• 제목/요약/키워드: METAL SURFACE

검색결과 5,332건 처리시간 0.031초

팔당호 표층 퇴적물에 함유된 중금속의 입도 의존성에 관한 연구 (A Study on Grain Size Dependency of Selected Heavy Metals in the Surface Sediment of Lake Paldang)

  • 신경용;전상호
    • 한국환경보건학회지
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    • 제38권5호
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    • pp.424-430
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    • 2012
  • Objective: The purpose of this study was to present the standard deviation of the elemental normalization of concentration of selected heavy metals in the surface sediment of Lake Paldang. Methods: Grain size dependency of selected heavy metal concentrations in the surface sediments of Lake Paldang was analyzed by the extrapolation method. The heavy metal concentrations were the sum of all fractions. Results: Cd and Cu showed an increase of the coefficient of determination($r^2$) in the fractional content of particle size, from <256 ${\mu}m$ to <20 ${\mu}m$, and a decrease from <20 ${\mu}m$ to <1 ${\mu}m$. The normalized concentration of Cd and Cu by extrapolation at 50% <20 ${\mu}m$ were 0.8 mg/kg, 37.0 mg/kg, 57.6 mg/kg and 201.7 mg/kg respectively. Conclusions: The normalized concentrations in the sediment of Lake Paldang are 1.5-2.0 times higher than mean average concentration. We concluded that in interpretation of heavy metal concentration in the sediment of Lake Paldang, normalization of grain size dependency should be considered.

DEVELOPMENT AND REPAIR OF LAMINATE TOOLS BY JOINING PROCESS

  • Yoon, Suk-Hwan;Na, Suck-Joo
    • 대한용접접합학회:학술대회논문집
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    • 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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    • pp.402-407
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    • 2002
  • Laminate tooling process is a fast and simple method to make metal tools directly for various molding processes such as injection molding in rapid prototyping field. Metal sheets are usually cut, stacked, aligned and joined with brazing or soldering. Through the joining process, all of the metal sheet layers should be rigidly joined. When joining process parameters are not appropriate, there would be defects in the layers. Among various types of defects, non-bonded gaps of the tool surface are of great importance, because they directly affect the surface quality and dimensional accuracy of the final products. If a laminate tool with defects has to be abandoned, it could lead to great loss of time and cost. Therefore a repair method for non-bonded gaps of the surface is essential and has important meaning for rapid prototyping. In this study, a rapid laminate tooling system composed of a CO2 laser, a furnace, and a milling machine was developed. Metal sheets were joined by furnace brazing, dip soldering and adhesive bonding. Joined laminate tools were machined by a high-speed milling machine to improve surface quality. Also, repair brazing and soldering methods of the laminates using the $CO_2$ laser system have been investigated. ill laser repair process, the beam duration, beam power and beam profile were of great importance, and their effects were simulated by [mite element methods. The simulation results were compared with the experimental ones, and optimal parameters for laser repair process were investigated.

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자궁난관 조영술 검사 시 Speculum 재질에 따른 흡수선량의 변화에 관한 연구 (Research about the absorbed dose with speculum material-related in Hysterosalpingography)

  • 김연민
    • 대한디지털의료영상학회논문지
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    • 제13권1호
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    • pp.1-6
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    • 2011
  • The purpose of our study was to determine the entrance surface dose and absorbed dose in ovary when using the metal speculum and plastic speculum in hysterosalpingography respectively. The examinations was performed in anthropomorphic phantom into which calibrated photoluminescence glass dosimeter were placed on symphysis pubis level surface and ovary area. We checked average fluoroscopy time and spot expose times during the hysterosalpingography. It was average fluoroscopy time 58 sec, spot expose 5 times. We divided the subjects into two different groups to used metal and plastic speculum. We measured 10 times of absorbed dose in the same condition of the anthropomorphic phantom. We compared two groups adsorbed dose on ovary with speculum material-related. The entrance surface dose on of plastic Speculum using group was average 17.23 mGy, absorbed dose on ovary was average 3.51 mGy. The entrance surface dose on ovary of metal Speculum using group was average 19.95 mGy, absorbed dose on ovary was average 4.14 mGy. Plastic speculum using group shows a decrease absorbed dose(17.9%) as compared with metal speculum using group. The method of plastic speculum using in hysterosalpingography. might provide us with lower radiation dose, especially in patients with childbearing stage.

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금속/copper(II)-phthalocyanine interface에서의 space charge 연구 (Study of space charge of metal/copper(II)-phthalocyanine interface)

  • 박미화;임은주;유현준;이기진;차덕준;이용산
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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    • pp.526-530
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    • 2004
  • We report the space charge and the surface potential of the interface between metal and CuPc according to isotropic property and different metal by measuring the microwave reflection coefficients $S_{11}$ of copper(II)-phthalocyanine(CuPc) thin films by using a near-field microwave microscope(NSMM) in order to understand. CuPc thin films were prepared on gold and aluminium substrates using a thermal evaporation method. Two kinds of CuPc thin films were prepared. One was deposited on preheated substrate at $150^{\circ}C$ and the other was annealed after deposition by using thermal evaporation methods. The microwave reflection coefficients $S_{11}$ of CuPc thin films were changed by the dependence on the heat treatment conditions. By comparing reflection coefficient $S_{11}$ we measured electrical conductivity of CuPc thin films and studied this results with respect to the surface potential and space charge of the interface between metal and CuPc thin films.

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기계가공이 이종용접부의 잔류응력에 미치는 영향에 관한 연구 (A Study on Machining Effects on Residual Stress at Dissimilar Metal Weld Region)

  • 이경수;이정근;이성호;박치용;이승건;박재학
    • Journal of Welding and Joining
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    • 제29권2호
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    • pp.56-63
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    • 2011
  • his paper aimed to understand the residual stress in the dissimilar metal welds of nuclear power plant. Two kinds of residual stress were considered, which caused by welding and machining. Residual stress due to mechanical machining was measured by hole-drilling technique and x-ray diffraction method for the SA508 and F316L. Weld residual stress at dissimilar metal weld between SA508 and F316L was evaluated by FEA. Residual stress profiles were obtained for the inside surface and through thickness of welds. Machining effect was also analyzed by FEA. According to the residual stress measurement, it was observed that mechanical machining can generate tensile stress on the surface of the test material. However, FEA results showed that mechanical machining did not increase the tensile stress on the surface of weld region. Further study with more elaborate measurement and numerical analysis is required to identify the effect of machining on residual stress in the dissimilar metal weld region.

Effects of Metal Anion Complexes in Electrolyte on the Properties of Anodic Oxide Films on ADC12 Al Alloy

  • Yoo, Hyeonseok;Lee, Chulho;Oh, Kiseok;Choi, Jinsub
    • 한국표면공학회지
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    • 제49권2호
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    • pp.130-134
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    • 2016
  • The anodization of ADC12 aluminum alloy was investigated in the metal anionic acid media. Anodic oxide films containing foreign elements were formed on ADC12 Al alloy by anodization in the anion complex solution. Furthermore, the rough surface and cracks were considerably smoothened by the deposit of metal anions. When the size of metal anion was small, relatively large amount of metal anions was loaded in anodic films. Existence of $MoO_3$, $TiO_2$ and MgO was confirmed by XPS. According to the results of Tafel analysis, Mo oxide represented the most noble anti-corrosion potential due to $MoS_2$ formation. Corrosion current densities were generally higher than that of pristine anodic oxide without anion complexes.

Metal/$Al_2O_3-SiO_2$ System Interface Investigations

  • Korobova, N.;Soh, Deawha
    • 한국정보통신학회:학술대회논문집
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    • 한국해양정보통신학회 2004년도 SMICS 2004 International Symposium on Maritime and Communication Sciences
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    • pp.70-73
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    • 2004
  • The packaging of the integrated circuits requires knowledge of ceramics and metals to accommodate the fabrication of modules that are used to construct subsystems and entire systems from extremely small components. Composite ceramics (Al$_2$O$_3$-SiO$_2$) were tested for substrates. A stress analysis was conducted for a linear work-hardening metal cylinder embedded in an infinite ceramic matrix. The bond between the metal and ceramic was established at high temperature and stresses developed during cooling to room temperature. The calculations showed that the stresses depend on the mismatch in thermal expansion, the elastic properties, and the yield strength and work hardening rate of the metal. Experimental measurements of the surface stresses have also been made on a Cu/Al$_2$O$_3$-SiO$_2$ceramic system, using an indentation technique. A comparison revealed that the calculated stresses were appreciably larger than the measured surface stresses, indicating an important difference between the bulk and surface residual stresses. However, it was also shown that porosity in the metal could plastically expand and permit substantial dilatational relaxation of the residual stresses. Conversely it was noted that pore clusters were capable of initiating ductile rupture, by means of a plastic instability, in the presence of appreciable tri-axiality. The role of ceramics for packaging of microelectronics will continue to be extremely challenging.

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다결정 실리콘 박막으로 구성된 Metal-Semiconductor-Metal 광검출기의 제조 (Metal-Semiconductor-Metal Photodetector Fabricated on Thin Polysilicon Film)

  • 이재성;최경근
    • 한국전기전자재료학회논문지
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    • 제30권5호
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    • pp.276-283
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    • 2017
  • A polysilicon-based metal-semiconductor-metal (MSM) photodetector was fabricated by means of our new methods. Its photoresponse characteristics were analyzed to see if it could be applied to a sensor system. The processes on which this study focused were an alloy-annealing process to form metal-polysilicon contacts, a post-annealing process for better light absorption of as-deposited polysilicon, and a passivation process for lowering defect density in polysilicon. When the alloy annealing was achieved at about $400^{\circ}C$, metal-polysilicon Schottky contacts sustained a stable potential barrier, decreasing the dark current. For better surface morphology of polysilicon, rapid thermal annealing (RTA) or furnace annealing at around $900^{\circ}C$ was suitable as a post-annealing process, because it supplied polysilicon layers with a smoother surface and a proper grain size for photon absorption. For the passivation of defects in polysilicon, hydrogen-ion implantation was chosen, because it is easy to implant hydrogen into the polysilicon. MSM photodetectors based on the suggested processes showed a higher sensitivity for photocurrent detection and a stable Schottky contact barrier to lower the dark current and are therefore applicable to sensor systems.

Ru/Al2O3/메탈폼 촉매를 이용한 친환경 액체추진제 분해 (Decomposition of Eco-friendly Liquid Propellants over Ruthenium/Al2O3/metal foam Catalysts)

  • 유달산;전종기
    • 청정기술
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    • 제25권3호
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    • pp.256-262
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    • 2019
  • Hydroxylammonium nitrate (HAN) 기반 액상 추진제는 발암물질이 아니며 연소가스 또한 독성이 거의 없어서 환경 친화적인 추진제로 주목을 받고 있다. 추력기에서 HAN 기반 액체추진제를 분해하는데 사용되는 촉매는 저온 활성 및 고내열성을 동시에 보유하고 있어야 한다. 본 연구의 목적은 metal foam 표면에 alumina slurry를 wash coating 방법으로 담지한 후, 루테늄(ruthenium) 전구체를 그 위에 담지하여 Ru/alumina/metal foam 촉매를 제조하고, 이 촉매의 HAN 수용액 분해 활성을 평가하는 것이다. Wash coating 방법으로 metal foam 지지체에 알루미나를 담지시키는 과정에서 wash coating 반복 횟수가 alumina/metal foam의 물리적 특성에 미치는 영향을 분석하였다. 알루미나 wash coating 횟수가 증가할수록 약 7 nm의 직경을 갖는 메조기공이 지속적으로 발달하여 표면적과 기공 부피가 증가하는데, metal foam에 알루미나를 코팅하는 과정을 12 회 반복하는 것이 최적이라고 판단하였다. 이 지지체에 Ru을 담지한 Ru/alumina/metal foam 촉매의 표면에도 메조기공이 잘 발달하였다. 활성금속과 알루미나를 담지하지 않은 metal foam 자체만으로도 HAN 수용액의 분해반응을 촉진할 수 있음을 알 수 있었다. Ru/alumina/metal foam-550촉매의 경우는 열분해 반응에 비해서 분해개시온도를 큰 폭으로 낮추었고, ${\Delta}P$를 크게 증가시킬 수 있어서, HAN 수용액 분해 반응에서 우수한 활성을 보였다. 그러나 이 촉매를 $1,200^{\circ}C$에서 소성하면 반응 활성이 저하되는데 이는 촉매의 표면적과 기공 부피가 급격하게 감소하고 Ru이 소결되기 때문이다. 추가적인 연구를 통해서 Ru/alumina/metal foam의 내열성을 개선할 필요성이 있다.

구리박막에서 수은 클러스터의 충돌거동에 대한 분자동역학적 연구 (Molecular Dynamics Study on Collision Behaviors of Cluster of Mercury on Thin-Film of Copper)

  • 정흥철;고선미;최경민;김덕줄
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2007년도 춘계학술대회B
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    • pp.2678-2683
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    • 2007
  • The interaction between metal molecules and liquid metal molecules was modeled in the molecular scale and simulated by the molecular dynamics method in order to understand behaviors of the cluster on metallic surface in collision process. Lennard-Jones potential had been used as intermolecular potential, and only attraction 때 d repulsion had been used for the behavior of the cluster on the metal surface. As results, the behavior of the cluster was so much influenced by the cluster of liquid metal temperature and function of molecules forces, such as attraction and repulsion, in the collision progress. These results of simulation will be the foundation for the micro fabrication manufacturing by using spray application technology.

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