• 반도체디스플레이기술학회지
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• 제11권1호
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• pp.29-33
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• 2012

In this study, we have investigated the structural and electrical characteristics of IZO thin films deposited under hydrogen atmosphere on flexible substrate for the OLED (organic light emitting diodes) devices. For this purpose, PES was used for flexible substrate and IZO thin films were deposited by RF magnetron sputtering under hydrogen ambient gases (Ar, $Ar+H^2$) at room temperature. In order to investigate the influences of the hydrogen, the flow rate of hydrogen in argon mixing gas has been changed from 0.1sccm to 0.5sccm. All the samples show amorphous structure regardless of flow rate. The electrical resistivity of IZO films increased with increasing flow rate of $H^2$ under $Ar+H^2$. All the films showed the average transmittance over 85% in the visible range. The OLED device was fabricated with different IZO electrodes made by configuration of IZO/$\acute{a}$-NPD/DPVB/$Alq_3$/LiF/Al to elucidate the performance of IZO substrate. OLED devices with the amorphous-IZO (a-IZO) anode film show good current density-voltage-luminance characteristics. This suggests that flat surface roughness and low electrical resistivity of a-IZO anode film lead to more efficient anode material in OLED devices.

• 한국재료학회지
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• 제11권9호
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• pp.740-744
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• 2001

The $Y_2SiO_5:Ce$ phosphors were synthesized by sol-gel technique in order to improve the performance of blue emitting phosphors for field emission display(FED). The resulted$Y_2SiO_5:Ce$ phosphors enhanced the emission intensity. In addition, calcination temperature of sol-gel technique(1300~140$0^{\circ}C$) was lower than that of the solid state reaction(>1$600^{\circ}C$). Under 365 nm and low voltage electron excitations. $Ce^{3+}$ -activated $Y_2SiO_5$phosphors showed blue emission band with a range of 400~ 430nm. Especially, 2mol% $Ce^{3+}$ doped $Y_2SiO_5:Ce$phosphors showed the maximum emission intensity. We have also controlled drying temperature of wet gel, pH, and $H_2O$/TEOS molar ratio for the optimum condition of TEOS hydrolysis.

• 한국가구학회지
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• 제18권3호
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• pp.205-210
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• 2007

Particleboard(PB) is one of the most commonly used wood-based composite materials, which can be prepared by utilizing any kind of low grade wooden materials like waste wood which contains formaldehyde itself. Therefore, PB have been of considerable interest, in issues regarding the formaldehyde emission problems. Wood wastes are carbonized by the carbonization kiln at $800^{\circ}C$. Charcoal has been known as a formaldehyde adsorber. Thus, in this study, we fabricated PBs with carbonized waste particles cores, to examine the possibility of developing less formaldehyde emitting boards. The physical and mechanical properties were evaluated by Korean Standard (KS F 3104). The moisture content of PBs ranged from 6.76 to 8.36%. Internal bond strengths decreased with the increase in the content of carbonized core particles. Formaldehyde emission showed minimum value at 25% of carbonized core particles, but the emission values increased when the amount of carbonized cote particles increased. When 25% of carbonized core particles was used, PBs met KS F 3104 standard properties.

• 한국안전학회지
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• 제11권1호
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• pp.53-59
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• 1996

To protect the damages or the disasters caused by overheating of industrial electric equipments or electric home appliances, a temperature sensitive thermal fuse is generally used in those equipments. Thermal fuses cutoff the current flow when the temperature of the electric equipments are abnormally overheated and over the certain temperature. Therefore thermal fuse is one of the most important elements in the sense of safety. Thermal fuses are classified into two types according to thermally sensitive materials, a low temperature melting alloy and an organic chemical compound. Domestic products of thermal fuses are now only with an organic chemical compound. Domestic products tested by using cutoff test and aging test etc. are satisfied UL specification. It's shown that the accuracy and the precision of the domestic products are as good as those of the overseas products obtained UL mark. However, some of domestic products show the reclosing problem which is mainly related the safety. This problem should be solved to make the reliable thermal fuses. In this paper, our Interest is to find out the causes of reclosing. In the comparison between thermally sensitive materials occurred reclosing and those occurred no reclosing, the test effects show that the characteristics of emitting heat and absorbing heat are different.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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• pp.290.2-290.2
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• 2016

Recently, organic thin-film transistors have been widely researched for organic light-emitting diode panels, memory devices, logic circuits for flexible display because of its virtue of mechanical flexibility, low fabrication cost, low process temperature, and large area production. In order to achieve high performance OTFTs, increase in accumulation carrier mobility is a critical factor. Post-fabrication thermal annealing process has been known as one of the methods to achieve this by improving the crystal quality of organic semiconductor materials In this paper, we researched the properties of pentacene films with X-Ray Diffraction (XRD) and Atomic Force Microscope (AFM) analyses as different annealing temperature in N2 ambient. Electrical characterization of the pentacene based thin film transistor was also conducted by transfer length method (TLM) with different annealing temperature in Al- and Ti-pentacene junctions to confirm the Fermi level pinning phenomenon. For Al- and Ti-pentacene junctions, is was found that as the surface quality of the pentacene films changed as annealing temperature increased, the hole-barrier height (h-BH) that were controlled by Fermi level pinning were effectively reduced.

• E2M - 전기 전자와 첨단 소재
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• 제10권3호
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• pp.262-267
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• 1997

In order to improve the brightness and chromaticity of green emitting low voltage phosphor for FED, we examine PL, PLE and CL emission characteristics of ZnGa$_{2}$O$_{4}$:Mn,O prepared in Ar and vacuum. ZnGa$_{2}$O$_{4}$:Mn,O sintered in vacuum shows about 16 times as bright as the one fabricated in Ar and excellent chromaticity. In PL emission spectra of ZnGa$_{2}$O$_{4}$:Mn,O at low temperature of 9 K, two peaks are observed at 504 nm and 513 nm. At room temperature, the two peaks are superimposed due to the lattice thermal vibrational energy, and only one peak is observed at 509 nm. From PLE measurements, it is believed that the energy levels of the host lattice and Mn ions are coexisted. The energy transfer from the host lattice to the emission center of Mn$^{2+}$ ions occurs.s.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.413-413
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• 2007

In recent years, flexible display devices such as liquid crystal display (LCD), organic light emitting diode (OLED), etc. have attracted considerable interest in a wide variety of applications. Polymer substrate is absolutely necessary to realize this kind of flexible display devices. Using the polymer as a substrate, there are lots of advantages including not only mechanical flexibility such as rolling and bending characteristics but also light weights, low cost and so on. In detail, thickness and weights is only one forth and one second of glass substrate, respectively. However, it needs low temperature below $150^{\circ}C$ in the fabrication process comparing to conventional deposition process. The polymer substrate is not thermally stable as much as the glass substrate so that some deformation can be occurred according to variation of temperature. In particular, performance of devices can be easily deteriorated by shrinkage of substrate when heating it. In this paper, pre-annealing and deposition of buffer layer was introduced and studied to solve previously mentioned problems of the shrinkage and followed shear stress.

• 한국재료학회지
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• 제11권8호
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• pp.636-640
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• 2001

PDP용 녹색 형광체의 발광특성을 개선시키기 위해 고안된 액상의 화학적 합성법을 사용하여 조성식이 $Zn_{2-x}$ $SiO_4$:xMn(x=0.05, 0.08)인 형광체를 입자크기가 0.5~2$\mu\textrm{m}$로 조절하여 제조하였다. 제조된 형광체 입자는 구상이며 잘 분산된 형상을 봉주었고, 고상반응법에 비해 상대적으로 낮은 $1080^{\circ}C$에서 willemite구조의 단일상을 얻을 수 있었다. 또한 진공 자외선 영역의 147 nm의 여기원을 사용하여 광발광 특성을 조사하였다. 입자의 크기가 1$\mu\textrm{m}$이고 Mn의 도핑양이 8mole%일 때, 상용 형광체와 비교하여 발광세기는 약 40% 향상되었고 색좌표는 x=0.24, y=0.69로 거의 일치하는 결과를 얻을 수 있었다. 측정된 형광체의 잔광시간은 7.8ms이었다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제38회 동계학술대회 초록집
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• pp.174-174
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• 2010

Gallium Nitride(GaN) attracts great attention due to their wide band gap energy (3.4eV), high thermal stability to the solid state lighting devices like LED, Laser diode, UV photo detector, spintronic devices, solar cells, sensors etc. Recently, researchers are interested in synthesis of polycrystalline and amorphous GaN which has also attracted towards optoelectronic device applications significantly. One of the alternatives to deposit GaN at low temperature is to use Single Source Molecular Percursor (SSP) which provides preformed Ga-N bonding. Moreover, our group succeeds in hybridization of SSP synthesized GaN with Single wall carbon nanotube which could be applicable in field emitting devices, hybrid LEDs and sensors. In this work, the GaN thin films were deposited on c-axis oriented sapphire substrate by MBE (Molecular Beam Epitaxy) using novel single source precursor of dimethyl gallium azido-tert-butylamine($Me_2Ga(N_3)NH_2C(CH_3)_3$) with additional source of ammonia. The surface morphology, structural and optical properties of GaN thin films were analyzed for the deposition in the temperature range of $600^{\circ}C$ to $750^{\circ}C$. Electrical properties of deposited thin films were carried out by four point probe technique and home made Hall effect measurement. The effect of ammonia on the crystallinity, microstructure and optical properties of as-deposited thin films are discussed briefly. The crystalline quality of GaN thin film was improved with substrate temperature as indicated by XRD rocking curve measurement. Photoluminescence measurement shows broad emission around 350nm-650nm which could be related to impurities or defects.

• Tribology and Lubricants
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• 제35권5호
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• pp.274-285
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• 2019

Chemical mechanical polishing (CMP), which is a material removal process involving chemical surface reactions and mechanical abrasive action, is an essential manufacturing process for obtaining high-quality semiconductor surfaces with ultrahigh precision features. Recent rapid growth in the industries of digital devices and semiconductors has accelerated the demands for processing of various substrate and film materials. In addition, to solve many issues and challenges related to high integration such as micro-defects, non-uniformity, and post-process cleaning, it has become increasingly necessary to approach and understand the processing mechanisms for various substrate materials and abrasive particle behaviors from a tribological point of view. Based on these backgrounds, we review recent CMP R&D trends in this study. We examine experimental and analytical studies with a focus on substrate materials and abrasive particles. For the reduction of micro-scratch generation, understanding the correlation between friction and the generation mechanism by abrasive particle behaviors is critical. Furthermore, the contact stiffness at the wafer-particle (slurry)-pad interface should be carefully considered. Regarding substrate materials, recent research trends and technologies have been introduced that focus on sapphire (${\alpha}$-alumina, $Al_2O_3$), silicon carbide (SiC), and gallium nitride (GaN), which are used for organic light emitting devices. High-speed processing technology that does not generate surface defects should be developed for low-cost production of various substrates. For this purpose, effective methods for reducing and removing surface residues and deformed layers should be explored through tribological approaches. Finally, we present future challenges and issues related to the CMP process from a tribological perspective.