• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.10
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• pp.853-858
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• 2003

In this study, a new simplified technology for fabricating high density trench gate DMOSFETs using only three mask layers and TEOS/nitride spacer is proposed. Due to the reduced masking steps and self-aligned process, this technique can afford to fabricate DMOSFETs with high cell density up to 100 Mcell/inch$^2$ and cost-effective production. The resulting unit cell pitch was 2.3∼2.4${\mu}$m. The fabricated device exhibited a excellent specific on-resistance characteristic of 0.36m$\Omega$. cm$^2$ with a breakdown voltage of 42V. Moreover, time to breakdown of gate oxide was remarkably increased by the hydrogen annealing after trench etching.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1996.11a
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• pp.160-163
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• 1996

To develope output characteristics of GaAs MESFET, which utilized in high frequency ranges, $Al_{0.2}$Ga$_{0.8}$As/GaAs layer was used. In this case, to minimize effects of deep-level in $Al_{0.2}$Ga$_{0.8}$As/GaAs layer, aluminium mole fraction was design to 0.2. HP 4145B was used in measurement, I$_{dss}$ was 25mA when V$_{G}$=0. Maximum transconductance was 168.75mS/mm, electron mobility was 3750 $\textrm{cm}^2$/V-s, therefore, it must be suitable for active device in MMIC. Also, Ideality factor was 1.26, which was similar to that of ideal schottky diode.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.679-682
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• 2007

We have developed low voltage operating OLEDs with new electron transport layer. The device having a structure of ITO/2TNATA/HTL:Rubrene(1%)/HTL /new ETL/LiF/Al have been used. The voltage for achieving $1,000\;cd/m^2$ was 4.1 V, whereas the turn on voltage for the brightness of $1\;cd/m^2$ was 2.8 V. This high luminance at low operating voltage is caused by the high current density, resulting from high electron conduction property of the new electron transport layer.

• Journal of Radiation Protection and Research
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• v.44 no.2
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• pp.79-88
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• 2019

Background: The main goal of experiments is to compare various operational and technical characteristics of D-Shuttle semiconductor personal dosimeters of the Japanese company "Chiyoda Technol Corporation" and Harshaw thermoluminescent dosimeters (TLD) manufactured by "Thermo Fisher Scientific" and DTL-02 of the Russian Research and Production Enterprise (RPE) "Doza" by their occupational and calibration exposure at various dose equivalents from 0.5 to 20 mSv of gamma-radiation. Materials and Methods: Besides dosimeters DTL-02, D-Shuttle and Harshaw TLD, there were also used: (1) the primary reference radionuclide source Hopewell Designs IAEA: G10-1-12 with $^{137}Cs$ isotope (an error is not more than 6% and activity is 20 Ci), and (2) the verification device UPGD-2M of RPE "Doza" and installed in the National Center for Expertise and Certification of the Republic of Kazakhstan (Kapchagai, the National Center for Expertise and Certification). Results and Discussion: The main results of researches are the following: (1) TLDs for Harshaw 6600 and DVG-02TM have an approximately equal measurement accuracy of the individual dose equivalents in the range from 0.5 to 20 mSv of gamma-radiation. (2) Advantages of dosimeters for Harshaw 6600 are due to the high measurement productivity and opportunity to indicate the dose on the skin $H_p$(0.07). Advantages of DVG-02TM consist of operation simplicity and lower cost than of Harshaw 6600. (3) D-Shuttles are convenient for use in the current and the operational monitoring of ionizing radiation. Measurement accuracy and 10% linearity of measurements are ensured when D-Shuttle is irradiated with dose equivalents below 1 mSv at the equivalent dose rate not higher than $3mSv{\cdot}hr^{-1}$. This allows using D-Shuttle at a routine technological activity. Conclusion: The obtained results of experiments demonstrate advantages and disadvantages of D-Shuttle semiconductor dosimeters in comparison with two TLD systems of DVG-02TM and Harshaw 6600.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.425-425
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• 2008

Bismuth-antimony-telluride based thermoelectric thin film materials were prepared by metal organic vapor phase deposition using trimethylbismuth, triethylantimony and diisopropyltelluride as metal organic sources. A planar type thermoelectric device has been fabricated using p-type $Bi_{0.4}Sb_{1.6}Te_3$ and n-type $Bi_2Te_3$ thin films. Firstly, the p-type thermoelectric element was patterned after growth of $4{\mu}m$ thickness of $Bi_{0.4}Sb_{1.6}Te_3$ layer. Again n-type $Bi_2Te_3$ film was grown onto the patterned p-type thermoelectric film and n-type strips are formed by using selective chemical etchant for $Bi_2Te_3$. The top electrical connector was formed by thermally deposited metal film. The generator consists of 20 pairs of p- and n-type legs. We demonstrate complex structures of different conduction types of thermoelectric element on same substrate by two separate runs of MOCVD with etch-stop layer and selective etchant for n-type thermoelectric material. Device performance was evaluated on a number of thermoelectric devices. To demonstrate power generation, one side of the device was heated by heating block and the voltage output was measured. The highest estimated power of 1.3mW is obtained at the temperature difference of 45K. We provide a promising approach for fabricating thin film thermoelectric generators by using MOCVD grown thermoelectric materials which can employ nanostructures for high thermoelectric properties.

• Proceedings of the IEEK Conference
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• 2001.06b
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• pp.229-232
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• 2001

4H-SIC(silicon carbide) MESFET large signal model was studied using modified Materka-Kacprzak large signal MESFET model. 4H-SiC MESFET device simulation have been conducted by Silvaco's 2D device simulator, ATLAS. The result is modeled using modified Materka large signal model. simulation and modeling results are -8V pinch off voltage, under $V_{GS=0V}$, $V_{DS=25V}$ conditions, $I_{DSS=270㎃}$mm, $G_{m=45㎳}$mm were obtained. Through the power simulation 2GHz, at the bias of $V_{GS=-4V}$ and $V_{DS=25V}$, 10dB Gain, 34dBm(1dB compression point)output power, 7.6W/mm power density, 37% PAE(power added efficiency) were obtained.d.d.d.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.5
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• pp.443-447
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• 2009

Bismuth-antimony-telluride based thermoelectric thin film materials were prepared by metal organic vapor phase deposition using trimethylbismuth, triethylantimony and diisopropyltelluride as metal organic sources. A planar type thermoelectric device has been fabricated using p-type $Bi_{0.4}Sb_{1.6}Te_3$ and n-type $Bi_{2}Te_{3}$ thin films. Firstly, the p-type thermoelectric element was patterned after growth of $5{\mu}m$ thickness of $Bi_{0.4}Sb_{1.6}Te_3$ layer. Again n-type $Bi_{2}Te_{3}$ film was grown onto the patterned p-type thermoelectric film and n-type strips are formed by using selective chemical etchant for $Bi_{2}Te_{3}$. The top electrical connector was formed by thermally deposited metal film. The generator consists of 20 pairs of p- and n-type legs. We demonstrate complex structures of different conduction types of thermoelectric element on same substrate by two separate runs of MOCVD with etch-stop layer and selective etchant for n-type thermoelectric material. Device performance was evaluated on a number of thermoelectric devices. To demonstrate power generation, one side of the device was heated by heating block and the voltage output was measured. The highest estimated power of 1.3 ${\mu}m$ is obtained at the temperature difference of 45 K.

• Bulletin of the Korean Chemical Society
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• v.31 no.2
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• pp.389-396
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• 2010

In this paper, we reported the synthesis and electroluminescent properties of blue fluorescent styrylamine derivatives end-capped with a diphenylvinyl group. A new series of styrylamine derivatives have been synthesized via the Horner-Wadsworth-Emmons reaction. To explore electroluminescent properties of these molecules, multilayer organic lighte-mitting devices with the configuration of ITO/NPB/1-5 doped in MADN/Bphen/Liq/Al were fabricated. All devices exhibited blue emissions with good EL performances. Among those reported herein, the device using dopant 5 exhibited a maximum luminance of $24,000\;cd/m^2$ at 11.0 V, a luminous efficiency of 12.5 cd/A at $20\;mA/cm^2$, a power efficiency of 6.50 lm/W at $20\;mA/cm^2$, and $CIE_{x,y}$ coordinates of (x = 0.173, y = 0.306) at 8.0 V, all of which demonstrate the superiority of these materials in blue OLEDs.

• Journal of the Korean Vacuum Society
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• v.8 no.4A
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• pp.490-495
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• 1999

In 0.18 $\mu \textrm m$ LOGIC device, the etch rate of NMOS polysilicons is different from that of PMOS polysilicons due to the state of polysilicon to manufacture gate line. To control the etch profile, we tested the ratio of $Cl_2$/HBr gas and the total chamber pressure, and also we reduced Back He pressure to get the vertical profile. In the case of manufacturing the gate photoresist line, we used Bottom Anti-Reflective Coating (BARC) to protect refrection of light. As a result we found that $CF_4O_2$ gas is good to etch BARC, because of high selectivity and good photoresist line profile after etching BARC. in the results of the characterization of plasma damage to the antenna effect of gate oxide, NO type thin film(growing gate oxide in 0, ambient followed by an NO anneal) is better than wet type thin film(growing gate oxide in $0_2+H_2$ ambient).

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.7
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• pp.176-184
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• 1996

To overcome the drawbacks of conventional LDMOSFETs, we propose RESURF EDMOSFETs which can be adapted in varous circuit applications, be driven without charge pumping circuity and thowe threshold voltage can be adjusted. The devices have the diffused drift region formed by a high tmperature process before the gate oxidaton. After the polysilicon gate electrode formation, a fraction of the drift region around the gate edge is opened for supplemental self-aligned ion implantation to obtain self-aligned drift region. This leads to a shorter gate length and desirable drift region junction contour under the gate edge for minimum specific-on-resistance. In additon, a and maximize the breakdown voltage. Also, by biasing the metal field plate, we can reduce the specific-on-resistance further. The devices are optimized by using the TSUPREM-4 process simulator and the MEDICI device simulator. The optimized devices have the breakdwon voltage and the specific-on-resistance of 101.5V and 1.14m${\Omega}{\cdot}cm^{2}$, respectively for n-channel RESURF EDMOSFET, and 98V and 2.75m.ohm..cm$^{2}$ respectively for p-channel RESURF EDMOSFET. To check the validity of the simulations, we fabricated n-channel EDMOSFETs and confirmed the measured breakdown voltage of 97V and the specific-on-resistance of 1.28m${\Omega}{\cdot}cm^{2}$. These results are superior to those of any other reported power devices for smart power IC applications.