• 대한전기학회:학술대회논문집
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• 대한전기학회 1998년도 하계학술대회 논문집 G
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• pp.2536-2538
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• 1998

This paper investigates the residual stress of tetraethoxysilane (TEOS) and 7wt% phosphosilicate glass (PSG), which are commonly used as a sacrificial layer or etch mask in the fabrication of microelectromechanical systems (MEMS). In order to measure residual stress, $2{\mu}m$ thick TEOS and PSG stress measurement structures are fabricated. Polysilicon is used as the sacrificial layer. First the residual stress of an as-deposited 7wt% PSG flim and TEOS film are measured to be-0.3115% and -0.435%, respectively, which are quite large. These films are annealed from $500^{\circ}C$ to $800^{\circ}C$. Annealing has the effects of reducing residual stress. In the case of the 7wt% PSG film, the residual stress becomes +0.00715% after annealing at $625^{\circ}C$ for 150 minutes. In the case of TEOS film, the residual stress reduces to -0.2134% after same condition. Incidentally, this condition is the same condition for depositing a $2{\mu}m$ thick polysilicon at $625^{\circ}C$ at our low pressure chemical vapor deposition (LPCVD) furnace.

• Applied Microscopy
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• 제49권
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• pp.3.1-3.7
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• 2019

Graphene, which is one of the most promising materials for its state-of-the-art applications, has received extensive attention because of its superior mechanical properties. However, there is little experimental evidence related to the mechanical properties of graphene at the atomic level because of the challenges associated with transferring atomically-thin two-dimensional (2D) materials onto microelectromechanical systems (MEMS) devices. In this study, we show successful dry transfer with a gel material of a stable, clean, and free-standing exfoliated graphene film onto a push-to-pull (PTP) device, which is a MEMS device used for uniaxial tensile testing in in situ transmission electron microscopy (TEM). Through the results of optical microscopy, Raman spectroscopy, and TEM, we demonstrate high quality exfoliated graphene on the PTP device. Finally, the stress-strain results corresponding to propagating cracks in folded graphene were simultaneously obtained during the tensile tests in TEM. The zigzag and armchair edges of graphene confirmed that the fracture occurred in association with the hexagonal lattice structure of graphene while the tensile testing. In the wake of the results, we envision the dedicated preparation and in situ TEM tensile experiments advance the understanding of the relationship between the mechanical properties and structural characteristics of 2D materials.

• 한국생산제조학회지
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• 제25권1호
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• pp.62-67
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• 2016

This paper presents a silicon nanostructure array embedded in a polymer film. The silicon nanostructure array was fabricated by using basic microelectromechanical systems (MEMS) processes such as photolithography, reactive ion etching, and anisotropic KOH wet etching. The fabricated silicon nanostructure array was transferred into polymer substrates such as polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), and polycarbonate (PC) through the hot-embossing process. In order to determine the transfer conditions under which the silicon nanostructures do not fracture, hot-embossing experiments were performed at various temperatures, pressures, and pressing times. Transfer was successfully achieved with a pressure of 1 MPa and a temperature higher than the transition temperature for the three types of polymer substrates. The transferred silicon nanostructure array was electrically evaluated through measurements with a semiconductor parameter analyzer (SPA).

• 한국해양공학회지
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• 제31권2호
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• pp.177-182
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• 2017

This paper describes an unscented Kalman filter approach to estimate the bias in magnetic field measurements. A microelectromechanical systems attitude heading reference system (MEMS AHRS) was used to measure the magnetic field, together with the acceleration and angular rate. A magnetic field is usually used for yaw detection, while the acceleration serves to detect the roll and pitch. Magnetic field measurements are vulnerable to distortion due to hard-iron effect and soft-iron effect. The bias in the measurement accounts for the hard-iron effect, and this paper focuses on an approach to estimate this bias. The proposed method is compared with other methods through experiments that implement the navigation of an underwater robot using an AHRS and Doppler velocity log. The results verify that the compensation of the bias by the proposed method improves the navigation performance more than or comparable to the compensation by other methods.

• 대한설비공학회:학술대회논문집
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• 대한설비공학회 2006년도 하계학술발표대회 논문집
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• pp.477-482
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• 2006

In this study, a micro vapor compressor has been designed, fabricated and tested. The micro vapor compressor was made of silicon substrates and fabricated by micromachining process. The compressor is driven by a piezoelectric actuator which is widely used in microfluidic systems because of its strong force and rapid response. The actuator is a bimorph structure which consists of a silicon membrane and a piezoelectric ceramic film. A simulation work was conducted on the performance characteristics of the compressor. The simulation investigated the flow rate variation under various back pressure conditions. Experimental works were carried out on the operation of a compressor and the test results were compared with the simulation results.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.418-418
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• 2008

The electrochemical etching of silicon in HF-based solutions is known to form various types of porous structures. Porous structures are generally classified into three categories according to pore sizes: micropore (below 2 nm in size), mesopore (2 ~ 50 nm), and macropore (above 50 nm). Recently, the formation of macropores has attracted increasing interest because of their promising characteristics for an wide scope of applications such as microelectromechanical systems (MEMS), chemical sensors, biotechnology, photonic crystals, and photovoltaic application. One of the promising applications of macropores is in the field of MEMS. Anisotropic etching is essential step for fabrication of MEMS. Conventional wet etching has advantages such as low processing cost and high throughput, but it is unsuitable to fabricate high-aspect-ratio structures with vertical sidewalls due to its inherent etching characteristics along certain crystal orientations. Reactive ion dry etching is another technique of anisotropic etching. This has excellent ability to fabricate high-aspect-ratio structures with vertical sidewalls and high accuracy. However, its high processing cost is one of the bottlenecks for widely successful commercialization of MEMS. In contrast, by using electrochemical etching method together with pre-patterning by lithographic step, regular macropore arrays with very high-aspect-ratio up to 250 can be obtained. The formed macropores have very smooth surface and side, unlike deep reactive ion etching where surfaces are damaged and wavy. Especially, to make vertical microwire or nanowire arrays (aspect ratio = over 1:100) on silicon wafer with top-down photolithography, it is very difficult to fabricate them with conventional dry etching. The electrochemical etching is the most proper candidate to do it. The pillar structures are demonstrated for n-type silicon and the formation mechanism is well explained, while such a experimental results are few for p-type silicon. In this report, In order to understand the roles played by the kinds of etching solution and mask patterns in the formation of microwire arrays, we have undertaken a systematic study of the solvent effects in mixtures of HF, dimethyl sulfoxide (DMSO), iso-propanol, and mixtures of HF with water on the structure formation on monocrystalline p-type silicon with a resistivity with 10 ~ 20 $\Omega{\cdot}cm$. The different morphological results are presented according to mask patterns and etching solutions.

• 센서학회지
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• 제8권3호
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• pp.265-273
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• 1999

본 논문에서는 MEMS 공정에 많이 사용되는 tetraethoxysilane (TEOS) 산화막, low temperature oxide (LTO), 7 wt%, 10 wt% phosphosilicate glass (PSG)의 잔류응력을 Euler beam과 bent-beam strain sensor를 제작하여 측정하였다. 이러한 산화막 잔류응력 측정 구조물을 만들기 위해 다결정실리콘을 희생층으로 사용하였으며 $XeF_2$를 이용하여 희생층 식각을 하였다. 먼저 각 산화막의 증착 당시 잔류응력을 측정한 후 $500^{\circ}C$에서 $800^{\circ}C$까지 질소분위기에서 1 시간 동안 열처리하였다. 또 표면미세가공에서 가장 많이 사용되는 $585^{\circ}C$, $625^{\circ}C$ 다결정실리콘 증착 조건에서 열처리하여 산화막의 잔류응력 변화를 측정하였다. 측정 결과 TEOS와 LTO, 7 wt% PSG는 $600^{\circ}C$ 이하에서 압축잔류응력이 줄어들다가 그 이상에서 다시 커지는 반면에 phosphorus 농도가 높은 10 wt% PSG의 경우는 $500^{\circ}C$이상에서 압축잔류응력이 증가하는 것을 확인하였다. 또 7 wt% PSG가 $585^{\circ}C$ 다결정실리콘 증착 시 가장 작은 잔류응력을 나타내었다.

• Advances in nano research
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• 제16권3호
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• pp.289-301
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• 2024

In this work, an analytical model employing a new higher-order shear deformation beam theory is utilized to investigate the bending behavior of axially randomly oriented functionally graded carbon nanotubes reinforced composite nanobeams. A modified continuum nonlocal strain gradient theory is employed to incorporate both microstructural effects and geometric nano-scale length scales. The extended rule of mixture, along with molecular dynamics simulations, is used to assess the equivalent mechanical properties of functionally graded carbon nanotubes reinforced composite (FG-CNTRC) beams. Carbon nanotube reinforcements are randomly distributed axially along the length of the beam. The equilibrium equations, accompanied by nonclassical boundary conditions, are formulated, and Navier's procedure is used to solve the resulting differential equation, yielding the response of the nanobeam under various mechanical loadings, including uniform, linear, and sinusoidal loads. Numerical analysis is conducted to examine the influence of inhomogeneity parameters, geometric parameters, types of loading, as well as nonlocal and length scale parameters on the deflections and stresses of axially functionally graded carbon nanotubes reinforced composite (AFG CNTRC) nanobeams. The results indicate that, in contrast to the nonlocal parameter, the beam stiffness is increased by both the CNTs volume fraction and the length-scale parameter. The presented model is applicable for designing and analyzing microelectromechanical systems (MEMS) and nanoelectromechanical systems (NEMS) constructed from carbon nanotubes reinforced composite nanobeams.

• 대한의용생체공학회:의공학회지
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• 제28권3호
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• pp.348-354
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• 2007

Polymer actuators, which are also called as smart materials, change their shapes when electrical, chemical, thermal, or magnetic energy is applied to them and are useful in wide variety of applications such as microelectromechanical systems (MEMS), machine components, and artificial muscles. For this study, Polyaniline/carbon-nanotube polymer actuator that is one of electroactive polymer actuators was prepared. Since the nonlinear phenomena of hysteresis and a step response are essential considerations for practical use of polymer actuators, we have investigated the movement of the Polyaniline/carbon-nanotube polymer actuator and have developed an integrated model that can be used for simulating and predicting the hysteresis and a step response during actuation. The Preisach hysteresis model, one of the most popular phenomenological models of hysteresis, were used for describing the hysteretic behavior of Polyaniline/carbon-nanotube polymer actuator while the ARX method, one of system identification techniques, were used for modeling a step response. In this paper, we first expain details in preparation of the Polyaniline/carbon-nanotube polymer then present the mathematical description of our model, the extraction of the parameters, simulation results from the model, and finally a comparison with measured data.

• 한국진공학회지
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• 제18권2호
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• pp.85-91
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• 2009

현재 플렉시블 폴리머를 이용한 MEMS (Microelectromechanical Systems) 기술이 빠르게 발전하고 있다. 그 중에서 Polycarbonate (PC), Poly Methyl Methacrylate (PMMA)와 같은 플렉시블 폴리머 재료는 광학적 특성이 우수하고 인체 친화적이며 미세 패턴 제조 공정이 용이하다는 등의 많은 장점을 가지고 있다. 본 연구는 반응성 이온 식각 기술을 이용하여 $O_2$, $SF_6$ 그리고 $CH_4$의 삼성분계 가스의 혼합 비율에 따른 PC와 PMMA의 건식 식각 결과 및 특성 평가에 관한 것이다. 준비한 각각의 기판에 포토리소그래피 방법으로 마스크를 형성하여 샘플을 만들었다. RF 척 파워를 100 W, 총 가스 유량을 10 sccm으로 고정시켜 플라즈마 식각 실험을 실시하였다. 그 결과에 의하면 전체적으로 PMMA의 식각율이 PC보다는 약 2배 정도 높았다. 그 결과는 PC는 PMMA 보다 상대적으로 높은 녹는점을 가지고 있다는 사실과 관계가 있다고 생각한다. 또한 $O_2/SF_6/CH_4$의 삼성분계 가스와 $SF_6/CH_4$, $O_2/SF_6$, $O_3/CH_4$로 나누었을 때 $O_2/SF_6$의 혼합 가스에서 PMMA와 PC의 식각 속도가 가장 높았다 (PC: 5 sccm $O_2$/5 sccm $SF_6$에서 약 350 nm/min, PMMA: 2.5 sccm $O_2$/7.5 sccm $SF_6$에서 약 570 nm/min). SEM을 활용하여 식각된 표면을 분석한 결과 PC는 PMMA보다 상대적으로 식각 표면이 더 매끈하였다. 또한 표면 거칠기 분석결과 PC의 표면 거칠기는 1.9$\sim$3.88 nm이었지만 PMMA의 표면 거칠기는 17.3$\sim$26.1 nm로 현저하게 높았음을 확인할 수 있었다.