• Smart Structures and Systems
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• v.6 no.5_6
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• pp.525-543
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• 2010

Testing and validation processes are critical tasks in developing a new hardware platform based on a new technology. This paper describes a series of experiments to evaluate the performance of a newly developed MEMS-based wireless sensor node as part of a wireless sensor network (WSN). The sensor node consists of a sensor board with four accelerometers, a thermometer and filtering and digitization units, and a MICAz mote for control, local computation and communication. The experiments include calibration and linearity tests for all sensor channels on the sensor boards, dynamic range tests to evaluate their performance when subjected to varying excitation, noise characteristic tests to quantify the noise floor of the sensor board, and temperature tests to study the behavior of the sensors under changing temperature profiles. The paper also describes a large-scale deployment of the WSN on a long-span suspension bridge, which lasted over three months and continuously collected ambient vibration and temperature data on the bridge. Statistical modal properties of a bridge tower are presented and compared with similar estimates from a previous deployment of sensors on the bridge and finite element models.

• Korean Journal of Metals and Materials
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• v.49 no.4
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• pp.304-312
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• 2011

In this study, MOSFET type micro hydrogen gas sensors with platinum catalytic metal gates were designed, fabricated, and their electrical characteristics were analyzed. The devised MOSFET Hydrogen Sensors, called MHS-1 and -2, were designed with a platinum gate for hydrogen gas adsorption, and an additional sensing part for higher gas sensitivity and with a micro heater for operation temperature control. In the electrical characterization of the fabricated Pt-gate MOSFET (MHS-1), the saturated drain current was 3.07 mA at 3.0 V of gate voltage, which value in calculation was most similar to measurement data. The amount of threshold voltage shift and saturated drain current increase to variation of hydrogen gas concentration were calculated and the hydrogen gas sensing properties were anticipated and analyzed.

• Tunnel and Underground Space
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• v.28 no.6
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• pp.547-554
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• 2018

Using crowdsourced sensor data collection technique, it is possible to collect high-density ground vibration data which is difficult to obtain by conventional methods. In this study, we have developed a crowdsourced ground vibration data collection system using MEMS sensors mounted on small electronic devices including smartphones, and implemented client and server based on the proposed infrastructure system design. The system is designed to gather vibration data quickly through Android-based smartphones or fixed devices based on Android Things, minimizing the usage of resource like power usage and data transmission traffic of the hardware.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.38 no.3
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• pp.300-308
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• 2010

In order to accelerate the evolution of faster, better, cheaper spacecraft, it is evident that greatly enhanced general-purpose attitude determination methods are needed Currently, star tracker sensors based on charge coupled devices (CCD) or active pixel sensors(APS) enable one to obtain the best spacecraft attitude estimation among the existing sensors for attitude determination. In this paper, basic principles of star tracker technology are explained including major issues arising in design and development of star tracker. Also, an historical overview and worldwide survey associated with various star trackers from star scanner through microelectromechanical system(MEMS)-based star tracker is offered.

• Proceedings of the Korea Contents Association Conference
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• 2008.05a
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• pp.846-850
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• 2008

Technologies related to sealed-type ultrasonic sensors and driving circuit modules for them are the key elements for intelligent robot industry. Those technologies are believed to yield a drastic enhancement of the performance measuring distances in the intelligent robot systems. Modulization technologies of ultrasonic sensors are expected to develop ASIC and MEMS technologies in the future. The size of domestic market for sealed-type ultrasonic sensor modules is expected to grow to 1 billion and 5.72 billion Won by 2008 and 2012, respectively. Recent interest to service robots and government-driven programs are promoting the rapid growth of the market for the service robots. Successful application of the sealed-type ultrasonic modules to the service robots is expected to replace the conventional photo-sensors in a near future.

• Korean Journal of Metals and Materials
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• v.49 no.5
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• pp.395-399
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• 2011

In this study, micro gas sensors for ammonia gas were prepared by adopting MEMS technology and using a sol-gel process. Three types of sensors were prepared via different synthesis routes starting with W sol and Ru sol mixture. This mixture was deposited on a MEMS platform and the platform was subsegueny heated to a temperature of $350^{\circ}C$. The topography and crystal structure of the sensing film were studied using FE-SEM and XRD. The response of the gas sensor to $NH_3$ gas was examined at various operating temperatures and gas concentrations. The sensor response increased almost linearly with gas concentration and the best sensing response was obtained at $333^{\circ}C$ for 5.0 ppm $NH_3$ for the specimen prepared by coating $WO_3$ powders with the Ru sol mixture.

• Journal of Sensor Science and Technology
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• v.24 no.1
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• pp.10-14
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• 2015

This paper reports the results of a study on the optimization of the etching profile, which is an important factor in deep-reactive-ion etching (DRIE), i.e., dry etching. Dry etching is the key processing step necessary for the development of the Internet of Things (IoT) and various microelectromechanical sensors (MEMS). Large-area etching (open area > 20%) under a high-frequency (HF) condition with nonoptimized processing parameters results in damage to the etched sidewall. Therefore, in this study, optimization was performed under a low-frequency (LF) condition. The HF method, which is typically used for through-silicon via (TSV) technology, applies a high etch rate and cannot be easily adapted to processes sensitive to sidewall damage. The optimal etching profile was determined by controlling various parameters for the DRIE of a large Si wafer area (open area > 20%). The optimal processing condition was derived after establishing the correlations of etch rate, uniformity, and sidewall damage on a 6-in Si wafer to the parameters of coil power, run pressure, platen power for passivation etching, and $SF_6$ gas flow rate. The processing-parameter-dependent results of the experiments performed for optimization of the etching profile in terms of etch rate, uniformity, and sidewall damage in the case of large Si area etching can be summarized as follows. When LF is applied, the platen power, coil power, and $SF_6$ should be low, whereas the run pressure has little effect on the etching performance. Under the optimal LF condition of 380 Hz, the platen power, coil power, and $SF_6$ were set at 115W, 3500W, and 700 sccm, respectively. In addition, the aforementioned standard recipe was applied as follows: run pressure of 4 Pa, $C_4F_8$ content of 400 sccm, and a gas exchange interval of $SF_6/C_4F_8=2s/3s$.

• Journal of Korean Society for Geospatial Information Science
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• v.20 no.1
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• pp.65-72
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• 2012

With the development of MEMS, small and low-priced sensors integrating IMU and GPS have produced and exploited for diverse field. In this research, we have judged that MEMS-based IMU/GPS sensor is suitable for light-weighted mobile mapping system and carried out experiments to analyze the characteristics of MTi-G, which was developed from XSens company. From a sensor which fixed to dashboard, coordinates results with no post-processing were achieved for test area. On the whole, the results show satisfactory performances but some errors also were discovered from parts of the road due to sensor properties, XKF characteristics and GPS reception environment. We could confirm the potential of light-weighted mobile mapping system. Experiments considering various GPS reception environments and road condition and more detailed level of accuracy analysis will be performed for further research.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.11
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• pp.63-70
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• 2008

In this paper, a smart sensor system for the MEMS pressure sensor was developed. A compensation algorithm and programmable calibration circuits were presented to eliminate errors caused by temperature drift of piezoresistive pressure sensors in itself. This system consisted of signal conditioning, calibration, temperature detection, microprocessor, and communication parts and these were integrated into a SOC. A RS-232 interface was employed for monitoring and control of a smart sensor system. The area of fabricated IC is $4.38{\times}3.78\;mm^2$ and a $0.35{\mu}m$ high voltage CMOS process was used. Compensation error for temperature drift of 50 KPa pressure sensors was measured into ${\pm}0.48%$ in the range of $-40^{\circ}C{\sim}150^{\circ}C$. Total power consumption was 30.5 mW.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.45 no.1
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• pp.41-49
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• 2008

Many machineries and equipments are being changing to various and complicated by development of recent technology and arrival of convergence age in distant future. These various and complicate equipments need more precise outcomes and low-power consumption sensors to get close and exact results. In this paper, we proposed fault tolerance and feedback theorem for sensor network and MEMS circuit which has a benefit of energy efficiency through wireless sensor network. The system is provided with independent sensor communication if possible as unused action, using idle condition of system and is proposed the least number of circuits. These technologies compared system efficiency after examining product of each Moving Distance by developed sensor which gives effects to execution of system witch is reduced things like control of management side and requirement for hardware, time, and interaction problems. This system is designed for practical application; however, it can be applied to a normal life and production environment such as "Ubiquitous City", "Factory Automata ion Process", and "Real-time Operating System", etc.