• JSTS:Journal of Semiconductor Technology and Science
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• v.5 no.1
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• pp.38-44
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• 2005

Pyrolyzed polyimide is explored in terms of MEMS material. This paper describes chemical, electrical, mechanical properties of pyrolyzed polyimide (PIX-1400) thin film as MEMS material. When polyimide thin film was pyrolyzed at $800^{\circ}C$ for 60 minutes in $N_{2}$ ambient, the residual ratio of pyrolyzed film thickness measured with a surface profiler is about 49 %, and the resistivity is about $2.17{\times}10^{-2}\;{Omega}cm$. From the result of the load-deflection test, the estimated Young's modulus and initial average stress of pyrolyzed polyimide are 67 GPa and 30 MPa, respectively. As one demonstration of MEMS structures of pyrolyzed polyimide, the fabrication method of the microbridge structure is proposed for a micro heater and a resonator.

• Journal of Sensor Science and Technology
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• v.26 no.2
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• pp.91-95
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• 2017

Recently, infrared (IR) spectrometers have been required in various fields such as environment, safety, mobile, automotive, and military. This IR dispersive sensor detection method of substances is widely used. In this study, we fabricated a silicon (Si) prism-based near infrared (NIR) spectrometer utilizing micro electro mechanical system (MEMS) technology. Si prism-based NIR spectrometer utilizing MEMS technology consists of upper, middle, and lower substrates. The upper substrate passes through the incident IR ray selectively. The middle substrate, acting as a prism, disperses and separates the incident IR beam. The lower substrate has an amorphous Si (a-Si)-based bolometer array to detect the IR spectrum. The fabricated Si prism-based NIR spectrometer utilizing MEMS technology has the advantage of a simple structure, easy fabrication steps, and a wide NIR region operating range.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.467-472
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• 2007

A modern MEMS resonator is a micro-scale structure operated over a high frequency range. In order to predict its resonant behavior in a design process, High-frequency response analysis (Hi-FRA) is demanded. Algebraic substructuring (AS) is known as a fast numerical technique to construct an eigenspace for FR and frequency sweep (FS) algorithm efficiently solves the frequency response system projected on the eigenspace. However, the existing FS algorithm using AS is developed for low-FRA, say over the range 1Hz-2KHz. In this work, we extend the FS algorithm using AS for FRA over an arbitrary frequency range. Therefore, it can be efficiently applied to systems operated at a high frequency, say over the range 230MHz-250MHz. The success of the proposed method is demonstrated by Hi-FRA of a checkerboard resonator.

• Journal of Institute of Control, Robotics and Systems
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• v.14 no.4
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• pp.361-364
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• 2008

Tips of probe card were fabricated using MEMS technology. P-type silicon wafer with $SiO_2$ layer was used as a substrate for fabricating the probe card. Ni-Cr and Au used as seed layer for electroplating Ni were deposited on the silicon wafer. Line patterns for probing devices were formed on silicon wafer by electroplating Ni through mold which formed by MEMS technology. Bridge structure was formed by wet-etching the silicon substrate. AZ-1512 photoresist was used for protection layer of back side and DNB-H100PL-40 photoresist was used for patterning of the front side. The mold with the thickness of $60{\mu}m$ was also formed using THB-120N photoresist and probe tip with thickness of $50{\mu}m$ was fabricated by electroplating process.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.258-263
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• 2004

Mechanical property evaluation of micrometer-sized structures is necessary to help design reliable microelectromechanical systems(MEMS) devices. Most material properties are known to exhibit dependence on specimen size and such properties of microscale structures are not well characterized. This paper describes techniques developed for tensile testing of materials used in MEMS. Epi-polycrystalline silicon is currently the most widely used material, and its tensile strength has been measured as 1.52GPa. We have developed an uniaxial testing machine for testing microscale specimen using electro-magnetic actuator. The field magnet and the moving coil taken from an audio-speaker were utilized as the components of the actuator. Structure of specimen was designed and manufactured for easy handling and alignment. In addition to the static tensile tests, new techniques and procedures for measuring strength are described.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.124-128
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• 2001

We apply for the first time a low cost and loss wafer level packaging technology for RF-MEMS device. The proposed structure was simulated by finite element method (FEM) tool (HFSS of Ansoft). S-parameter measured of the package shows the return loss (S11) of 20dB and the insertion loss (S21) of 0.05dB.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.10
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• pp.188-195
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• 2004

In this paper, we fabricated fluidic devices like micro-channel, pump, mixer and particular gas separator with the technology of stereolithouaphy using RP(rapid-prototyping). The fabricated fluidic devices are expected to be applied to develop Lab-on-a chip type liquid analyzer. Stereolithography technology seems effective for fabricating MEMS(Micro Electro Mechanical System) with complicated structure because it makes three dimensional fabrication possible but, exclusive devices are needed to be developed fur fabricating even more microscopic MEMS structure.

• Ceramist
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• v.7 no.3
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• pp.48-54
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• 2004

반도체 집적화 공정 기술을 바탕으로 기계적 구조물(Micromachined mechanical structure)구현을 가능하게 한 Microelectromechanical systems (MEMS) 기술은 최근 들어 새로운 연구분야로서 크게 각광받고 있다. 이러한 MEMS 기술은 자동차, 산업, 의공학, 정보과학 등에 폭넓게 응용되고 있으며 실리콘 가공 기술 및 미세전기소자 (Microelectronics) 기술이 융합되어 전기$.$기계적인 미세소자를 제작하는데 널리 이용되고 있다. (중략)

• Proceedings of the KSME Conference
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• 2001.06e
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• pp.169-174
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• 2001

This paper reports on the development of high aspect ratio structure and 3-D integrated process for MEMS-based micro gas turbines. To manufacture high aspect ratio structures, Deep Reactive Ion Etching (DRIE) process have been developed and optimized. Specially, in this study, structures with aspect ratios greater than 10 were fabricated. Also, wafer direct bonding and Infra-Red (IR) camera bonding inspection systems have been developed. Moreover, using glass/silicon wafer direct bonding, we optimized the 3-D integrated process.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.31 no.5
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• pp.550-555
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• 2007

The effective fracture toughness testing of materials intended for application in Micro Electro Mechanical Systems (MEMS) devices is required in order to improve understanding of how micro sized material used in device may be expected to perform upon the micro scale. ${\gamma}$-TiAl based materials are being considered for application in MEMS devices at elevated temperatures. Especially, in Alloy 4, both ${\alpha}_2$ and ${\gamma}$ lamellae were altered markedly in 3,000 h, $700^{\circ}C$ exposure. Parallel decomposition of coarse ${\alpha}_2$ into bunches of very fine (${\alpha}_2+{\gamma}$) lamellae. Parallel decomposition of coarse ${\alpha}_2$ into bunches of very fine (${\alpha}_2+{\gamma}$) lamellae. The materials were examined 2 types Alloy 4 on heat exposed specimen($700^{\circ}C$, 3,000 h) and no heat exposed one. Micro sized cantilever beams were prepared mechanical polishing on both side at $25{\sim}30{\mu}m$ and electro final stage polishing to observe lamellar orientation of same colony with EBSD (Electron Backscatter Diffraction Pattern). Through lamellar orientation as inter-lamellae or trans-lamellae, Cantilever beam was fabricated with Focused Ion Beam(FIB). The directional behavior of the lamellar structure was important property in single material, because of the effects of the different processing method and variations in properties according to lamellar orientation. In MEMS application, it is first necessary to have a reliable understanding of the manufacturing methods to be used to produce micro structure.