• Steel and Composite Structures
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• v.36 no.3
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• pp.293-305
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• 2020

This article presented a nanoscale modified continuum model to investigate the free vibration of functionally graded (FG) porous nanobeam by using finite element method. The main novelty of this manuscript is presenting effects of four different porosity models on vibration behaviors of nonlocal nanobeam structure including size effect, that not be discussed before The proposed porosity models are, uniform porosity distribution, symmetric with mid-plane, bottom surface distribution and top surface distribution. The nano-scale effect is included in modified model by using the differential nonlocal continuum theory of Eringen that adding the length scale into the constitutive equations as a material parameter constant. The graded material is distributed through the beam thickness by a generalized power law function. The beam is simply supported, and it is assumed to be thin. Therefore, the kinematic assumptions of Euler-Bernoulli beam theory are held. The mathematical model is solved numerically using the finite element method. Results demonstrate effects of porosity type, material gradation, and nanoscale parameters on the free vibration of nanobeam. The proposed model is effective in vibration analysis of NEMS structure manufactured by porous functionally graded materials.

• Bulletin of the Korean Chemical Society
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• v.28 no.4
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• pp.533-537
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• 2007

This paper describes the heteroepitaxial growth of single-crystalline 3C-SiC (cubic silicon carbide) thin films on Si (100) wafers by atmospheric pressure chemical vapor deposition (APCVD) at 1350 oC for micro/nanoelectromechanical system (M/NEMS) applications, in which hexamethyldisilane (HMDS, Si2(CH3)6) was used as a safe organosilane single-source precursor. The HMDS flow rate was 0.5 sccm and the H2 carrier gas flow rate was 2.5 slm. The HMDS flow rate was important in obtaing a mirror-like crystalline surface. The growth rate of the 3C-SiC film in this work was 4.3 μm/h. A 3C-SiC epitaxial film grown on the Si (100) substrate was characterized by X-ray diffraction (XRD), transmission electron microscopy (TEM), reflection high energy electron diffraction (RHEED), atomic force microscopy (AFM), X-ray photoelectron spectroscopy (XPS) and Raman scattering, respectively. These results show that the main chemical components of the grown film were single-crystalline 3C-SiC layers. The 3C-SiC film had a very good crystal quality without twins, defects or dislocations, and a very low residual stress.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.252-257
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• 2004

Nanometer-sized structures are being applied to many devices including micro/nano electronics, optoelectronics, quantum devices, MEMS/NEMS, biosensors, etc. Especially, the thin film with submicron thickness is a basic structure for fabricating these devices, but its mechanical behaviors are not well understood. The mechanical properties of the thin film are different from those of the bulk structure and are difficult to measure because of its handling inconvenience. Several techniques have been applied to mechanical characterization of the thin film, such as nanoindentation test, micro/nano tensile test, strip bending test, etc. In this study, we focus on the strip bending test because of its high accuracy and moderate specimen preparation efforts, and measure Au thin film, which is a very popular material in micro/nano electronic devices. Au film is deposited on Si substrate by evaporation process, of which thickness is 100nm. Using the strip bending test, we obtain elastic modulus, yield and ultimate tensile strength, and residual stress of Au thin film.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.331-332
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• 2007

Surface micromachined SiC devices have readily been fabricated from the polycrystalline (poly) 3C-SiC thin film which has an advantage of being deposited onto $SiO_2$ or $Si_3N_4$ as a sacrificial layer. Therefore, in this work, magnetron reactive ion etching process which can stably etch poly 3C-SiC thin films grown on $SiO_2$/Si substrate at a lower energy (70 W) with $CHF_3$ based gas mixtures has been studied. We have investigated the etching properties of the poly 3C-SiC thin film using PR/Al mask, according to $O_2$ flow rate, pressure, RF power, and electrode gap. The etched RMS (root mean square), etch rate, and etch profile of the poly 3C-SiC thin films were analyzed by SEM, AFM, and $\alpha$-step.

• Steel and Composite Structures
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• v.32 no.6
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• pp.753-767
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• 2019

Vibration control in mechanical equipments is an important problem where unwanted vibrations are vanish or at least diminished. In this paper, free vibration active control of the porous sandwich piezoelectric polymeric nanocomposite microbeam with microsensor and microactuater layers are investigated. The aim of this research is to reduce amplitude of vibration in micro beam based on linear quadratic regulator (LQR). Modified couple stress theory (MCST) according to sinusoidal shear deformation theory is presented. The porous sandwich microbeam is rested on elastic foundation. The core and face sheet are made of porous and three-phase carbon nanotubes/resin/fiber nanocomposite materials. The equations of motion are extracted by Hamilton's principle and then Navier's type solution are employed for solving them. The governing equations of motion are written in space state form and linear quadratic regulator (LQR) is used for active control approach. The various parameters are conducted to investigate on the frequency response function (FRF) of the sandwich microbeam for vibration active control. The results indicate that the higher length scale to the thickness, the face sheet thickness to total thickness and the considering microsensor and microactutor significantly affect LQR and uncontrolled FRF. Also, the porosity coefficient increasing, Skempton coefficient and Winkler spring constant shift the frequency response to higher frequencies. The obtained results can be useful for micro-electro-mechanical (MEMS) and nano-electro-mechanical (NEMS) systems.

• Coupled systems mechanics
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• v.10 no.1
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• pp.39-60
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• 2021

The present paper is concerned with the study of nonlinear ultrasonic waves in a magneto thermo (MT) elastic armchair single-walled carbon nanotube (ASWCNT) resting on polymer matrix. The analytical formulation is developed based on Eringen's nonlocal elasticity theory to account small scale effect. After developing the formal solution of the mathematical model consisting of partial differential equations, the frequency equations have been analyzed numerically by using the nonlinear foundations supported by Winkler-Pasternak model. The solution is obtained by ultrasonic wave dispersion relations. Parametric work is carried out to scrutinize the influence of the non local scaling, magneto-mechanical loadings, foundation parameters, various boundary condition and length on the dimensionless frequency of nanotube. It is noticed that the boundary conditions, nonlocal parameter, and tube geometrical parameters have significant effects on dimensionless frequency of nano tubes. The results presented in this study can provide mechanism for the study and design of the nano devices like component of nano oscillators, micro wave absorbing, nano-electron technology and nano-electro- magneto-mechanical systems (NEMMS) that make use of the wave propagation properties of armchair single-walled carbon nanotubes embedded on polymer matrix.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.7
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• pp.606-610
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• 2007

This paper describes the Raman scattering characteristics of polycrystalline (poly) 3C-SiC thin films, in which they were deposited on the oxidized Si substrate by APCVD method according to growth temperature. Since the phonon modes were not measured for $0.4{\mu}m$ thick 3C-SiC, $2.0{\mu}m$ thick 3C-SiC deposited on the oxidized Si at $1180^{\circ}C$, in which TO (transverse optical mode) and LO (longitudinal optical mode) phonon modes were appeared at 794.4 and $965.7cm^{-1}$, respectively. The broad FWHM (full width half maximum) can explain that the crystallinity of 3C-SiC deposited at $1180^{\circ}C$ becomes polycrystalline instead of disorder crystal. Additionally, the ratio of intensity $I_{LO}/I_{TO}{\approx}1.0$ of 3C-SiC indicates that the crystal disorder of $3C-SiC/SiO_2/Si$ is small. Compared poly $3C-SiC/SiO_2$ with $SiO_2/Si$ interfaces, $1122.6cm^{-1}$ phonon mode was measured which may belong to C-O bonding and two phonon modes, 1355.8 and $1596.8cm^{-1}$ related to D and G bands of C-C bonding in the Raman range of 200 to $2000cm^{-1}$.

• KSTLE International Journal
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• v.6 no.2
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• pp.33-38
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• 2005

Submicron-scale patterns made of polymethyl methacrylate (PMMA) were fabricated on silicon-wafer using a capillarity-directed soft lithographic technique. Polyurethane acrylate (PUA) stamps (Master molds) were used to fabricate the patterns. Patterns with three different aspect ratios were fabricated by varying the holding time. The patterns fabricated were the negative replica of the master mold. The patterns so obtained were investigated for their adhesion and friction properties at nano-scale using AFM. Friction tests were conducted in the range of 0-80 nN. Glass (Borosilicate) balls of diameter 1.25 mm mounted on cantilever (Contact Mode type NPS) were used as tips. Further, micro-friction tests were performed using a ball-on-flat type micro-tribe tester, under reciprocating motion, using a soda lime ball (1 mm diameter) under a normal load of 3,000 mN. All experiments were conducted at ambient temperature ($24{\pm}1^{\circ}C$) and relative humidity ($45{\pm}5\%$). Results showed that the patterned samples exhibited superior tribological properties when compared to the silicon wafer and non-patterned sample (PMMA thin film) both at the nano and micro-scales, owing to their increased hydrophobicity and reduced real area of contact. In the case of patterns it was observed that their morphology (shape factor and size factor) was decisive in defining the real area of contact.

• Steel and Composite Structures
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• v.49 no.4
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• pp.361-380
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• 2023

A size dependent bending behavior of piezoelectrical flexoelectric layered perforated functionally graded (FG) composite nanobeam rested on an elastic foundation is investigated analytically. The composite beam is composed of regularly cutout FG core and two piezoelectric face sheets. The material characteristics is graded through the core thickness by power law function. Regular squared cutout perforation pattern is considered and closed forms of the equivalent stiffness parameters are derived. The modified nonlocal strain gradient elasticity theory is employed to incorporate the microstructure as well as nonlocality effects into governing equations. The Winkler as well as the Pasternak elastic foundation models are employed to simulate the substrate medium. The Hamiltonian approach is adopted to derive the governing equilibrium equation including piezoelectric and flexoelectric effects. Analytical solution methodology is developed to derive closed forms for the size dependent electromechanical as well as mechanical bending profiles. The model is verified by comparing the obtained results with the available corresponding results in the literature. To demonstrate the applicability of the developed procedure, parametric studies are performed to explore influences of gradation index, elastic medium parameters, flexoelectric and piezoelectric parameters, geometrical and peroration parameters, and material parameters on the size dependent bending behavior of piezoelectrically layered PFG nanobeams. Results obtained revealed the significant effects both the flexoelectric and piezoelectric parameters on the bending behavior of the piezoelectric composite nanobeams. These parameters could be controlled to improve the size dependent electromechanical as well as mechanical behaviors. The obtained results and the developed procedure are helpful for design and manufacturing of MEMS and NEMS.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.7
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• pp.929-933
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• 2010

Four-point bending tests were performed to investigate the interfacial adhesion of Cu-Cu bonding fabricated by thermo-compression process for three dimensional packaging. A pair of Cu-coated Si wafers was bonded under a pressure of 15 kN at $350^{\circ}C$ for 1 h, followed by post annealing at $350^{\circ}C$ for 1 h. The bonded wafers were diced into $30\;mm\;{\times}\;3\;mm$ pieces for the test. Each specimen had a $400-{\mu}m$-deep notch along the center. An optical inspection module was installed in the testing apparatus to observe crack initiation at the notch and crack propagation over the weak interface. The tests were performed under a fixed loading speed, and the corresponding load was measured. The measured interfacial adhesion energy of the Cu-to-Cu bonding was $9.75\;J/m^2$, and the delaminated interfaces were analyzed after the test. The surface analysis shows that the delamination occurred in the interface between $SiO_2$ and Ti.