• 제목/요약/키워드: MEMS technology

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MEMS용 MCA/Si diaphragm 구조의 변위해석 (Deflection Analysis of MCA/Si diaphragm for MEMS)

  • 김재민;이종춘;윤석진;정귀상
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
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    • pp.372-375
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    • 2003
  • MCA deflection control is a important technology for the development of MEMS applications. In this study, deflection analysis at the MLA/Si diaphragm was investigated by Finite Element Method. Analysis of Si diaphragm combined with MCA has been implemented into the ANSYS (Solid5 and Solid45). On the basis of this structure, deflection versus MCA number of layers has been modelled and MCA/Si contact area characteristics with different diaphragm conditions were analyzed. Consequently, it is expected that fabrication technology of MCA/Si diaphragm could be usefully applied for the fabrication process of high-performance piezoelectric MEMS devices.

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유무선 통신용 MEMS 온습도 네트워크 센서 (MEM Temperature and Humidity Network Sensor for Wire and Wireless Network)

  • 정우철;차부상
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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    • pp.360-361
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    • 2006
  • This paper describes a wire and wireless network sensor for temperature and humidity measurements. The network sensor comprises PLC(Power Line Communication) and RF transmitter(433MHz) for acquiring an internal (on-board) sensor signal, and measured data is transmitted to a main processing unit. The network sensor module is consist of MEMS sensor, 10-bit A/D converter, pre-amp., gain-amp., ADUC812 one chip processor and PLC/RF transmitting unit. The temperature and humidity sensor is based on MEMS piezoelectric membrane structure and is implemented by using dual function sensor for smart home and smart building.

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패키징으로 인한 응력이 MEMS 소자에 미치는 영향 분석 및 개선 (Effects of Package Induced Stress on MEMS Device and Its Improvements)

  • 좌성훈;조용철;이문철
    • 한국정밀공학회지
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    • 제22권11호
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    • pp.165-172
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    • 2005
  • In MEMS (Micro-Electro-Mechanical System), packaging induced stress or stress induced structure deformation becomes increasing concerns since it directly affects the performance of the device. In the decoupled vibratory MEMS gyroscope, the main factor that determines the yield rate is the frequency difference between the sensing and driving modes. The gyroscope, packaged using the anodic bonding at the wafer level and EMC (epoxy molding compound) molding, has a deformation of MEMS structure caused by thermal expansion mismatch. This effect results in large distribution in the frequency difference, and thereby a lower yield rate. To improve the yield rate we propose a packaged SiOG (Silicon On Glass) process technology. It uses a silicon wafer and two glass wafers to minimize the wafer warpage. Thus the warpage of the wafer is greatly reduced and the frequency difference is more uniformly distributed. In addition. in order to increase robustness of the structure against deformation caused by EMC molding, a 'crab-leg' type spring is replaced with a semi-folded spring. The results show that the frequency shift is greatly reduced after applying the semi-folded spring. Therefore we can achieve a more robust vibratory MEMS gyroscope with a higher yield rate.

LTCC 기술을 이용한 MEMS 소자 진공 패키징 (Vacuum packaging of MEMS (Microelectromechanical System) devices using LTCC (Low Temperature Cofired Ceramic) technology)

  • 전종인;최혜정;김광성;이영범;김무영;임채임;황건탁;문제도;최원재
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2002년도 추계기술심포지움논문집
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    • pp.195-198
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    • 2002
  • 현재의 광통신, 이동통신 및 디지털 시대에서는 보다 소형화되고, 대용량의 데이터 저장 및 다기능 소자에 대한 요구가 많아지고 있다. 이러한 전자 산업 환경에서 MEMS 소자는 여러 요구조건을 만족시킬 수 있는 특징을 갖추고 있으며 실제 소자의 제작에 있어서 MEMS 소자를 이용하여 여러 물리 및 화학 센서 및 Actuator 제작에 응용이 되어지고 있고 Optical switch, Gyroscope, 적외선 어레이 센서, 가속도 센서, 위치 센서 등 여러 분야에서 실용화가 진행되어지고 있다. MEMS 구조물의 packaging 방법에 있어서는 내부 MEMS 소자의 동작을 위한 외부 환경으로부터의 보호를 위하여 Hermetic sealing에 대한 요구를 만족시켜야 한다. 본 발표에서는 이와 같은 MEMS device의 진공 패키지를 구현함에 있어서 기판 내부에 수동소자를 실장할 수 있는 LTCC 기술을 이용하여 진공 패키징하는 방법에 대하여 소개한다. 본 기술을 이용하는 경우 기존의 Hermetic sealing 이외에 향후 적층 기판 내부에 수동소자를 내장시켜 배선 길이 및 노이즈 성분을 감소시켜 더욱 전기적 성능을 향상시킬 수 있는 장점이 있게된다. 본 논문에서는 LTCC 기판을 이용하여 패키징 시킨 후, 내부 진공도에 영향을 줄 수 있는 계면들에서의 시간에 따른 진공도 변화의 특성치를 측정하여 LTCC 기판의 Hermetic sealing 특성에 관하여 조사하였다.

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MEMS 기술을 이용하여 제작한 적외선 영상 투사용 에미터 단위 소자의 특성 분석 (The analysis on properties of IR emitter unit device fabricated by using MEMS technology for Infrared Scene Projector)

  • 박기원;신영봉;강인구;이희철
    • 전자공학회논문지
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    • 제54권3호
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    • pp.31-36
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    • 2017
  • 본 논문에서는 가상의 적외선 영상을 투사하여 적외선 검출기의 성능 평가를 위한 목적으로 사용되는 적외선 영상 투사장치 (Infrared scene projector, IRSP)의 내부에서 적외선을 방사하는 역할을 하는 적외선 에미터 소자에 대한 연구가 수행되었다. 적외선 에미터 소자의 구조를 설계한 후 설계된 소자의 특성 파라미터들을 추출하였으며 각 특성 파라미터에 근거한 소자의 성능을 유한 요소법을 통해 예측하였다. 또한 소자를 구성하는 각 부분의 특성에 따른 물질 선정 후 MEMS 기반 반도체 공정기술을 적용하여 에미터 단위소자를 제작하였고 중적외선 대역($3{\sim}5{\mu}m$)의 적외선을 관찰할 수 있는 적외선 영상 현미경을 사용하여 진공 환경을 갖춘 챔버 내부에서 소자의 성능을 측정한 결과 최대 423K의 유효온도 및 22msec의 응답 시간을 나타내는 것을 확인하였다.

An Integrated Sensor for Pressure, Temperature, and Relative Humidity Based on MEMS Technology

  • Won Jong-Hwa;Choa Sung-Hoon;Yulong Zhao
    • Journal of Mechanical Science and Technology
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    • 제20권4호
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    • pp.505-512
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    • 2006
  • This paper presents an integrated multifunctional sensor based on MEMS technology, which can be used or embedded in mobile devices for environmental monitoring. An absolute pressure sensor, a temperature sensor and a humidity sensor are integrated in one silicon chip of which the size is $5mm\times5mm$. The pressure sensor uses a bulk-micromachined diaphragm structure with the piezoresistors. For temperature sensing, a silicon temperature sensor based on the spreading-resistance principle is designed and fabricated. The humidity sensor is a capacitive humidity sensor which has the polyimide film and interdigitated capacitance electrodes. The different piezoresistive orientation is used for the pressure and temperature sensor to avoid the interference between sensors. Each sensor shows good sensor characteristics except for the humidity sensor. However, the linearity and hysteresis of the humidity sensor can be improved by selecting the proper polymer materials and structures.

The Static and Dynamic Performance of a MEMS/MST Based Gas-Lubricated proceeding Bearing with the Slip Flow Effect

  • Kwak, H.-D.;Lee, Y.-B.;Kim, C.-H.;Lee, N.-S.;Choi, D.-H.
    • 한국윤활학회:학술대회논문집
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    • 한국윤활학회 2002년도 proceedings of the second asia international conference on tribology
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    • pp.103-104
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    • 2002
  • The influence of the slip flow on the MEMS/MST based gas-lubricated proceeding bearing is investigated. Based on the modified Reynolds equation, the numerical analysis of the finite difference method was developed by applying the first order slip flow approximation. The numerical prediction of bearing performance provides the significant results concerning the slip flow effect in micro scale gas-lubricated proceeding bearing. The result indicates that the load-carrying capacity as well as the rotordynamic coefficients were significantly reduced due to the slip flow. Through this work, it is concluded that the slip flow effect could not be ignored in the micro gas-lubricated proceeding bearing.

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MEMS 기술 기반 이식형 청각 장치용 전자기 엑츄에이터의 소형화 및 최적화 (Miniaturization and Optimization of Electromagnetic Actuators for Implantable Hearing Device Based on MEMS Technology)

  • 김민규;정용섭;조진호
    • 센서학회지
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    • 제27권2호
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    • pp.99-104
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    • 2018
  • A micro electromagnetic actuator with high vibration efficiency is proposed for use in an implantable hearing device. The actuator, which can be implanted in the middle ear, consists of membranes based on the stainless steel 304 (SUS-304), and other components. In conventional actuators, in which a thick membrane and a silicone elastomer are used, the size reduction was difficult. In order to miniaturize the size of the actuator, it is necessary to reduce the size of the actuation potion that generates the driving force, resulting in reduction of the electromagnetic force. In this paper, the electromagnetic actuator is further miniaturized by the metal membrane and the vibration amplitude is also optimized. The actuator designed according to the simulation results was fabricated by using micro-electro-mechanical systems (MEMS) technology. In particular, a $20{\mu}m$ thick metal membrane was fabricated using the erosion process, which reduced the length of the actuator by more than $400{\mu}m$. In the experiments, the vibration displacement characteristics of the optimized actuator were above 400 nm within the range of 0.1 to 1 kHz when a current of $1mA_{rms}$ was applied to the coil.