• Title/Summary/Keyword: MICRO-VOID

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Porosity and pore size distribution in high-viscosity and conventional glass ionomer cements: a micro-computed tomography study

  • Aline Borburema Neves ;Laisa Inara Gracindo Lopes;Tamiris Gomes Bergstrom;Aline Saddock Sa da Silva ;Ricardo Tadeu Lopes ;Aline de Almeida Neves
    • Restorative Dentistry and Endodontics
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    • v.46 no.4
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    • pp.57.1-57.9
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    • 2021
  • Objectives: This study aimed to compare and evaluate the porosity and pore size distribution of high-viscosity glass ionomer cements (HVGICs) and conventional glass ionomer cements (GICs) using micro-computed tomography (micro-CT). Materials and Methods: Forty cylindrical specimens (n = 10) were produced in standardized molds using HVGICs and conventional GICs (Ketac Molar Easymix, Vitro Molar, MaxxionR, and Riva Self-Cure). The specimens were prepared according to ISO 9917-1 standards, scanned in a high-energy micro-CT device, and reconstructed using specific parameters. After reconstruction, segmentation procedures, and image analysis, total porosity and pore size distribution were obtained for specimens in each group. After checking the normality of the data distribution, the Kruskal-Wallis test followed by the Student-Newman-Keuls test was used to detect differences in porosity among the experimental groups with a 5% significance level. Results: Ketac Molar Easymix showed statistically significantly lower total porosity (0.15%) than MaxxionR (0.62%), Riva (0.42%), and Vitro Molar (0.57%). The pore size in all experimental cements was within the small-size range (< 0.01 mm3), but Vitro Molar showed statistically significantly more pores/defects with a larger size (> 0.01 mm3). Conclusions: Major differences in porosity and pore size were identified among the evaluated GICs. Among these, the Ketac Molar Easymix HVGIC showed the lowest porosity and void size.

How do imaging protocols affect the assessment of root-end fillings?

  • Fernanda Ferrari Esteves Torres;Reinhilde Jacobs;Mostafa EzEldeen;Karla de Faria-Vasconcelos;Juliane Maria Guerreiro-Tanomaru;Bernardo Camargo dos Santos;Mario Tanomaru-Filho
    • Restorative Dentistry and Endodontics
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    • v.47 no.1
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    • pp.2.1-2.11
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    • 2022
  • Objectives: This study investigated the impact of micro-computed tomography (micro-CT)-based voxel size on the analysis of material/dentin interface voids and thickness of different endodontic cements. Materials and Methods: Following root-end resection and apical preparation, maxillary premolars were filled with mineral trioxide aggregate (MTA), Biodentine, and intermediate restorative material (IRM) (n = 24). The samples were scanned using micro-CT (SkyScan 1272; Bruker) and the cement/dentin interface and thickness of materials were evaluated at voxel sizes of 5, 10, and 20 ㎛. Analysis of variance and the Tukey test were conducted, and the degree of agreement between different voxel sizes was evaluated using the Bland and Altman method (p < 0.05). Results: All materials showed an increase in thickness from 5 to 10 and 20 ㎛ (p < 0.05). When evaluating the interface voids, materials were similar at 5 ㎛ (p > 0.05), while at 10 and 20 ㎛ Biodentine showed the lowest percentage of voids (p < 0.05). A decrease in the interface voids was observed for MTA and IRM at 20 ㎛, while Biodentine showed differences among all voxel sizes (p < 0.05). The Bland-Altman plots for comparisons among voxel sizes showed the largest deviations when comparing images between 5 and 20 ㎛. Conclusions: Voxel size had an impact on the micro-CT evaluation of thickness and interface voids of endodontic materials. All cements exhibited an increase in thickness and a decrease in the void percentage as the voxel size increased, especially when evaluating images at 20 ㎛.

Variations of Micro-Structures and Mechanical Properties of Ti/STS321L Joint Using Brazing Method (브레이징을 이용한 Ti/STS321L 접합체의 미세조직과 기계적 특성의 변화)

  • 구자명;정우주;한범석;권상철;정승부
    • Journal of Welding and Joining
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    • v.20 no.6
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    • pp.106-106
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    • 2002
  • This study investigated variations of micro-structures and mechanical properties of Ti / STS321L joint with various bonding temperature and time using brazing method. According to increasing bonding temperature and time, it was observed that the thickness of their reaction layer increased due So increasing diffusion rate and time. From the EPMA results, Ti diffused to the STS321L substrate according to increasing bending time to 30min. Hardness of bonded interface increased with increasing bonding temperature and time due to increasing their oxides and intermetallic compounds. XRD data indicated that Ag, Ag-Ti intermetallic compounds, TiAg and Ti₃Ag and titanium oxide, TiO₂were formed in interface. In tensile test, it was found that the tensile strength had a maximum value at the bonding temperature of 900℃ and time of 5min, and tensile strength decreased over bonding time of 5min. The critical thickness of intermetallic compounds was observed to about 30㎛, because of brittleness from their excessive intermetallic compounds and titanium oxide, and weakness from void.

Variations of Micro-Structures and Mechanical Properties of Ti/STS321L Joint Using Brazing Method (브레이징을 이용한 Ti/STS321L 접합체의 미세조직과 기계적 특성의 변화)

  • 구자명;정우주;한범석;권상철;정승부
    • Journal of Welding and Joining
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    • v.20 no.6
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    • pp.830-837
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    • 2002
  • This study investigated variations of micro-structures and mechanical properties of Ti / STS321L joint with various bonding temperature and time using brazing method. According to increasing bonding temperature and time, it was observed that the thickness of their reaction layer increased due So increasing diffusion rate and time. From the EPMA results, Ti diffused to the STS321L substrate according to increasing bending time to 30min. Hardness of bonded interface increased with increasing bonding temperature and time due to increasing their oxides and intermetallic compounds. XRD data indicated that Ag, Ag-Ti intermetallic compounds, TiAg and $Ti_3Ag$ and titanium oxide, $TiO_2$ were formed in interface. In tensile test, it was found that the tensile strength had a maximum value at the bonding temperature of $900^{\circ}C$ and time of 5min, and tensile strength decreased over bonding time of 5min. The critical thickness of intermetallic compounds was observed to about $30\mu\textrm{m}$, because of brittleness from their excessive intermetallic compounds and titanium oxide, and weakness from void.

An Evaluation of the Fracture Behavior for Flash Butt Welding zone by Acoustic Emission Method (AE방법에 의한 Flash Butt 용접부의 파괴거동 평가)

  • 김용수;이하성;강동명
    • Journal of the Korean Society of Safety
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    • v.9 no.1
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    • pp.9-18
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    • 1994
  • In this study, we conducted experimental tests to evaluate fracture behaviors of fresh-butt welded metal by Acoustic Emission technique. We selected similar welding and dissimilar welding process, the one welded for SM45C, SS41 and SUS304 of each material, the other for SM45C and SS41, SM45C and SUS304 and SS41 and SUS304. The fracturing processes of weld metal were estimatied through the fracture toughness test with compact tension specimens and fractography analysis. In ASTM test method E-399, type I curves for materials of this study were obtained by load-cod diagram of fracture toughness test. and 5% offset load( $P_{5}$) was estimated as the estimated crack initial load( $P_{Q}$), The estimated crack initial load( $P_{Q}$) of similar welding materials generally lower than base matal, and then SM45C appeared greatly in decreasing rate of PB, SS41 and SUS304 appeared in order. $P_{Q}$ of dissimilar welding materials were lower than the similar welding materials. $P_{Q}$ of welding of SM45C and SS41 appeared in small, SUS304 and SS41 appeared greatly in dissimilar welding materials. In fracture toughness test, AE counts increased before the inflection point of the slope, decreased after that. It was found that increasing of AE counts were due to the microcrack formation at the crack tip near the $P_{5}$ point through AE data. For welding materials in this study, both low and high AE amplitude appeared simulataneously. It was confirmed that the low AE amplotude was due to formation of micro void, micro crack or micro dimple, the high AE amplitude was caused by microvoid coalescence and quasi-cleavage fracture through analyses of fractograpy.apy.apy.apy.

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Preparation of PVDF Membrane by Thermally-Induced Phase Separation

  • Heo, Chi-Haeng;Lee, Kyung-Mo;Kim, Jin-Ho;Kim, Sung-Soo
    • Korean Membrane Journal
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    • v.9 no.1
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    • pp.27-33
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    • 2007
  • PVDF membrane formation via TIPS was performed for PVDF/DBP and PVDF/DMP systems. PVDF/DBP system showed solid-liquid phase separation behavior, while PVDF/DMP system has liquid-liquid phase separation characteristic as well as solid-liquid phase separation characteristic. PVDF contents and cooling conditions had great influence on structure, and the effects of each parameter were examined. Spherulitic structure was obtained due to the dominant PVDF crystallization. Diluent rejected to the outside of spherulite occupied the surface of the PVDF spherulites to result in the microporous spherulite formation and micro-void between spherulites. PVDF/DMP system had competitive solid-liquid and liquid-liquid phase separation depending on the cooling path.

A Study on the Initial Crack Growth in Spheroidal Graphite Cast Iron under Extremely Low Cycle Loading (극저사이클 하중을 받는 구상흑연주철의 초가균열성장에 관한 연구)

  • Kim, Min-Gun;Lim, Bok-Kyu;Kim, Dong-Youl
    • Journal of Industrial Technology
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    • v.22 no.A
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    • pp.3-8
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    • 2002
  • In this study, extremely low cycle fatigue tests were carried out under push-pull loading conditions using graphite cast iron (GCD). In order to clarify the fatigue fracture mechanism of GCD in an extremely low cycle fatigue regime successive observations of internal fatigue damage were performed. The results obtained are as follows. (1) The process of extremely low cycle fatigue can be classified into three stages which are composed of the generation, growth and coalescence of microvoids inside materials. (2) In an extremely low cycle fatigue regime, microvoids originate from debonding of graphite-matrix interface.

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Fundamental Properties of Mortar Utilizing Waste Concrete Power (폐콘크리트 분말을 활용한 모르타르의 기초물성에 관한 연구)

  • Choi, Yun-Wang;Moon, Dae-Joong;Kim, Sung-Su;Kim, Ki-Hyung;Moon, Han-Young
    • Proceedings of the Korea Concrete Institute Conference
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    • 2004.05a
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    • pp.620-623
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    • 2004
  • Waste concrete powder(WCP) has been estimated with a great value-added material as by-product of waste concrete manufactured to fine and coarse aggregate for concrete, because it is able to utilized for cement clinker and concrete admixture. In the experimental results for this study, chemical composition of WCP was similar to that of cement, and specific gravity of WCPs were 2.46 and 2.48 due to internal micro-void of WCP. Final setting of paste with WCP was delayed, and flow value of mortar with WCP was tendency to reduced in comparison with that of paste and mortar with only ordinary portland cement as replacement ratio of WCP increased. Furthermore, sorptivity of mortar with WCP was increased as replacement ratio of WCP increased. Compressive strength of mortar with $15\%$ WCP was developed about 27MPa at 28days.

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A Study of Aging Characteristic of EPDM by High-temperature Treatment (고온 열처리에 의한 EPDM의 열화 특성에 대한 연구)

  • Choi, N.H.;Han, S.I.;Han, S.O.;Yoon, J.Y.;Park, K.S.;Kim, J.S.
    • Proceedings of the KIEE Conference
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    • 1997.07d
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    • pp.1465-1468
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    • 1997
  • In this study we investigated the aging characteristic such as leakage current, dielectric loss, contact angle, of EPDM for outdoor use by thermal treatment. And also observed the color change of surface, changing of chemical ingredient of the marterials by optical microscope. SEMI, FTIR and EDX at the section and surface. The test result show that leakage current is increased with thermal aging time. contact angle and dielectric loss is slightly decreased. Moreover, micro-void or crack in bulk is severely increased with aging time. However, the result affect to the tan $\delta$ at bulk of EPDM. It seems that carrier sources are removed by degassing with heat treatment.

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A Study on Reliability of Solder Joint in Different Electronic Materials (이종 전자재료 JO1NT 부위의 신뢰성에 관한 연구)

  • 신영의;김경섭;김형호
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1993.11a
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    • pp.49-54
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    • 1993
  • This paper discusses the reliability of solder joints of electronic devices on printed circuit board. Solder application is usually done by screen printing method for the bonding between outer leads of devices and thick film(Ag/Pd) pattern on Hybrid IC as wel1 as Cu lands on PCB. As result of thermal stresses generated at the solder joints due to the differences of thermal expansion coefficients between packge body and PCB, Micro cracking often occurs due to thermal fatigue failure at solder joints. The initiation and the propagate of solder joint crack depends on the environmental conditions, such as storage temperature and thermal cycling. The principal mechanisms of the cracking pheno- mana are the formation of kirkendal void caused by the differences in diffusion rate of materials, ant the thermal fatigue effect due to the differences of thermal expansion coefficient between package body and PCB. Finally, This paper experimentally shows a way to supress solder joints cracks by using low-${\alpha}$ PCB and the packages with thin lead frame, and investigates the phenomena of diffusion near the bonding interfaces.

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