• Korean Chemical Engineering Research
• /
• v.47 no.2
• /
• pp.203-207
• /
• 2009

In the NCAs(non-conductive adhesive) for adhesion of Micro Electro Mechanical System(MEMS), there are some problems such as delamination and cracking, because of the differences of CTE(coefficients of thermal expansion) between NCAs and substrates. Addition of inorganic particle or flexibilizer have been performed to solve those problems. In this study, to improve the flexibility of epoxy adhesive, epoxy/siloxane composites were prepared by adding 1, 3, or 5 phr of amino modified siloxane(AMS). Glass transition temperatures(Tg), moduli and CTE of those composites were measured to confirm effects of siloxane on thermal/mechanical properties of siloxane/epoxy-composites. Tg of AMS/epoxy-composites decreased from $134^{\circ}C$ to $122^{\circ}C$ with increasing AMS contents and moduli decreased from 2,425 MPa to 2,143 MPa with increasing AMS contents. But CTE of AMS/epoxy-composites increased from $67ppm/^{\circ}C$ to $71ppm/^{\circ}C$ with increasing AMS contents. In short, the addition of siloxane is effective for enhancing the flexibility of epoxy but leads to the decrease of Tg.

• Journal of Institute of Convergence Technology
• /
• v.1 no.2
• /
• pp.6-15
• /
• 2011

This paper reports the design and fabrication of a micro-electro-mechanical-system(MEMS)-based electrostatic angular microactuator for a dual-stage servo. The proposed actuator employs a novel electrode pattern named "skewed electrode array(SEA)" scheme. It is shown that SEA has better linearity than a parallel plate type actuator and stronger force than a comb-drive based actuator. The moving and the fixed electrodes are arranged to make the driving force perpendicular to the rotating moment of arm. By changing the electrode overlap length, the magnitude of electrostatic force and stable displacement will be changed. In order to optimize the design, an electrostatic FE analysis was carried out and an empirical force model was established for SEA. A new assembly method which will allow the active electrodes to be located beneath the slider was developed. The active electrodes are connected by inner and outer rings lifted on the base substrate, and the inner and outer rings are connected to platform on which the slider locates. Electrostatic force between active electrodes and platform can be used for exiting out of plane modes, so this provides the possibility of the flying height control. A microactuator that can position the pico-slider over ${\pm}0.5{\mu}m$ using under 20 volts for a 2 kHz fine-tracking servo was designed and fabricated using SoG process.

• Applied Microscopy
• /
• v.47 no.3
• /
• pp.208-213
• /
• 2017

The microstructural changes in Co nanoparticles and an Au-10at.%Pd thin film have been investigated using an in situ heating holder with a micro-electro-mechanical system (MEMS). In Co nanoparticles, two phases (face-centered cubic and hexagonal close-packed crystal structures) were found to coexist at room temperature and microstructures at temperatures, higher than $1,000^{\circ}C$, were observed with a quick response time and significant stability. The actual temperature of each specimen was directly estimated from the changes in the lattice spacing (Bragg-peak separation). For the Au-10at.%Pd thin film, at a set temperature of $680^{\circ}C$, the actual temperature of the sample was estimated to be $1,020^{\circ}C{\pm}123^{\circ}C$. Note that the specimen temperature should be carefully evaluated because of the undesired effects, i.e., the temperature non-uniformity due to the sample design of the MEMS chip, and distortion due to thermal expansion.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.23 no.2
• /
• pp.89-92
• /
• 2010

A bolometer sensor used in an infrared thermal imaging system has many advantages on the process because it does not need a separate cooling system and its manufacturing is easy. However the sensitivity of the bolometer is low and the fixed pattern noise(FPN) is large, because the bolometer sensor is made by micro electro mechanical systems (MEMS). These problems can be fixed-by using the high performance readout integrated circuit(ROIC) with noise reduction techniques. In this paper, we propose differential delta sampling circuit to remove the mismatch noise of ROIC itself, the FPN of the bolometer. And for reduction of FPN noise, the reference signal compensation circuit which compensate the reference signal by using on-resistance of MOS transistor was proposed.

• Journal of the Korea Institute of Information and Communication Engineering
• /
• v.22 no.10
• /
• pp.1307-1313
• /
• 2018

In recent years, there have been frequent occurrences of collapsing buildings and tilting accidents due to frequent earthquakes and aging of buildings. Various methods have been proposed to prevent disasters on these buildings. In this paper, we propose a system that provides an indication of anomalous phenomena such as collapse and tilting of buildings by real-time monitoring of IoT(Internet of Things) based architectural anomalies. The MEMS sensor is based on the inclinometer sensor and the accelerometer sensor, transmits the detected data to the server in real time, accumulates the data, and provides the service to cope when the set threshold value is different. It is possible to evacuate and repair the collapse and tilting of the building by warning the occurrence of the upper threshold event such as the collapse and tilting of the building.

• Journal of the Microelectronics and Packaging Society
• /
• v.30 no.2
• /
• pp.13-20
• /
• 2023

The process of microelectromechanical system (MEMS) fabrication involves surface treatment to impart functionality to the device. Such surface treatment method is the self-assembled monolayer (SAM) technique, which modifies and functionalizes the surface of MEMS components with organic molecule monolayer, possessing a precisely controllable strength that depends on immersion time and solution concentration. These monolayers spontaneously adsorb on polymeric substrates or metal/ceramic components offering high precision at the nanoscale and modifying surface properties. SAM technology has been utilized in various fields, such as tribological property control, mass-production lithography, and ultrasensitive organic/biomolecular sensor applications. This paper provides an overview of the development and application of SAM technology in various fields.

• Journal of the Institute of Electronics and Information Engineers
• /
• v.54 no.3
• /
• pp.31-36
• /
• 2017

In this paper, designed infrared (IR) emitter device for infrared scene projector (IRSP) which is used for evaluating the performance of IR sensor systems was simulated by using finite element analysis (FEA) tool and fabricated by using MEMS (Micro Electro-Mechanical System) technology. The performance of the fabricated IR emitter unit device was characterized in the vacuum chamber by using IR image microscope for MWIR($3{\sim}5{\mu}m$), which showed 423K apparent temperature (Tapp) and 22msec time constant (${\tau}$).

• The Journal of Korean Institute of Electromagnetic Engineering and Science
• /
• v.14 no.12
• /
• pp.1292-1299
• /
• 2003

In this paper, we fabricated new GaAs-based dielectric-supported air gapped microstriplines(DAMLs) using the surface MEMS and the LPF for Ka-band using the fabricated DAMLs. We elevated the signal lines from the substrate, in order to reduce the substrate dielectric loss and obtain low losses at millimeter-wave frequency band with wide impedance range. We fabricated LPF with DAMLs for Ka-band. Due to reducing the dielectric loss of DAMLs, the insertion loss of LPF can be reduced. Miniature is essential to integrate LPF with active devices, so that we fabricated LPF with the slot on the ground to reduce the size of the LPF. We compared a characteristic to LPF with the slot and LPF without the slot.

• Smart Structures and Systems
• /
• v.6 no.3
• /
• pp.225-238
• /
• 2010

We report on the development of a new technology for the fabrication of Micro-Electro-Mechanical-System (MEMS) strain sensors to realize a novel type of crackmeter for health monitoring of ageing civil infrastructures. The fabrication of micromachined silicon MEMS sensors based on a Silicon On Insulator (SOI) technology, designed according to a Double Ended Tuning Fork (DETF) geometry is presented, using a novel process which includes a gap narrowing procedure suitable to fabricate sensors with low motional resistance. In order to employ these sensors for crack monitoring, techniques suited for bonding the MEMS sensors on a steel surface ensuring good strain transfer from steel to silicon and a packaging technique for the bonded sensors are proposed, conceived for realizing a low-power crackmeter for ageing infrastructure monitoring. Moreover, the design of a possible crackmeter geometry suited for detection of crack contraction and expansion with a resolution of $10{\mu}m$ and very low power consumption requirements (potentially suitable for wireless operation) is presented. In these sensors, the small crackmeter range for the first field use is related to long-term observation on existing cracks in underground tunnel test sections.

• Journal of the Institute of Electronics and Information Engineers
• /
• v.51 no.6
• /
• pp.78-86
• /
• 2014

In this paper, a novel intensity-based fiber optic vibration sensor using a mass-spring structure, which consists of four serpentine flexure springs and a rectangular aperture within a proof mass, is proposed and its feasibility test is given by the simulation and experiment. An optical collimator is used to broaden the beam which is modulated by the displacement of the rectangular aperture within the proof mass. The proposed fiber optic vibration sensor has been analyzed and designed in terms of the optical and mechanical parts. A mechanical structure has been designed using theoretical analysis, mathematical modeling, and 3D FEM (Finite Element Method) simulation. The relative aperture displacement according to the base vibration is given using FEM simulation, while the output beam power according to the relative displacement is measured by experiment. The simulated sensor sensitivity of $15.731{\mu}W/G$ and detection range of ${\pm}6.087G$ are given. By using reference signal, the output signal with 0.75% relative error shows a good stability. The proposed vibration sensor structure has the advantages of a simple structure, low cost, and multi-point sensing characteristic. It also has the potential to be made by MEMS (Micro-Electro-Mechanical System) technology.