• 대한기계학회논문집B
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• 제25권11호
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• pp.1483-1491
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• 2001

Enhancement of pulsed-laser ablation by an artificially deposited liquid film is presented. Measurements of ablation rate, ablation threshold, and surface topography arc performed. Correlation between material ablation and photoacoustic effect is examined by the optical beam deflection method. The dependence of ablation rate on liquid-film thickness and chemical composition is also examined. The results indicate that photomechanical effect in the phase explosion of liquid is responsible for the enhanced ablation. The low critical temperature of liquid induces explosive vaporization with localized photoacoustic excitation in the superheat limit and increases the ablation efficiency. Experiments were carried out utilizing a Q-swiched Nd:YAG laser at near-threshold laser fluences with negligible plasma effect (up to ∼100 MW/cm$^2$).

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.595-596
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• 2006

The flexible organic thin film transistor (OTFT) array to use as a switching device for an organic light emitting diode (OLED) was designed and fabricated in the microcontact printing and low-temperature processes. The gate, source, and drain electrode patterns of OTFT were fabricated by microcontact printing which is high-resolution lithography technology using polydimethylsiloxane(PDMS) stamp. The OTFT array with dielectric layer and organic active semiconductor layers formed at room temperature or at a temperature tower than $40^{\circ}C$. The microcontact printing process using SAM(self-assembled monolayer) and PDMS stamp made it possible to fabricate OTFT arrays with channel lengths down to even nano size, and reduced the procedure by 10 steps compared with photolithography. Since the process was done in low temperature, there was no pattern transformation and bending problem appeared. It was possible to increase close packing of molecules by SAM, to improve electric field mobility, to decrease contact resistance, and to reduce threshold voltage by using a big dielecric.

• 한국전기전자재료학회논문지
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• 제32권5호
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• pp.366-370
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• 2019

In this paper, a single N+ emitter trench gate-type insulated gate bipolar transistor (IGBT) device was studied using T-CAD, in order to achieve a low on-state voltage drop (Vce-sat) and high breakdown voltage, which would reduce power loss and device reliability. Using the simulation, the threshold voltage, breakdown voltage, and on-state voltage drop were studied as a function of the temperature, the length of time in the diffusion process (drive-in) after implant, and the trench gate depth. During the drive-in process, a $20^{\circ}C$ change in temperature from 1,000 to $1,160^{\circ}C$ over a 150 minute time frame resulted in a 1 to 4 V change in the threshold voltage and a 24 to 2.6 V change in the on-state voltage drop. As a result, a 0.5 um change in the trench depth of 3.5 to 7.5 um resulted in the breakdown voltage decreasing from 802 to 692 V.

• JSTS:Journal of Semiconductor Technology and Science
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• 제1권3호
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• pp.158-166
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• 2001

Based on uniform hot carrier injection (optically assisted electron injection) across the $Si-SiO_2$ interface into the gate insulator of n-channel IGFETs, the threshold voltage shifts associated with electron injection of $1.25{\times}l0^{16}{\;}e/\textrm{cm}^2 between 0.5 and 7 MV/cm were found to decrease from positive to negative values, indicating both a decrease in trap cross section ($E_{ox}{\geq}1.5 MV/cm$) and the generation of FPC $E_{ox}{\geq}5{\;}MV/cm$). It was also found that FNC and large cross section NETs were generated for $E_{ox}{\geq}5{\;}MV/cm$. Continuous, uniform low-field (1MV/cm) electron injection up to $l0^{19}{\;}e/\textrm{cm}^2 is accompanied by a monatomic increase in threshold voltage. It was found that the data could be modeled more effectively by assuming that most of the threshold voltage shift could be ascribed to generated bulk defects which are generated and filled, or more likely, generated in a charged state. The injection method and conditions used in terms of injection fluence, injection density, and temperature, can have a dramatic impact on what is measured, and may have important implications on accelerated lifetime measurements.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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• pp.907-909
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• 2009

Low voltage operated top gated polymer transistors were fabricated with a high permittivity polymer, P(VDF-TrFE) and F8T2 as a gate dielectric and semiconducting layer, respectively. The operating voltage of transistors was effectively reduced under -10 V and typical threshold voltages were as low as -1 ~ -4 V with the reasonable charge carrier mobility of $10^{-3}cm^2$/Vs for the amorphous polymer. The large hysteresis in transfer curve was improved effectively by annealing at low temperature.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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• pp.473-476
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• 2008

A simple voltage compensation pixel circuit for AMOLED is produced using low temperature polycrystalline silicon (LTPS) technology. Its operation is verified by AIM-SPICE. Simulation results show that the pixel circuit has high immunity to variation of LTPS-TFT and reduces the drop in luminance due to the degradation of the OLED.

• 한국전자통신학회논문지
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• 제8권2호
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• pp.207-212
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• 2013

본 논문에서는 n-채널 저온 다결정 실리콘 박막 트랜지스터의 문턱전압 변동을 보상할 수 있는 전압 기입 AMOLED 화소회로를 제안하였다. 제안한 6T1C 화소회로는 5개의 스위칭 박막 트랜지스터, 1개의 OLED 구동 박막 트랜지스터 및 1개의 정전용량으로 구성되어 있다. SmartSpice 시뮬레이션 결과, 구동 트랜지스터의 문턱전압이 ${\pm}0.33$ V 변동시 최대 OLED 전류의 오차율은 7.05 %이고 Vdata = 5.75 V에서 OLED 양극 전압 오차율은 0.07 %로 제안한 6T1C 화소회로가 구동 트랜지스터의 문턱전압 변동에도 균일한 OLED 전류를 공급함을 확인하였다.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2002년도 International Meeting on Information Display
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• pp.487-490
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• 2002

In this paper, we report a novel way to evaluate the anticlinic interlayer coupling coefficient U between smectic layers of an antiferroelectric liquid crystal, by utilizing a small field-induced perturbation of the molecular orientation. U was found to exhibit an unusual "S-shaped" dependence on temperature, with values ranging between $0.4{\times}10^4$ and $0.4{\times}10^{-1}$ erg $cm^{-3}$ over a 10$^{\circ}C$ temperature range below smectic A-smectic $C_A$ phase transition temperature. The results are good agreement with estimates for U based upon the threshold field for the onset of solitary waves, and provide strong supporting the low-field regime for the single Fourier component model.

• 전기전자학회논문지
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• 제22권2호
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• pp.344-349
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• 2018

AlGaN/GaN HEMT를 제작하여 상온에서 $-178^{\circ}C$의 저온에 이르기까지 트랜지스터의 전기적인 특성 변화를 연구하였다. 상온에서 264 mA/mm를 나타내던 게이트 길이 $2{\mu}m$인 HEMT의 드레인 전류는 온도의 감소에 따라 변화하여 $-108^{\circ}C$의 온도에서 388 mA/mm로 47%의 증가를 나타냈으며 최대 트랜스컨덕턴스는 121 mS/mm로 부터 183 mS/mm로 증가하였다. 또한 $-178^{\circ}C$의 온도에 이르기까지 -0.39 V의 문턱전압 변화를 보였다. 이러한 변화는 주로 상온에서부터 $-108^{\circ}C$의 온도에서 나타나고 있으며 온도감소에 따른 $720{\Omega}/sq.$ 로부터 $300{\Omega}/sq.$로 감소하는 면저항의 변화와 함께하고 있다.

• 전기전자학회논문지
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• 제20권2호
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• pp.192-195
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• 2016

본 논문에서는 저항과 BJT를 사용하지 않고 sub-threshold 영역에서 동작하는 저전압, 저전력 기준전압 발생기를 설계하였다. CTAT 전압 발생기는 두 개의 NMOS 트랜지스터를 이용하여 구성하였고, 충분한 영역의 CTAT 전압을 발생시키기 위해 바디 바이어스 회로를 이용하였다. PTAT 전압 발생기는 PTAT 전압을 생성하기 위해 MOS 트랜지스터 입력 쌍의 서로 다른 사이즈 비를 이용하는 차동증폭기 형태로 구성하였다. 제안한 회로는 $0.18-{\mu}m$ 표준 CMOS 공정으로 설계되었다. 시뮬레이션 결과로 290mV의 출력 기준 전압을 가지며, -$20^{\circ}C$ 에서 $120^{\circ}C$의 온도 변화에서 92 ppm/$^{\circ}C$의 전압 변화 지수와 전원전압 0.63V에서 15.7nW의 소모 전력을 갖는 것을 확인하였다.