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The development of a variable capacitive pressure sensor for TPMS(tire pressure monitoring system)

TPMS 적용을 위한 가변 정전 용량형 압력센서 개발

  • Choi, Bum-Koo (Dept. of Mechanical Engineering, Sogang University) ;
  • Kim, Do-Hyung (Dept. of Mechanical Engineering, Sogang University) ;
  • Oh, Jae-Geun (Dept. of Mechanical Engineering, Sogang University)
  • Published : 2005.07.30

Abstract

In this study, a variable capacitive pressure sensor is fabricated for TPMS (Tire Pressure Monitoring System). This study is for developing sensors which consecutively measure the tire pressure given as 30 psi from the industrial standard. For improving non-linearity of the prior capacitive pressure sensors, it is suggested that touch mode capacitive pressure sensor be applied. In addition, initial capacitance is designed as small as possible for the conformity to the wireless sensor. ANSYS, commercial FEA package, is used for designing and simulating the sensor. The device is progressed by MEMS (Micro Electro Mechanical Systems) fabrication and packaged with PDMS. The result is obtained sensitivity, 1 pF/psi, through a pressure test. The simulation result is discrepant from experiment one. Wafer's uniformity is presumed as the main reason of discrepancy.

Keywords

References

  1. 이윤영, 'SAW sensor를 이용한 Tire Pressure MoniToring System 설계에 관한 연구', 서강대학교 공학석사 학위 논문, 2003
  2. M. Hill and J. D. Turner, 'Automotive tyre pressure sensing', Automotive Sensors, lEE Colloquium, pp. 5/1-5/6 , 1992
  3. W. H. Ko and Q. Wang, 'Touch mode capacitive pressure sensors for industrial applications', MEMS '97, Proceedings, IEEE., Tenth Annu al International Workshop, pp. 284-289 , 1997
  4. S. Yamamoto, H. Nakamura, H. Nishimura, T. Suzuki, T. Takizawa, and O. Nakao, 'Touch mode capacitive pressure sensors', Fujikura Technical Review, pp. 45-49, 2003
  5. W. H. Ko and Q. Wang, 'Touch mode capacitive pressure sensors', Sensors and Actuators A, vol. 75, pp. 242-25 1, 1999 https://doi.org/10.1016/S0924-4247(99)00069-2
  6. Q. Wang and W. H. Ko, 'Modeling of touch mode Capacitive pressure sensors and diaphragms', Sensors and Actuators A, vol. 75, pp. 230-241, 1999 https://doi.org/10.1016/S0924-4247(99)00068-0
  7. B. K. Choi and G. B. Lee, 'Modeling of stretching effects on the contacted diaphragm of pressure transducers by LIGA process', Sensors and Actuators A, vol. 69, pp. 192- 198, 1998 https://doi.org/10.1016/S0924-4247(98)00057-0
  8. D. M. Achneider et al., 'A new analytical solution for the load-deflection of square membranes', Journal of icorelectromechanical Systems, pp. 23824 1, 1995
  9. S. Timoshenko and S. Woinowsky-Krieger, Theory of Plates and Shells 2nd edition, McGRAW-HILL, 1981
  10. C.Y. Wang and c.c. Lee, 'An eutectic bonding technology at a temperature below the eutectic point', Electronic Components and Technology Conference, Proceedings., 42nd, pp. 502-507, 1992
  11. C.H. Tsau, S.M. Spearing, and M.A. Schmidt, 'Fabrication of wafer-level thermocompression bonds', Journal of Microelectromechanical Systems, vol. 11 , pp. 64 1-647, 2002 https://doi.org/10.1109/JMEMS.2002.805214
  12. W. B. Kim, Q. Wang, K. D. Jung, J. S. Hwang, and C. Y. Moon, 'Application of au-sn eutectic bond ing in hermetic RF MEMS wafer level packaging', Advanced Packaging Materials: Processes, Properties and Interfaces, 2004. Proceedings. 9th International Symposium, pp. 2 15-2 19, 2004