• Journal of the Korean Society for Aeronautical & Space Sciences
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• 제43권5호
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• pp.432-439
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• 2015

MEMS solid thruster module is composed of solid thruster and its control board. It was developed for the purpose of an academic research. Therefore, thermo-mechanical design and verification for space usage were not considered in the design phase. To mount it on a cube satellite without any design modification, technical efforts at the system level structure design is required. In this study, we proposed a structural design concept to mount the MEMS thruster module by using brackets for guaranteeing structure safety under launch loads and easier mating and de-mating of MEMS thruster module during test phase. The effectiveness of the design has been verified through structural analysis and vibration test. In addition, electrical connection method using spring pins between MEMS thruster and control board is effective for guaranteeing the structural safety under launch vibration loads.

• Transactions on Electrical and Electronic Materials
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• 제17권3호
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• pp.129-133
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• 2016

Theoretical and graphical analysis of pull-in-voltage and figure of merit for a fixed-fixed capacitive Micro Electromechanical Systems (MEMS) switch is presented in this paper. MEMS switch consists of a thin electrode called bridge suspended over a central line and both ends of the bridge are fixed at the ground planes of a coplanar waveguide (CPW) structure. A thin layer of dielectric material is deposited between the bridge and centre conductor to avoid stiction and provide low impedance path between the electrodes. When an actuation voltage is applied between the electrodes, the metal bridge acquires pull in effect as it crosses one third of distance between them. In this study, we describe behavior of pull-in voltage and figure of merit (or capacitance ratio) of capacitive MEMS switch for five different dielectric materials. The effects of dielectric thicknesses are also considered to calculate the values of pull-in-voltage and capacitance ratio. This work shows that a reduced pull-in-voltage with increase in capacitance ratio can be achieved by using dielectric material of high dielectric constant above the central line of CPW.

• KSII Transactions on Internet and Information Systems (TIIS)
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• 제15권10호
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• pp.3554-3570
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• 2021

With the rapid development of the Chinese water project, the safety monitoring of dams is urgently needed. Many drawbacks exist in dams, such as high monitoring costs, a limited equipment service life, long-term monitoring difficulties. MEMS sensors have the advantages of low cost, high precision, easy installation, and simplicity, so they have broad application prospects in engineering measurements. This paper designs intelligent monitoring based on the collaborative measurement of dual MEMS sensors. The system first determines the endpoint coordinates of the sensor array by the coordinate transformation relationship in the monitoring system and then obtains the dam settlement according to the endpoint coordinates. Next, this paper proposes a dual-MEMS sensor collaborative measurement algorithm that builds a mathematical model of the dual-sensor measurement. The monitoring system realizes mutual compensation between sensor measurement data by calculating the motion constraint matrix between the two sensors. Compared with the single-sensor measurement, the dual-sensor measurement algorithm is more accurate and can improve the reliability of long-term monitoring data. Finally, the experimental results show that the dam subsidence monitoring system proposed in this paper fully meets the engineering monitoring accuracy needs, and the dual-sensor collaborative measurement system is more stable than the single-sensor monitoring system.

• Journal of the Microelectronics and Packaging Society
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• 제12권3호
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• pp.187-196
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• 2005

MEMS devices such as a vibratory gyroscope often suffer from a lower yield rate due to fabrication errors and the external stress. In the decoupled vibratory gyroscope, the main factor that determines the yield rate is the frequency difference between the sensing and driving modes. The gyroscope, fabricated with SOI (Silicon-On-Insulator) wafer and packaged using the anodic bonding, has a large wafer bowing caused by thermal expansion mismatch as well as non-uniform surfaces of the structures caused by the notching effect. These effects result in large distribution in the frequency difference, and thereby a lower yield rate. To improve the yield rate we propose a packaged SiOG (Silicon On Glass) technology. It uses a silicon wafer and two glass wafers to minimize the wafer bowing and a metallic membrane to avoid the notching. In the packaged SiOG gyroscope, the notching effect is eliminated and the warpage of the wafer is greatly reduced. Consequently the frequency difference is more uniformly distributed and its variation is greatly improved. Therefore we can achieve a more robust vibratory MEMS gyroscope with a higher yield rate.

• Journal of the Microelectronics and Packaging Society
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• 제15권2호
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• pp.29-36
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• 2008

In this paper, mechanical reliability issues of copper through-wafer interconnections are investigated numerically and experimentally. A hermetic wafer level packaging for MEMS devices is developed. Au-Sn eutectic bonding technology is used to achieve hermetic sealing, and the vertical through-hole via filled with electroplated copper for the electrical connection is also used. The MEMS package has the size of $1mm{\times}1mm{\times}700{\mu}m$. The robustness of the package is confirmed by several reliability tests. Several factors which could induce via hole cracking failure are investigated such as thermal expansion mismatch, via etch profile, and copper diffusion phenomenon. Alternative electroplating process is suggested for preventing Cu diffusion and increasing the adhesion performance of the electroplating process. After implementing several improvements, reliability tests were performed, and via hole cracking as well as significant changes in the shear strength were not observed. Helium leak testing indicated that the leak rate of the package meets the requirements of MIL-STD-883F specification.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 한국정밀공학회 2002년도 춘계학술대회 논문집
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• pp.497-502
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• 2002

This paper describes a design methodology of a tri-axial silicon-based farce sensor with square membrane by using micromachining technology (MEMS). The sensor has a maximum farce range of 5 N and a minimum force range of 0.1N in the three-axis directions. A simple beam theory was adopted to design the shape of the micro-force sensor. Also the optimal positions of piezoresistors were determined by the strain distribution obtained from the commercial finite element analysis program, ANSYS. The Wheatstone bridge circuits were designed to consider the sensitivity of the force sensor and its temperature compensation. Finally the process for microfabrication was designed using micromachining technology.

• Journal of the Korea Institute of Military Science and Technology
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• 제5권3호
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• pp.120-124
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• 2002

Microturbine refers to turbines on the scale of centimeters which can transmit power on the order of tens of Watts. Such devices can be used as propulsion or power generation devices for various military systems. An interdisciplinary team at Seoul National University has designed, and fabricated such a device, and this paper describes each phase. A commercial code has been used for design, and MEMS processes have been used for manufacturing. Finally, some preliminary test results are presented.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.223-227
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• 2003

A new flexible electronic packaging technology and its medical applications are presented. Conventional silicon chips and electronic modules can be considered as "mechanically rigid box." which does not bend due to external forces. This mechanically rigid characteristic prohibits its applications to wearable systems or bio-implantable devices. Using current MEMS (Microelectromechanical Systems) technology. a surface micromachined flexible polysilicon sensor array and flexible electrode array fer neural interface were fabricated. A chemical thinning technique has been developed to realize flexible silicon chip. To combine these techniques will result in a realization of truly flexible sensing modules. which are suitable for many medical applications.

• Journal of Korean Association for Spatial Structures
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• 제18권2호
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• pp.51-58
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• 2018

Recently, measuring instruments for SHM of structures had being developed. In general, the wireless transmission of sensor signals, compared to its wired counterpart, is preferable due to its absence of triboelectric noise and elimination of the requirement for cumbersome cable. However, the research on the tall buildings with relatively small vibration levels is insufficient. Therefore, in this paper, we used the wireless MEMS sensor and iPad to compare and analyze the vibration measurements of three tall buildings and two towers.

• Journal of Korean Association for Spatial Structures
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• 제19권1호
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• pp.101-108
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• 2019

Recently, measuring instruments for SHM of structures has been developed. In general, the wireless transmission of sensor signals, compared to its wired counterpart, is preferable due to the absence of triboelectric noise and elimination of the requirement of a cumbersome cable. However, the low-cost wireless MEMS sensor has high noise density and transmits the signal wirelessly, so data transmission delay occurs during measurement. Therefore, the footbridges that was previously measured by a mobile phone in 2014 was remeasured using G-Link-200, iPad and iPhone to compare their performance.