• Proceedings of the Optical Society of Korea Conference
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• 2000.02a
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• pp.32-33
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• 2000

최근 디지털 정보 처리 기술의 획기적인 발전과 함께 저가의 반도체 레이저의 개발로 말미암아 광기록 장치(optical pickup device) 및 고속 광통신(optical fiber communication)분야에 응용을 위한 레이저 광학 시스템에 대한 연구가 활발하다. 광신호의 커플링(coupling) 및 스위칭(switching)을 기반으로 하는 이러한 광학 시스템은 일반적으로 광신호의 변조를 위한 광학 요소와 광학 요소의 공간적 제어를 위한 정밀 구동기로 구성되는데, 기존의 상용 시스템의 경우에는 독립적으로 기 제작된 광학 요소와 정밀 구동기를 사후에 조립하는 방법으로 소기의 목적을 달성하였다. 이와 같은 경우 제작에 많은 노력과 비용이 요구되며, 성능의 획기적인 향상을 기대하기 어려우므로 최근에는 Optical MEMS 혹은 MOEMS(Micro-Opto-Electro-Mechanical System)로 대변되는 마이크로머시닝기술(micromachining technology)을 이용한 초정밀 광학계의 제작 기술을 통하여 기존 시스템의 한계를 극복하고자 하는 노력이 다각도로 모색되고 있다. (중략)

• Transactions of the Korean Society of Mechanical Engineers B
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• v.27 no.9
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• pp.1256-1261
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• 2003

Since the viscous effect increases as the size of device decreases, viscous-driven micropump is a promising mechanism in microscale applications. In the present study, a dual-rotor type pump which contains two counter-rotating cylinders for improving performance characteristics is proposed. First, for flows in the single-rotor type pump, the present unstructured grid simulation method is validated by comparing its results to the previous results. Next, the performance of the dual-rotor type pump is evaluated by the parametric studies and is compared to that of the previous single-rotor type pump. The flow characteristics are qualitatively similar to those of single-rotor type pump. However, the performance of the micropump with tandem rotors is still better than that of previous pumping type, e.g. much larger flow rate, smaller driving region, higher efficiency, and wider operation range.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.3
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• pp.228-233
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• 2001

This paper presents the optimized design, fabrication and thermal characteristics of micro-heaters for thermal MEMS (micro elelctro mechanical system) applications usign SOI (Si-on-insulator) and trench structures. The micro-heater is based on a thermal measurement principle and contains for thermal isolation regions a 10㎛ thick Si membrane with oxide-filled trenches in the SOI membrane rim. The micro-heater was fabricated with Pt-RTD (resistance thermometer device) on the same substrate by suing MgO as medium layer. The thermal characteristics of the micro-heater wit the SOI membrane is 280$\^{C}$ at input power 0.9W; for the SOI membrane with 10 trenches, it is 580$\^{C}$ due to reduction of the external thermal loss. Therefore, the micro-heater with trenches in SOI membrane rim provides a powerful and versatile alternative technology for improving the performance of micro-thermal sensors and actuators.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.5
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• pp.85-91
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• 2010

In this paper, we present details on fabrication of single-cell electroporation microdevice, practical experiments of single-cell electroporation with our fabricated microdevice. Also, the continuous electroporation for the continuous flow of cells is used for high-throughput electroporation. The delivery efficiency and cell viability tests are provided and the successful GFP transfection into cells is also evaluated with a fluorescent microscope after electroporation. This device enables to reduce the size of samples and thus the use of small amount of reagents. Also, it makes it possible to permit to avoid cell discrimination (transfected cells versus non-transfected cells) encountered when traditional bulk electroporation is held.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.18 no.4
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• pp.369-374
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• 2009

In micro/nano-scale contacts in MEMS and NEMS, capillary and van der Waals forces generated around contacting micro-asperities significantly influence the performance of concerning device as they are closely related to adhesion and stiction of interacting surfaces. In this regard, it is of prime importance to accurately estimate the magnitude of surface forces so that an optimal solution for reducing friction and adhesion of micro/nano-surfaces may be obtained We introduced an effective method to calculate these surface forces based on topography information obtained from an atomic force microscope. This method was used to calculate surface forces generated in the contact interface formed between diamond-like carbon coating and $Si_3N_4$ ball. This method is shown to effectively demonstrate the influence of capillary force in the contact area, especially in humid atmosphere.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.12S
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• pp.1255-1260
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• 2003

In order to reduce driving power consumption, we propose and fabricate a new structure of asymmetric SOI 1${\times}$2 thermo-optic switch that has a back side silicon trenched structure. Compared to conventional SOI thermo optic switches without heat sink structure, it shows an improvement of switching power reduction from about 4 watt to 1.8 watt without sacrificing cross talk of about 20 ㏈ at the light wavelength of 1.55 $\mu\textrm{m}$. Here we also described the main design consideration and fabrication procedure for the proposed device.

• Laser Solutions
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• v.3 no.3
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• pp.21-29
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• 2000

For the direct metal shape processing the powder feed device which is different from the widely used in rapid prototyping. is developed, The three dimensional object is shaped with the melting metal powder. The developed research has applied to rapid prototyping in ultraprecision for MEMS and medical science fields required of rapid manufacture of complex shape. The goal of this study make 3D model which has precision accuracy. Powder spreading apparatus has been more improved because that the control of powder spread is very important in layer manufacturing. It consists of the vibration motor, nozzle and tube which supplies various metal powder. This apparatus could control the spreading velocity that could control powder spreading thickness. Laser on/off switch was adapted because laser scanning velocity must be preserved constantly to prevent heat transformation of laser overheating. The error between sintered thickness md experimental one occurred by shrinkage in sintering melting process. The problem of heat transformation was solved by On/Off switching system.

• ETRI Journal
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• v.35 no.4
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• pp.603-609
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• 2013

In this paper, we present a 600-V reverse conducting insulated gate bipolar transistor (RC-IGBT) for soft and hard switching applications, such as general purpose inverters. The newly developed RC-IGBT uses the deep reactive-ion etching trench technology without the thin wafer process technology. Therefore, a freewheeling diode (FWD) is monolithically integrated in an IGBT chip. The proposed RC-IGBT operates as an IGBT in forward conducting mode and as an FWD in reverse conducting mode. Also, to avoid the destructive failure of the gate oxide under the surge current and abnormal conditions, a protective Zener diode is successfully integrated in the gate electrode without compromising the operation performance of the IGBT.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.569-572
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• 2000

This paper presents the optimized fabrication and thermal characteristics of micro-heaters for thermal MEMS applications using a SDB SOI substrate. The micro-heater is based on a thermal measurement principle and contains for thermal isolation regions a 10$\mu\textrm{m}$ thick silicon membrane with oxide-filled trenches in the SOI membrane rim. The micro-heater was fabricated with Pt-RTD(Resistance Thermometer Device)on the same substrate by using MgO as medium layer. The thermal characteristics of the micro-heater with the SOI membrane is 280$^{\circ}C$ at input Power 0.9 W; for the SOI membrane with 10 trenches, it is 580$^{\circ}C$ due to reduction of the external thermal loss. Therefore, the micro-heater with trenches in SOI membrane rim provides a powerful and versatile alternative technology for improving the performance of micro thermal sensors and actuators.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.135-138
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• 2005

HDL(Hardware Description Language) is the most important modem tools used to describe hardware, and becomes important as we move to higher levels of abstraction. The HDL has been made brisk use of in analog design, MEMS device[1-2], process related field as well as digital design. The most important characteristics of HDL is Abstraction which is the strongest tool that extend greatly designer's design ability. In this paper by the Modelling Continuum with hierarchical structure of abstraction, we apply UML(Unified Modeling Language) to SoC Design with HDL UML makes an easy and visual description of the various levels of abstraction, and gives designers good flexible modeling capabilty for SoC Design.