• Journal of Applied Reliability
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• v.3 no.2
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• pp.103-116
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• 2003

We carry out reliability tests and investigate the failure mechanisms. of the wafer level vacuum packaged MEMS gyroscope sensor using an accelerated degradation test. The accelerated degradation test (ADT) is used to evaluate reliability (and/or life) of the MEMS vacuum package and to select the accelerated test conditions, which reduce the reliability testing time. Using the failure distribution model and stress-life model, we are able to estimate the average life time of the vacuum package, which is well agreed with the measured data. After improving several package reliability issues such as prevention of gas diffusion through package, we carry out another set of accelerated tests at the chosen acceleration level. The results show that reliability of the vacuum packaged gyroscope has been greatly improved and can survive without degradation of performance, which is the Q-factor in gyroscope sensor, during environmental stress reliability tests.

• Journal of Information Display
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• v.13 no.1
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• pp.51-54
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• 2012

In this study, the bias-temperature stress and current-temperature stress induced by the electrical stabilities of half-Corbino hydrogenated-amorphous-silicon (a-Si:H) thin-film transistors (TFTs) with different gate electrode geometries fabricated on the same substrate were examined. The influence of the gate pattern on the threshold voltage shift of the half-Corbino a-Si:H TFTs is discussed in this paper. The results indicate that the half-Corbino a-Si:H TFT with a patterned gate electrode has enhanced power efficiency and improved aperture ratio when compared with the half-Corbino a-Si:H TFT with an unpatterned gate electrode and the same source/drain electrode geometry.

• Journal of Sensor Science and Technology
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• v.20 no.3
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• pp.145-150
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• 2011

In this paper, we designed a tunable microstrip patch antenna using RF MEMS switches. The design and simulation of the antenna were performed using a high frequency structure simulator(HFSS). The antenna was designed for use in the ISM band and either operates at 2.4 GHz or 5.7 GHz achieving -10 dB return-loss bandwidths of 20 MHz and 180 MHz, respectively. In order to obtain high efficiency and improve the ease of integration, a high resistivity silicon(HRS) wafer on a glass substrate was used for the antenna. The antenna achieved high gains: 8 dB at 5.7 GHz and 1 dB at 2.4 GHz. The RF MEMS DC contact switches were simulated and analyzed using ANSYS software.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.11
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• pp.63-70
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• 2008

In this paper, a smart sensor system for the MEMS pressure sensor was developed. A compensation algorithm and programmable calibration circuits were presented to eliminate errors caused by temperature drift of piezoresistive pressure sensors in itself. This system consisted of signal conditioning, calibration, temperature detection, microprocessor, and communication parts and these were integrated into a SOC. A RS-232 interface was employed for monitoring and control of a smart sensor system. The area of fabricated IC is $4.38{\times}3.78\;mm^2$ and a $0.35{\mu}m$ high voltage CMOS process was used. Compensation error for temperature drift of 50 KPa pressure sensors was measured into ${\pm}0.48%$ in the range of $-40^{\circ}C{\sim}150^{\circ}C$. Total power consumption was 30.5 mW.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.22 no.10
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• pp.1307-1313
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• 2018

In recent years, there have been frequent occurrences of collapsing buildings and tilting accidents due to frequent earthquakes and aging of buildings. Various methods have been proposed to prevent disasters on these buildings. In this paper, we propose a system that provides an indication of anomalous phenomena such as collapse and tilting of buildings by real-time monitoring of IoT(Internet of Things) based architectural anomalies. The MEMS sensor is based on the inclinometer sensor and the accelerometer sensor, transmits the detected data to the server in real time, accumulates the data, and provides the service to cope when the set threshold value is different. It is possible to evacuate and repair the collapse and tilting of the building by warning the occurrence of the upper threshold event such as the collapse and tilting of the building.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.30 no.6 s.249
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• pp.531-537
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• 2006

A lever type $NO_2$ micro gas sensor was fabricated by MEMS technology. In order to heat up the gas sensing material to a target temperature, a micro heater was built on the gas sensor. The sensing material laid on the heater and electrodes and did not contact with the silicon base to minimize the heat loss to the silicon base. The electric power to heat up the gas sensor to a target temperature was measured. The temperature distribution of micro gas sensor was analyzed by a CFD program. The predicted electric power of micro heater to heat up the sensing material to the target temperature showed a good agreement with the measured data. The design of micro gas sensor could be modified to show more uniform temperature distribution and to consume less electric power by optimizing the layout of micro heater and electrodes.

• Journal of Sensor Science and Technology
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• v.14 no.4
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• pp.265-271
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• 2005

In this study, a variable capacitive pressure sensor is fabricated for TPMS (Tire Pressure Monitoring System). This study is for developing sensors which consecutively measure the tire pressure given as 30 psi from the industrial standard. For improving non-linearity of the prior capacitive pressure sensors, it is suggested that touch mode capacitive pressure sensor be applied. In addition, initial capacitance is designed as small as possible for the conformity to the wireless sensor. ANSYS, commercial FEA package, is used for designing and simulating the sensor. The device is progressed by MEMS (Micro Electro Mechanical Systems) fabrication and packaged with PDMS. The result is obtained sensitivity, 1 pF/psi, through a pressure test. The simulation result is discrepant from experiment one. Wafer's uniformity is presumed as the main reason of discrepancy.

• Journal of Sensor Science and Technology
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• v.21 no.5
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• pp.374-378
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• 2012

Biofouling causes many problem in industrial processes, medical health industries, water utilities and our daily life. So detecting formation of biofilm on the surface of medical appliance, water pipe and industrial utility is highly important to prevent the problem caused by biofouling. In this study, we suggest an electrochemical sensor for detecting biofilm. We fabricated the electrochemical sensor in MEMS process and cultivated two different kinds of Pseudomonas aeruginosa RpoN type and Wild type on the surface of electrochemical sensor. Each group of Pseudomonas aeruginosa was cultivated according to the hours of 2, 4, 6, 8, 12 and 24. Then we investigated changes in degree of biofilm cultivation using cyclic voltammetry. As a result, it was observed that peak of the cyclic voltammetry curve is increased according as the biofilm growth on the surface of electrochemical sensor. Also we can discern between Pseudomonas aeruginosa RpoN type and Wild type.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.55 no.5
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• pp.278-285
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• 2006

A micro hotplate for micro gas sensor was fabricated by MEMS technology. In order to heat up the gas sensing material to a target temperature, a micro hotplate was built on the gas sensor. The sensing material was deposited on the heater and electrodes, and did not contact with the silicon base to minimize the heat loss to the silicon base. The electric power to heat up the gas sensor was measured. The temperature distribution of micro gas sensor was analyzed by a CFD program. The predicted electric power to heat up th sensing material showed a good agreement with the measured data. The design of micro gas sensor could be modified to increase the temperature uniformity and to decrease the electric power consumption by optimizing the layout of micro hotplate and electrodes.

• Proceedings of the Optical Society of Korea Conference
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• 2008.02a
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• pp.401-402
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• 2008