• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.1
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• pp.49-55
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• 2013

In this paper, semiconducting shield specimens for a DC cable os fabricated and characterized by measurement of volume resistance, tensile strength, and the coefficient of expansion to show the electrical and mechanical characteristics of the semiconducting shield. Due to the PTC phenomenon, the volume resistance at $25^{\circ}C$ increases rapidly in comparison to the volume resistance at $90^{\circ}C$. Since the compounding ration of carbon black is low, the tensile strength and density become lower and the coefficient of expansion is increased. As the general specification of the tensile strength and density is $0.8kgf/mm^2$ and 150%, respectively, the fabricated specimen in this paper has excellent mechanical characteristic.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2010.11a
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• pp.221-224
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• 2010

Recently, due to the enormous cost for sending a satellite into an orbit, small and more reliable satellites have been more demanded. An introduction of new binders(HTPB, GAP) and new oxidizers made great improvements of the large thrust modulation. In order to make cost reduction, one prefers to the low melting temperature thermoplastic propellant reforming the manufacturing process dramatically. Solid propellant rockets have been had a problem of the injection accuracy into orbit, but PBS(Post Boost Stage) using a liquid mono-propellant improves the injection accuracy. This paper also gives the direction of the advanced nozzle materials and the motor case.

• Elastomers and Composites
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• v.54 no.4
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• pp.271-278
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• 2019

Polyurethane elastomers (PUEs) were synthesized using trans-1,4-bis(isocyanatomethyl) cyclohexane (1,4-H₆XDI), poly(oxytetramethylene) glycol, 1,4-butanediol (BD), and 1,1,1-trimethylol propane (TMP). To control the molecular aggregation state and mechanical properties of these PUEs, hard segment contents of 20 and 30 wt% and BD/TMP ratios of 10/0 and 8/2 were chosen. Differential scanning calorimetry and small-angle X-ray scattering measurements revealed that the degree of microphase separation increased with an increase in both hard segment content and BD ratio. The Young's modulus and strain at break of the 1,4-H₆XDI-based PUE were 6-20 MPa and 5-15, respectively. Incorporation of 20% TMP as a cross-linking agent into BD increased the melting temperature of the hard segment chains, that is, heat resistance, and decreased the Young's modulus. This could be due to the low density of the physical cross-linking network and the dispersion of hard segment chains in the soft segment matrix in the PUE in the presence of 20% TMP.

• ETRI Journal
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• v.35 no.4
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• pp.625-631
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• 2013

For the formation of solder bumps with a fine pitch of 130 ${\mu}m$ on a printed circuit board substrate, low-volume solder on pad (LVSoP) technology using a maskless method is developed for SAC305 solder with a high melting temperature of $220^{\circ}C$. The solder bump maker (SBM) paste and its process are quantitatively optimized to obtain a uniform solder bump height, which is almost equal to the height of the solder resist. For an understanding of chemorheological phenomena of SBM paste, differential scanning calorimetry, viscosity measurement, and physical flowing of SBM paste are precisely characterized and observed during LVSoP processing. The average height of the solder bumps and their maximum and minimum values are 14.7 ${\mu}m$, 18.3 ${\mu}m$, and 12.0 ${\mu}m$, respectively. It is expected that maskless LVSoP technology can be effectively used for a fine-pitch interconnection of a Cu pillar in the semiconductor packaging field.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.2 no.2
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• pp.53-62
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• 1992

In Zone Melting Recrystallization(ZMR) of SOl structure, thin silicon films have been recrystallized by artificial control of beam intensity profile which was obtained by tilting of upper elliptical reflector. Temperature profiles and gradients near solidification interface were calculated by numerical simulation for analysis of asymmetric line heating effect. The larger the tilting angle of the upper reflector, the larger the degree of supercooling at liquid and the interdefect spacing in thin silicon films. Major defects were continuous subgrainboundaries. Isolated threading dislocations were observed in the case of the film having low defect density. We have found that the thin silicon films were recrystallized into (100) textured single crystals by cross-sectional TEM and thin film X-ray diffraction analysis.

• International Journal of Industrial Entomology and Biomaterials
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• v.25 no.1
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• pp.75-79
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• 2012

Low-melting-temperature agarose gel solution, as a novel porogen was combined with a silk fibroin solution to generate interconnected porous networks. The porosity of the resultant silk fibroin-agarose scaffolds was greater than that of the scaffolds generated with agarose and deionized water. The porosities of silk fibroin scaffolds containing agarose gel at 0.5%, 1.0%, 1.5%, 2.0% [w/v] were 110.9%, 111.7%, 120.9%, and 123.0%, respectively. Lastly, the internal space generated in scaffolds after dissolution of the agarose gel provides a good environment for cell growth and movement within the scaffold.

• Korean Journal of Materials Research
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• v.13 no.8
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• pp.503-508
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• 2003

The purpose of this study is to investigate the effect of $V_2$$O_{5}$ addition on the Ag and Cu precipitation in the NiCuZn ferrite layers of 7.7${\times}$4.5${\times}$1.0 mm sized multi-layer chip inductors prepared by the screen printing method using 0∼0.5 wt% $V_2$$O_{5}$ -doped ferrite pastes. With increasing the $V_2$$O_{5}$ content and sintering temperature, Ag and Cu oxide coprecipitated more and more at the polished surface of ferrite layers during re-annealing at $840^{\circ}C$. It was thought that during the sintering process, V dissolved in the NiCuZn ferrite lattice and the Ag-Cu liquid phase of low melting point was formed in the ferrite layers due to the Cu segregation from the ferrite lattice and Ag diffusion from the internal electrode. During re-annealing at $840^{\circ}C$, the Ag-Cu liquid phase came out the polished surface of ferrite layers, and was decomposed into the isolated Ag particles and the Cu oxide phase during the cooling process.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.7
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• pp.598-606
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• 2000

In this paper we investigated the relation between the surface degradations and anti-pollution characteristics of Room Temperature Vulcanized(RTV) silicone rubber coating that has different roughness through immersing into saline water. We utilized several analytic techniques such as atomic force microscopy(AFM) scaning electron microscopy(SEM) contact angle Salt Deposit Density(SDD) and average leakage current under the condition of salt fog. It is found that the surface roughness of treated RTV silicone rubber increased and the hydrophobicity of sample surface decreased with increasing the duration o immersion into water due to the erosion of base polymer the melting down alumina trihydrate(ATH) and the diffusion of Low Molecular weight(LMW) fluid. Despite the roughness of surface had been increased by water immersion excellant anti-pollution and recovery characteristics were maintained and SDD saturated to 0.1~0.14mg/cm$^2$. The average leakage current under salt fog increased with surface roughness. Measurement of average leakage current will be helpful to investigate surface degradation and lifetime expectation of RTV silicone coating.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.32 no.5
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• pp.1-7
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• 2000

Alkaline Sizing behavior and mechanism of handsheets, which were prepared from thermomechanical pulp (TMP) with alkylketene dimer (AKD), were studied in terms of the conditions of the handsheet-making. AKD content in the TMP handsheets was increased with increasing of AKD addition level and the addition of a polyamideamine-epichlorohydrin resin (PAE) clearly enhanced AKD retention as well as the resultant sizing performance of TMP handsheets. Although drying of the AKD sized TMP webs at $20^{\circ}C$ led to no or quite low sizing level, but TMP handsheets sized with AKD had higher sizing degrees with increasing of the temperature of heat treatment. Scanning electron microscopic observations of the AKD-sized TMP handsheets showed that AKD emulsion particles were present on pulp fiber surfaces independently without coagulation in the TMP handsheets dried at $20^{\circ}C$. Heat treatment of the AKD-sized handsheets resulted in disappearance of the AKD emulsion particles because of their melting and spreading. The addition of calcium carbonate filler to the TMP suspensions did not influence on AKD content in the TMP handsheets. Nevertheless, their sizing degrees clearly increased by the addition of $CaCO_3$filler. Probably, AKD molecules adsorbed on the $CaCO_3$filler particles contribute to the enhancement of sizing performance. Thus, AKD can give sizing features effectively to the TMP handsheets, when they are made under suitable conditions.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.05a
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• pp.321-324
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• 2005

The main purpose of the present study has been placed on investigating the effects of controlled rolling and cooling on the microstructures and mechanical properties of C-Si-Mn-V steels for cold forming. The steels were manufactured in vacuum induction melting(VIM) furnace and casted to 1.1ton Ingots and the ingots were forged to $\Box150$ billet. The forged billets were reheated in walking beam furnace and rolled to coil, the stocks were rolled by Controlled Rolling and Cooling Technology (CRCT), so rolled at low temperature by water spraying applied in rolling stage and acceleratly cooled before coiling. Rolled coils were cold drawed to the degree of $27\%$ of area reduction without heat treatment. Microstructual observation, tensile test, compression test and charpy impact tests were conducted. The mechanical properties of the steels were changed by area reduction of cold drawing and it is founded that there are optimum level of cold drawing to minimize compression stress for these steels. From the result of this study, it is conformed that mechanical properties and microstructure of C-Si-Mn-V steels for cold forming were enhanced by accelerated cooling and founded optimum level of cold drawing.