• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.10
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• pp.883-888
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• 2002

SiC direct bonding technology is very attractive for both SiCOI(SiC-on-insulator) electric devices and SiC-MEMS(micro electro mechanical system) fields because of its application possibility in harsh environments. This paper presents pre-bonding techniques with variation of HF pre-treatment conditions for SiC wafer direct bonding using PECVD(plasma enhanced chemical vapor deposition) oxide. The PECYD oxide was characterized by XPS(X-ray photoelectron spectrometer) and AFM(atomic force microscopy). The characteristics of the bonded sample were measured under different bonding conditions of HF concentration and an applied pressure. The bonding strength was evaluated by the tensile strength method. The bonded interface was analyzed by using SEM(scanning electron microscope). Components existed in the interlayer were analyzed by using FT-IR(fourier transform infrared spectroscopy). The bonding strength was varied with HF pre-treatment conditions before the pre-bonding in the range of 5.3 kgf/cm$^2$to 15.5 kgf/cm$^2$.

• Proceedings of the KIEE Conference
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• 1999.07g
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• pp.3307-3309
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• 1999

Electrochemical discharge machining (ECDM) is a very recent technique in the fabrication of the micro-electro-mechanical system ( MEMS ) devices. This paper presents the experimental results of the machining of micro-holes on pyrex glass substrates by use of ECDM. Electrolyte is used with a KOH aqueous solution, cathode with copper, anode with platinum, and tool feed system is applied with gravity feed system. Already established experimental results were taken under the condition of constant voltage frequency. However in this paper, the effect of variation of the voltage frequency and duty ratio is considered. In this experiment, it is measured the ECDM performances with variation of the voltage frequency and duty ratio under the conditions of constant other machining variables. ECDM performances are described by the hole depth, and the top hole diameter.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.15 no.3
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• pp.271-277
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• 2004

A Si(Silicon) MEMS(Micro Electro Mechanical System) package using a doped lossy Si carrier for CPW(Coplanar Waveguide) MMICs(Microwave and Millimeter-wave Integrated Circuits) is proposed in order to reduce parasitic problems of leakage, coupling and resonance. The proposed chip-carrier scheme is verified by fabricating and measuring a GaAs CPW on the two types of carriers(conductor-back metal, doped lossy Si) in the frequency from 0.5 to 40 ㎓. The proposed MEMS package using the lightly doped lossy(15 Ω$.$cm) Si chip-carrier and the HRS(High Resistivity Silicon, 15 ㏀$.$cm) shows the optimized loss and parasitic problems-free since the doped lossy Si-carrier effectively absorbs and suppresses the resonant leakage. The Si MEMS package for CPW MMICs has an insertion loss of only - 2.0 ㏈ and a power loss of - 7.5 ㏈ at 40 ㎓.

• The Journal of the Korea institute of electronic communication sciences
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• v.12 no.2
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• pp.315-324
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• 2017

The smart grid with distributed power supply introduces a number of problems including not only the problems of the existing power grid but also the problem of protection co-operation due to new electric phenomenon because it has a mixed operation structure combining the existing radial operation structure and the new loop operation structure. The EMTP based power system analysis method has flexibility and convenience from the view of system configuration but it requires another experimental verification because of uncertainty of design and analysis results. On the other hand, the real demonstration system has difficulties in observing accurate fault on large scale system due to considerable economical and spatial construction cost, system configuration constraint, and it is difficult to demonstrate the distributed, autonomous and adaptive control strategy of smart grid. In this paper, a basic theory for a micro smart grid simulator design using MEMS(Micro Electro-Mechanical Systems) miniaturization technology is studied which can safely and freely experiment and observe electrical phenomena, and distribution, autonomous adaptive control strategy for disturbances on 22.9kV smart grid under minimum economic and spatial cost.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.3 s.40
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• pp.9-12
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• 2006

We have designed and fabricated micro power generators by electroplating which is important in MEMS(micro electro mechanical system) technique. We have electroplated MEMS coils on the glass substrates and have chosen one of these coils for experiments. The thickness, width, and length of the coil are $7{\mu}m,\;20{\mu}m$, and 1.6 m, respectively. We have analyzed the structure of MEMS coil by SEM. We have made a vibrating system for reproducible results in measurement. With reciprocating a magnet on the surface of a fabricated winding coil, the micro power generator produce an alternating voltage. We have changed the vibrational frequency from 0.5 Hz to 8 Hz. The generated voltage was 106 mV at 3 Hz and 198 mV at 6 Hz. We aim at the micro power generator which can change vibration energy to useful electric energy.

• Journal of Positioning, Navigation, and Timing
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• v.4 no.3
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• pp.141-150
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• 2015

In this study, a Global Navigation Satellite System (GNSS) / Inertial Navigation System (INS) / odometer / barometer integrated navigation system that uses a commercial navigation device including Micro Electro Mechanical Systems (MEMS) accelerometer and gyroscope in addition to GNSS, odometer information obtained from a vehicle, and a separate MEMS barometer sensor was implemented, and the performance was verified. In the case of GNSS and GNSS/INS integrated navigation system that are generally used in a navigation device, the performance would deteriorate in areas where GNSS signals are not available. Therefore, an integrated navigation system that calculates a better navigation solution in areas where GNSS signals are not available compared to general GNSS/INS by correcting the velocity error of GNSS/INS using an odometer and by correcting the cumulative altitude error of GNSS/INS using a barometer was suggested. To verify the performance of the navigation system, a commercial navigation device (Softman, Hyundai Mnsoft, http://www.hyundai-mnsoft.com) and a barometer sensor (ST Company) were installed at a vehicle, and an actual driving test was performed. To examine the performance of the algorithm, the navigation solutions of general GNSS/INS and the GNSS/INS/odometer/barometer integrated navigation system were compared in an area where GNSS signals are not available. As a result, a navigation solution that has a smaller position error than that of GNSS/INS could be obtained in the area where GNSS signals are not available.

• Smart Structures and Systems
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• v.18 no.4
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• pp.787-800
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• 2016

The aim of the paper is to analyze nonlinear transverse vibration of an embedded piezoelectric plate reinforced with single walled carbon nanotubes (SWCNTs). The system in rested in a Pasternak foundation. The micro-electro-mechanical model is employed to calculate mechanical and electrical properties of nanocomposite. Using nonlinear strain-displacement relations and considering charge equation for coupling between electrical and mechanical fields, the motion equations are derived based on energy method and Hamilton's principle. These equations can't be solved analytically due to their nonlinear terms. Hence, differential quadrature method (DQM) is employed to solve the governing differential equations for the case when all four ends are clamped supported and free electrical boundary condition. The influences of the elastic medium, volume fraction and orientation angle of the SWCNTs reinforcement and aspect ratio are shown on frequency of structure. The results indicate that with increasing volume fraction of SWCNTs, the frequency increases. This study might be useful for the design and smart control of nano/micro devices such as MEMS and NEMS.

• Journal of Powder Materials
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• v.20 no.5
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• pp.355-358
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• 2013

Micro trench structures are applied in gratings, security films, wave guides, and micro fluidics. These micro trench structures have commonly been fabricated by micro electro mechanical system (MEMS) process. However, if the micro trench structures are machined using a diamond tool on large area plate, the resulting process is the most effective manufacturing method for products with high quality surfaces and outstanding optical characteristics. A nonferrous metal has been used as a workpiece; recently, and hybrid materials, including polymer materials, have been applied to mold for display fields. Thus, the machining characteristics of polymer materials should be analyzed. In this study, machining characteristics were compared between nonferrous metals and polymer materials using single crystal diamond (SCD) tools; the use of such materials is increasing in machining applications. The experiment was conducted using a square type diamond tool and a shaper machine tool with cutting depths of 2, 4, 6 and 10 ${\mu}m$ and a cutting speed of 200 mm/s. The machined surfaces, chip, and cutting force were compared through the experiment.

• Proceedings of the Optical Society of Korea Conference
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• 2000.02a
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• pp.32-33
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• 2000

최근 디지털 정보 처리 기술의 획기적인 발전과 함께 저가의 반도체 레이저의 개발로 말미암아 광기록 장치(optical pickup device) 및 고속 광통신(optical fiber communication)분야에 응용을 위한 레이저 광학 시스템에 대한 연구가 활발하다. 광신호의 커플링(coupling) 및 스위칭(switching)을 기반으로 하는 이러한 광학 시스템은 일반적으로 광신호의 변조를 위한 광학 요소와 광학 요소의 공간적 제어를 위한 정밀 구동기로 구성되는데, 기존의 상용 시스템의 경우에는 독립적으로 기 제작된 광학 요소와 정밀 구동기를 사후에 조립하는 방법으로 소기의 목적을 달성하였다. 이와 같은 경우 제작에 많은 노력과 비용이 요구되며, 성능의 획기적인 향상을 기대하기 어려우므로 최근에는 Optical MEMS 혹은 MOEMS(Micro-Opto-Electro-Mechanical System)로 대변되는 마이크로머시닝기술(micromachining technology)을 이용한 초정밀 광학계의 제작 기술을 통하여 기존 시스템의 한계를 극복하고자 하는 노력이 다각도로 모색되고 있다. (중략)

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.19 no.1
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• pp.61-70
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• 2008

This paper presents the flexible MEMS transmitter based on flexible printed circuit board or FPCB, which can be transformed to arbitrary shape. The FPCB is suitable to fabricate light weight and small size modules with the help of its thin thickness. Moreover a module based on FPCB can be attached on the arbitrary curved surface due to its flexible enough to be lolled up like paper. In this paper, the flexible MEMS transmitter integrated on FPCB for a short-distance sensor network which is based on orthogonal frequency division multiplexing(OFDM) communication system is proposed. The active device of the proposed flexible MEMS transmitter is fabricated on InGaP/GaAs HBT process which has been used for power amplifier design to take advantages of high linear and high efficient characteristics. Moreover, the passive devices such as the filter and signal lines are integrated and fabricated on the FPCB board. The performance of the fabricated flexible MEMS transmitter is analyzed with EVM characteristics of the output signal.