• Korean Journal of Materials Research
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• v.9 no.4
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• pp.368-372
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• 1999

The suggested electrode structure of MOCVD-Pt/sputtered-Ru/polysilicon has an excellent adhesion with increasing annealing temperatures and shows a stable electrode structure up to $600^{\circ}C$. However, the ruthenium used for barrier layer increased the roughness of platinum bottom electrodes because ruthenium diffused through the Pt bottom electrode and reacted with oxygen during the annealing above $700^{\circ}C$. The surface roughness increased the resistivity of Pt bottom electrodes. The resistivity of samples annealed at $600^{\circ}C$ was about $13\mu$Ω.cm. The electrode structure was possible to apply for ferroelectric thin film integration of semiconductor memory devices.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.10
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• pp.864-868
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• 2007

Effect of high-temperature annealing on morphology of fully coherent self-assembled InAs quantum dots' grown on Si (100) substrates at $450^{\circ}C$ by atmospheric pressure metalorganic chemical vapor deposition(APMOCVD) was investigated by atomic force microscopy(AFM). When the dots were annealed at 500 - 600$^{\circ}C$ for 15 sec - 60 min, there was no appreciable change in the dot density but the heights of the dots increased along with the reduction in the diameters. In segregation from the InAs quantum dots and/or from the 2-dimensional InAs wetting layer which was not transformed into quantum dots looked responsible for this change in the dot size. However the change rates remained almost same regardless of annealing time and temperature, which may indicate that the morphological change due to thermal annealing is done instantly when the dots are exposed to high temperature annealing.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.12
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• pp.1027-1031
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• 2001

A new constant growth technique to conserve an initial grating height of V-groove AlGaAs/InGaAs quantum nanostructures above 1.0 $\mu\textrm{m}$ thickness has been successfully embodied on submicron gratings using low pressure metalorganic chemical vapor deposition. A GaAs buffer prior to an AlGaAs barrier layer on submicron gratings plays an important role in overcoming mass transport effects and improving the uniformity of gratings. Transmission electron microscopy (TEM) image shows that high-density V-groove InGaAs quantum wires (QWRs) are well confined at the bottom of gratings. The photoluminescence (PL) peak of the InGaAs QWRs is observed in the temperature range from 10 to 280 K with a relatively narrow full width at half maximum less than 40 meV at room temperature PL. The constant growth technique is an important step to realize complex optoelectronic devices such as one-step grown distributed feedback lasers and two-dimensional photonic crystal.

• Journal of the Korean Vacuum Society
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• v.12 no.2
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• pp.118-122
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• 2003

Using low pressure metalorganic chemical vapor deposition (MOCVD), we have developed selectively area epitaxy (SAE). Using the developed SAE technology, we have grown AlGaAs/GaAs multi layers and InGaAs/GaAs quantum wire structures on the selectively $SiO_2$ masked GaAs substrates. We have obtained triangular shaped AlGaAs/GaAs and InGaAs/GaAs structures with sharp tips and smooth sidewalls. To rod the optimum conditions, several growth parameters such as growth rate, V/III ratio, growth temperature, and direction of the opening stripes were investigated. The emission peak from quantum wires was observed at 975 nm. With increasing of temperature the emission intensity from side wall quantum wells decreased abruptly. But the intensity from Quantum wires decreased slowly compared to that of side wall quantum wells and it became even stronger from above 50 K.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.229-229
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• 2010

We report a high crystalline nonpolar a-plane (11-20) GaN on r-plane (1-102) sapphire substrates with $+0.15^{\circ}$, $-0.15^{\circ}$, $+0.2^{\circ}$, $-0.2^{\circ}$ and $+0.4^{\circ}$ misoriented by metalorganic chemical-vapor deposition (MOCVD). The multi-quantum wells (MQWs) active region is consists of 5 periods the nonpolar a-plane InGaN/GaN (a-InGaN/GaN) on a high quality a-plane GaN (a-GaN) template grown by using the multibuffer layer technique. The full widths at half maximum (FWHMs) of x-ray rocking curve (XRC) obtained from phiscan of the specimen that was grown up to nonpolar a-plane GaN layers with double crystal x-ray diffraction. The FWHM values of $+0.4^{\circ}$ misoriented sapphire substrate were decreased down to 426 arc sec for $0^{\circ}$ and 531 arc sec for $-90^{\circ}$, respectively. Also, the samples were characterized by photoluminescence (PL).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.59-59
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• 2007

최근 GaN계 LED를 대체할 만한 물질로 주목받고 있는 ZnO는 단결정 박막성장의 어려움, 동일접합 LED 소자구현을 위한 p-ZnO 성장의 어려움 3원계 합금제작의 어려움 등으로 소자제작에 있어 고전을 하고 있다. 특히 이러한 문제점을 극복하고자 하는 방안으로 양자 제한 효과, 탁월한 결정성, self-assembly, internal stress 등의 새로운 기능성을 지닌 ZnO 나노구조가 제시되었다. 하지만 나노구조를 이용한 다이오드 제작에서도 금속전극의 접합이라는 문제의 벽에 가로막혀 있다. 본 실험에서는 자체 개발된 MOCVD 장비를 이용한 일차원 ZnO 나노선을 성장한 이후 연속적으로 박막을 성장하여 금속전극의 접합을 시도하였다. 이종접합구조 뿐만 아니라 일차원 및 이차원 구조의 복합구조는 일반 다결정 박막보다 결정성에서 우수한 특성을 보였으며, 다이오드 제작시에 높은 효율을 보였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.150-153
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• 2004

본 논문에서는 780 nm 고출력 레이저 다이오드의 신뢰성을 향상시키기 위하여 DLTS(deep level transient spectroscopy)을 이용하여 MOCVD(metalorganic chemical vapor deposition) 성장 조건 변화에 따른 $Al_{0.48}Ga_{0.52}As$와 $Al_{0.1}Ga_{0.9}As$ 물질에서의 깊은준위(deep level)의 거동을 조사하였다. DLTS 측정결과, MOCVD로 성장된 막에서만 나타나는 결함(defect)으로 추정되는 trap A(0.3 eV), DX center로 알려진 trap B, 갈륨(Ga) vacancy와 산소(O2) 원자의 복합체(complex)에 의한 결함인 trap D(0.6 eV) 및 EL2 라고 불리우는 trap E(0.9 eV)의 네 가지 깊은준위들이 관측되었고, 성장 조건의 변화에 따라 깊은 준위들의 농도가 감소하는 것을 관측함으로써 최적 성장 조건을 찾을 수 있었다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.21-21
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• 2006

21세기 정보통신 및 관련 소재의 연구방향은 새로운 기능성 확보, 극한적 제어성, 복합 및 융합이라는 경향으로 발전해 가고 있다. 반도체 기술 분야에서 현재의 공정적 한계를 극복하고 새로운 기능성을 부여하기 위해 나노 합성과 배열을 기본으로 하여 bottom-up 방식의 나노소자 구현이 큰 주목을 받고 있다. 나노선의 경우 나노 스케일의 dimension, 양자 제한 효과, 우수한 결정성, self-assembly, internal stress 등 기존 벌크형 소재에서 발견할 수 없는 새로운 기능성이 나타나고 있어 바이오, 에너지, 구조, 전자, 센서 등의 분야에서의 활용이 가능하다. 현재 국내외적으로 반도체 나노선으로 널리 연구되고 있는 재료는 ZnO, $SnO_2$, SiC 등이 중심이 되고 있다. 이중 ZnO 나 노선의 합성을 위해서는 thermal CVD, MOCVD, PLD, wet-chemical 등 다양한 방법이 사용되고 있다. 특히 MOCVD 방법에 의해 수직 정렬된 ZnO 나노막대를 성장할 수 있다. 이러한 나노막대는 MO 원료 및 산소 공급량을 적절히 제어함으로서 수직 배향 및 나노선의 구경 제어가 가능하며, 나노 막대의 크기 제어와 관련해서는 반응 관내의 DEZn 와 $O_2$의 양을 변화시켜 구조체의 크기를 수 십 ~ 수 백 나노미터의 크기로 제어할 수 있다. 본 연구는 이러한 ZnO 나노선의 성장과정에서 $210^{\circ}C$ 이하의 저온에서 성장한 ZnO 버퍼층을 이용해 나노구조의 형상을 제어하고자 하였다. 특히 ZnO 저온 버퍼층의 두께에 따라 나노막대의 직경변화, 수직배향성, 형상변화의 제어가 가능하였다. 나노막대의 특성 평가는 TEM, SEM, PL, XRD 등을 이용하여 구조적, 결정학적, 광학적 특성을 분석하였다.

• Journal of the Semiconductor & Display Technology
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• v.4 no.1 s.10
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• pp.43-48
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• 2005

Metaloganic chemical vapor deposition, also known as metalorganic vapor phase epitaxy has become one of the main techniques for growing thin, high purity films for compound semiconductors such as GaAs, InP, and InGaAsP. In this study, the distribution of growth rate and composition of InGaAsP, InGaP, and InGaAs films are studied using computational method. The influences of process parameters such as pressure, temperature and precursors' partial pressure on the growth rate and composition distributions are analyzed. The film growth rate is increased in the upstream part according to the increase of temperature but not in the downstream part. The Ga composition in InGaAsP film shows an asymptotic behavior for temperature variation but As composition varies significantly within the temperature range considered in the present study. The overall film growth rates of InGaP, InGaAs and InGaAsP are decreased with increasing the Ga/In ratios of the source gases. Pressure variation does not seem to be a significant parameter to the film growth. Film growth characteristics of tertiary films such as InGaP and InGaAs show similar trends to the quaternary film, InGaAsP.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.215-215
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• 2010

The feasibility of InSbTe (IST) chalcogenide materials prepared by metalorganic chemical vapor deposition (MOCVD) for phase-change memory (PRAM) applications was demonstrated. Films grown below $225^{\circ}C$ exhibited an amorphous structure, and the films grown at $300^{\circ}C$ Cincluded various crystalline phases such as In-Sb-Te, In-Sb, In-Te, and Sb-Te. The composition of the amorphous films grown at $225^{\circ}C$ was dependent on the working pressure. Films grown at $225^{\circ}C$ exhibited a smooth morphology with a root mean square(rms) roughness of less than 1nm, and the step-coverage of the films grown on a trench structure with an aspect ratio of 5:1 was greater than 90%. An increase in deposition time increased the filling rate, while retaining the conformal step-coverage. Films grown at $225^{\circ}C$ for 3h in a working pressure of $13{\times}10^2$ Pa exhibited a reproducible and complete filling in a trench structure.