• Journal of Korean Society of Industrial and Systems Engineering
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• v.46 no.4
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• pp.181-189
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• 2023

In this paper, we present a case study of developing MVIS (Machine Vision Inspection System) designed for exterior quality inspection of stamping dies used in the production of automotive exterior components in a small to medium-sized factory. While the primary processes within the factory, including machining, transportation, and loading, have been automated using PLCs, CNC machines, and robots, the final quality inspection process still relies on manual labor. We implement the MVIS with general-purpose industrial cameras and Python-based open-source libraries and frameworks for rapid and low-cost development. The MVIS can play a major role on improving throughput and lead time of stamping dies. Furthermore, the processed inspection images can be leveraged for future process monitoring and improvement by applying deep learning techniques.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.46 no.4
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• pp.58-63
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• 2009

The appearance inspection of various electronic products and parts was executed by the eyesight of human. The appearance inspection is applied to the most electronic component of LCD Panel, flexible PCB and remote control. If the appearance of electronic products of small and minute size is inspected by the eyesight of human, we can't expect the stable inspection result because inspection result is changed by condition of physical and spirit of the checker. Therefore currently machine vision systems are used to many appearance inspection fields instead of inspection by human. The many problems of inspection by the checker are not occurred in machine vision circumstance. However, the inspection by automatic machine vision system is mainly influenced by illumination of workplace. In this paper, we propose a histogram transform method for improving accuracy of machine visual inspection.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.6
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• pp.2624-2630
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• 2013

In LED chip packaging, die bonding is a very important process which fixes the LED chip on the lead flame to provide enough strength for the next process. During the process, inspection processes are very important to detect exact locations of dispensed epoxy dots and to determine bonding status of dies whether they are lies at exact positions with sufficient bonding strength. In this study, a useful machine vision based inspection system is proposed for the LED die bonder. In the proposed system, 2 cameras are used for epoxy dot position detection and 2 cameras are sued for die attaching status determination. New vision processing algorithm is proposed, and its efficiency is verified through required field experiments. Measured position error is less than $X:-29{\mu}m$, $Y:-32{\mu}m$ and rotation error:$3^{\circ}$ using proposed vision algorithm. It is concluded that the proposed machine vision based inspection system can be successfully implemented on the developed die bonding system.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.2 no.2
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• pp.67-74
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• 2003

This paper presents the development of the Inspection machine for SMD mounted on cream solder of PCB. There are mounting errors of SMD such as misalignment, missing part, wrong orientation, wrong polarity and so on. The main hardware of the system consists of a machine vision part and a motion control part. Operating software has been developed in GUI environment to help user convenience. The Inspection Jobs consist of two procedures, that is, creation of the inspection reference data and automatic inspection. The Inspection reference data has a tree structure of linked list including PCB information, blocks, components, windows, and inspection methods. This paper presents versatile inspection methods which include a section length method, a projection method and histogram method. Therefore, user can choose the suitable procedure for various components. Finally, the automatic Inspection procedure using the reference data checks the mounting errors of components.

• Journal of Institute of Control, Robotics and Systems
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• v.20 no.7
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• pp.741-749
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• 2014

This paper proposes a machine vision module for PLCs (Programmable Logic Controllers). PLC is the industrial controller most widely used in factory automation system. However most of the machine vision systems are based on PC (Personal Computer). The machine vision system embedded in PLC is required to reduce the cost and improve the convenience of implementation. In this paper, we newly propose a machine vision module based on PLC. The image processing libraries are implemented and integrated with the PLC programming tool. In order to interface the libraries with ladder programming, the ladder instruction set was also designed for each vision library. By use of the developed system, PLC users can implement vision systems easily by ladder programming. The developed system was applied to sample inspection system to verify the performance. The experimental results show that the proposed system can reduce the cost of installing as well as increase the ease-of-implementation.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.34 no.5
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• pp.371-381
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• 2021

A machine vision inspection system consists of a camera, optics, illumination, and image acquisition system. Especially a scanning system has to be made to measure a large inspection area. Therefore, a machine vision line scan camera needs a line scan light source. A line scan light source should have a high light intensity and a uniform intensity distribution. In this paper, an offset calibration and slope calibration methods are introduced to obtain a uniform light intensity profile. Offset calibration method is to remove the deviation of light intensity among channels through adding intensity difference. Slope calibration is to remove variation of light intensity slope according to the control step among channels through multiplying slope difference. We can obtain an improved light intensity profile through applying offset and slope calibration simultaneously. The proposed method can help to obtain clearer image with a high precision in a machine vision inspection system.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2019.05a
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• pp.211-213
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• 2019

This paper proposes an image detection method, which can detect images regardless of the location and the direction of an image, required for automatic inspection based on machine vision technologies. A cable harness is considered in this paper as an inspection object, and implementation results of a technology of being applicable to a real cable harness production process is presented.

• Journal of Practical Engineering Education
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• v.6 no.1
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• pp.37-42
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• 2014

The automated visual inspection system (machine vision system) for quality assurance is important factory automation equipment in the manufacturing industries, such as display, semiconductor, etc. There is a lot of demand for the machine vision engineers. However, there are no technical training courses for machine vision technologies in vocational schools, colleges and universities. In this paper, we present the implementation of line scan camera based equipment for technical training of the automated visual inspection system. The training system consists of the X-Y stage which is widely used in machine vision industries and its variable image resolution are set to $10-30{\mu}m$. Additionally, this training system can attach the industrial illumination, either the direct illuminator or coaxial illuminator, for verifying the effect of illuminations. This means that the trainee can have a practical training in various equipment conditions and the training system is similar to the automated visual inspection system in industries.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.10a
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• pp.309-310
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• 2006

• Journal of the Korean Society for Precision Engineering
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• v.20 no.12
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• pp.105-114
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• 2003

In this study, a dicing machine with vision system was built and an algorithm for automatic alignment was developed for dual camera system. The system had a macro and a micro inspection tool. The algorithm was formulated from geometric relations. When a wafer was put on the cutting stage within certain range, it was inspected by vision system and compared with a standard pattern. The difference between the patterns was analyzed and evaluated. Then, the stage was moved by x, y, $\theta$ axes to compensate these differences. The amount of compensation was calculated from the result of the vision inspection through the automatic alignment algorithm. The stage was moved to the compensated position and was inspected by vision for checking its result again. Accuracy and validity of the algorithm was discussed from these data.