotation component of the calibration results as a constant to use only a single point by moving a robot to a specific pose. The flat structure can be installed easily in a manufacturing site, because the structure does not have a volume (i.e. almost 2D structure). The calibration process is fully autonomous and does not need any manual operation. A robot which installed the sensor moves to the specific pose by sensing features of the circular hole such as length of chord and center position of the chord. We show the precision of the proposed method by performing repetitive experiments in various situations. Furthermore, we applied the result of the proposed method to sensor based seam tracking with a robot, and report the difference of the robot's TCP (Tool Center Point) trajectory. This experiment shows that the proposed method ensures precision.

• Korean Journal of Food Science and Technology
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• v.34 no.5
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• pp.867-872
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• 2002

This study was performed to investigate the optimum process conditions for manufacturing yeast extract from waste brewer's yeast using various enzymes. Contents of IMP, GMP, free amino acids, and crude protein of yeast extracts were measured by enzymes treatment. Crude protein contents of yeast extracts subjected to cell wall digestion enzyme treatment were 21.1, 33.6, and 28.0% for the control grouup, glucanase (0.5%, 12 h), and tunicase (1%, 18 h), respectively. Crude protein contents of yeast extracts subjected to protease treatment were 22.0, 30.8, and 29.8% for control group, bromelin (1%, 3 h), and protamex (1%, 3 h), respectively. Crude protein content of yeast extract subjected to glucanase and protamex mixed treatment was 34.4%. The total contents of IMP and GMP of yeast extracts subjected to G+P+A (glucanase+phosphodiesterase+adenyldeminase) and G+Pro+P+A (glucanase+protamex+phosphodiesterase+adenyldeaminase) treatments were 1,066 and 1,047 mg/100 g, respectively. The content of free amino acids of yeast extract was the highest (2,302 mg/100 g) in G+Pro+P+A treatment. Optimum concentration and process condition of enzyme treatment to obtain yeast extract with high IMP, GMP, and free amino acid content were in the order of glucanase (0.5%, 12 h), protamex (1%, 3h), phosphodiesterase (0.1%, 3 h) and adenyldeaminase (1%, 1.5 h) treatments.

• Korean Journal of Food Science and Technology
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• v.36 no.6
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• pp.1032-1040
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• 2004

Biological, physical, and chemical hazards in raw manufacturing processes of Saengshik, powdered raw grains and vegetables, were analyzed to identify critical control points (CCPs). In raw materials, total plate and coliform counts ranged 2.82-8.23 and $1.40-6.57\;{\log}_{10}\;CFU/g$, respectively. In final products, total plate counts, except for Lactobacillus spp., were $1.51-7.40\;{\log}_{10}\;CFU/g$. During processing steps, both total plate and coliform counts decreased after washing, whereas no changes were observed after freeze-drying. Physical hazards, such as contents of metal and other contaminants, and chemical hazards, such as moisture content, were assessed. Suggested CCPs for Saengshik were: washing process for controlling microbial contamination, freeze-drying process for controlling moisture content to prevent deterioration and growth of microorganisms, and pulverization process for controlling contamination of foreign substances such as metals. These results will provide guideline to apply HACCP system standards to this product.

• Clean Technology
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• v.24 no.2
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• pp.105-111
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• 2018

This study presents a novel and eco-friendly process that can precisely control the location of the patches on the patch particles. The method of manufacturing these anisotropic hexagram patch particles consists of sequential combinations of two separate methods such as a sequential micromolding technique for fabricating patch particles and a selective localization method for controlling the location of patches on the patch particles. The micromolding technique was carried out using physicochemically stable material as a micromold. In order to fabricate the highly stable patch anisotropic hexagram particles, the perfluoropolyether (PFPE) micromold was used to the process of the micromolding technique because they could prevent the problem of diffusion of hydrophobic monomers while conventional poly(dimethylsiloxane) (PDMS) micromold is limited to prevent the problem of diffusion of hydrophobic monomers. Based on combination methods of the micromolding technique and the selective localization method, the reproducibility and stability have been improved to fabricate 12 different types of anisotropic hexagram patch particles. This fabrication method shows the unique advantages in eco-friend condition, easy and fast fabrication due to less number of process, the feasibility of a mass production. We believe that these anisotropic hexagram patch particles can be widely utilized to the field of the directional self-assembly.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.1
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• pp.43-48
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• 2024

The discovery of a two-dimensional electron gas (2DEG) at the interface of LaAlO₃ (LAO) and SrTiO₃ (STO) substrates has sparked significant interest, providing a foundation for cutting-edge research in electronic devices based on complex oxide heterostructures. However, conventional methods for producing LAO thin films, typically employing techniques like pulsed laser deposition (PLD) within physical vapor deposition (PVD), are associated with high costs and challenges in precisely controlling the La and Al composition within LAO. In this study, we adopted a cost-effective alternative approach-solution-based processing-to fabricate LAO thin films and investigated their electrical properties. By adjusting the concentration of the precursor solution, we varied the thickness of LAO films from 2 to 65 nm and determined the sheet resistance and carrier density for each thickness. After vacuum annealing, the sheet resistance of the conductive channel ranged from 0.015 to 0.020 Ω·s^-1, indicating that electron conduction occurs not only at the LAO/STO interface but also into the STO bulk region, consistent with previous studies. These findings demonstrate the successful formation and control of 2DEG through solution-based processing, offering the potential to reduce process costs and broaden the scope of applications in electronic device manufacturing.

• Korea Science and Art Forum
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• v.30
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• pp.251-261
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• 2017

Metal is a material that has exerted a lot of influence on the development of human cultures, and has closely connected with our life from the past to the present. Types of metal we have used from the prehistoric times are varied, and iron relics take the largest percentage of metal relics excavated in our country. The biggest threat to the existence of iron relics ranging from excavated relics to the ones that are transmitted is the process of corrosion, and physical removal has been used the most for removing corroded oxides. For details for removal of corrosion oxides, this thesis aimed to research on the chemical corrosion oxides remover that protects parent material of iron relics but treats corrosion oxides only. For safe and effective removal of corrosion oxides of iron relics, this study was conducted aiming at finding the possibility of and optimized composition for removal of iron relics corrosion oxides by manufacturing new acid, alkaline and neutral oxides removers and changing their composition variously, exploring the possibility by applying the agents to modern relics. The results of this study are as follows: First, the acid solution removed only some part of corrosive substance oxidized on the surface of metal specimen. Second, the application of each of alkaline and neutral solution resulted in remaining black-colored corrosive substance, but it was removed when the quantity of the solution and the duration of application are increased. Third, All the three solutions did not cause any damage to parent material in the course of application, and showed the result that they are capable of removing unstable oxide layer while protecting parent material and stable corrosive layer as the solutions would be able to deal with situation by a relic only through the control of concentration of solution and duration of application.

• Korean Journal of Food Science and Technology
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• v.42 no.4
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• pp.494-501
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• 2010

The purpose of this study was to examine the presence of Bacillus cereus, aerobic bacteria and coliforms in the raw material of infant formulas and investigate the manufacturing process in terms of microbial safety. Among ten kinds of raw infant formula material samples (n=20), Bacillus cereus appeared in two (n=4). Aerobic bacteria were not detected in raw infant formula material or maximum 4.15 log CFU/g. Eleven species of aerobic bacteria were isolated and 76% of them were Sphingomonas paucimobilis, Pseudomonas fluorescens, Rhizobium radiobactor, or Stenotrophomonas maltophilia. A Pearson's correlation analysis revealed that the most influential factors for detecting Bacillus cereus were aerobic bacteria and coliforms. In other words, when the measured values of aerobic bacteria and coliforms were higher, the possibility that Bacillus cereus would appear increased. In a regression model to predict Bacillus cereus, the rate of appearance was correlated with aerobic bacteria and coliforms, and its contribution rate for effectiveness was 86%. Improving microbial quality control by pasteurization, spray dry, popping and extrusion resulted in a decrease in the numbers of Bacillus cereus, aerobic bacteria and coliforms in the raw materials. The results suggest that a hazard analysis and critical control point system might be effective for reducing microbiological contamination.