• Polymer(Korea)
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• v.37 no.4
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• pp.494-499
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• 2013

Modified polypropylene (m-PP) was fabricated by furfuryl sulphide (FS) as branching agent and m-PP/nano-filler composites were prepared with silicate and multi-walled carbon nanotube (MWCNT), using a twin screw extruder. The chemical structures and thermal properties of the m-PP were investigated by FTIR and DSC. The chemical structure of the m-PP was confirmed by the existence of =C-H stretching peak of the branching agent at 3100 $cm^{-1}$. There was no district change in melting temperature in case of m-PP, but a certain increase in crystallization temperature was notified and the increase was in the range of $10-20^{\circ}C$. The rheological properties, filler dispersion and foaming behaviors of the m-PP/nano-filler composites were investigated by dynamic rheometer, X-ray diffractometer (XRD) and scanning/transmission electron microscope (SEM/TEM). m-PP/nano-filler composites showed a high complex viscosity at a low frequency, an increase in melt elasticity, and a high shear thinning effect. Compared to pure PP, m-PP and m-PP/nano-filler composites were sufficient to enhance the foaming behavior.

• Korean Journal of Food Science and Technology
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• v.29 no.6
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• pp.1213-1221
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• 1997

Effects of the addition of three commercial oligosaccharide syrups into a Korean rice cake (Karedduk) on the textural characteristics and retrogradation of the rice cake were examined during the storage for 5 days at $25^{\circ}C$ and $4^{\circ}C$. Each syrups contained maltose (M75), isomaltose and panose (HL), or maltotetraose (G4) as major sugars. The increment (rates) in gumminess, hardness and chewiness during the storage were significantly reduced by replacing rice flour (up to 10%) with the oligosaccharides. The retardation in the textural changes by the oilgosaccharides was more significant when the rice cake was stored at $25^{\circ}C$ than at $4^{\circ}C$. Among the three types, HL exhibited most effective in retarding the textural changes. Thermograms by a differential scanning calorimeter (DSC) showed that the oligosaccharide increased the onset temperatures and enthalpy for the starch melting, but the recrystallinity measured from the enthalpy ratio before and after the storage was significantly reduced by the presence of the oligosaccharide. Especially with 5% HL, the recrystallinity was significantly low (72.7%) compared to rice cake without HL (88.1%). Therefore, HL had great efficiency in retarding starch retrogradation as well as textural changes of the rice cake during the storage.

• The Journal of Korean Academy of Prosthodontics
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• v.44 no.1
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• pp.20-28
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• 2006

Statement of problem: The titanium has advantages of a high biocompatibility, a corrosion resistence, low density, and cheep price, so it is focused as a substituted alloy But it is quite difficult to cast with the tranditional method due to the high melting point, reacivity with element at, elevated temperature. By using the CAD-CAM system for the crown construction, it is possible to reduce the errors while proceeding the wax-up, investing, and casting procedure Purpose: The purposes of this study were to measure the marginal adaptation of the casting titanium coping and machine-milled titanium coping according to the casting methods and the marginal configurations. Material and method: The marginal configurations were used chamfer shoulder, and beveled shoulder. The total 30 copings were used, and these are divided into 6 groups according to the manufacturing method and marginal configuration. The gap between margin of the model and the restoration was measured with 3-dimensional measuring microscope. Results: The following results were obtained; 1. casting gold coping demonstrated the best marginal seal, followed by casting titanium coping finally machine-milled titanium copings. 2. In casting titanium coping, chamfer demonstrated the best marginal seal, followed by shoulder and beveled shoulder. There was no significantly difference in shoulder and beveled shoulder. But all margin form has clinically acceptable 3. In machine-milled titanium copings, chamfer demonstrated the best marginal seal, followed by shoulder and beveled shoulder. Beveled shoulder show large and uneven marginal gap Conclusions: Above result revealed that marginal adaptation of the titanim coping is avail able in the clinical range, it can be used as an alternative metal and it is prefered especially in chamfer or shoulder margin during implant superstructure fabrication. But there should be more research on machine-milled titanium in order to use it in the clinics.

• Journal of Sensor Science and Technology
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• v.8 no.3
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• pp.239-246
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• 1999

A highly sensitive photovoltaic infrared photodiode was fabricated for detecting infrared light in $3{\sim}5\;{\mu}m$ wavelength range on InSb wafer with p-i-n structure grown by MOCVD. Silicon dioxide($SiO_2$) insulating films for the junction interface and surface of photodiode were prepared using RPCVD because InSb has low melting point and evaporation temperature. After formation of In ohmic contacts by thermal evaporation, the electrical properties of the photodiode were characterized in dark state at 77K. A product of zero-bias resistance and area($R_0A$) showed $1.56{\times}10^6\;{\Omega}{\cdot}cm^2$ that satisfied BLIP(background limited infrared photodetector) condition. When the photodiode was tested under infrared light, the normalized detectivity of about $10^{11}\;cm{\cdot}Hz^{1/2}{\cdot}W^{-1}$ was obtained. we successfully fabricated a unit cell with InSb IR array with good quantum efficiency and high detectivity.

• Resources Recycling
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• v.18 no.1
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• pp.22-29
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• 2009

To design and construct a moving bed stoker incinerator for incineration treatment of the domestic oil fly ash, operating condition and moving bed area of incinerator were determined by performing incinerate experiment of the oil fly ash in the muffle furnace which simulates moving bed stoker incinerator in all conditions. Incineration process of the oil fly ash could be divided into 3 stages, every stage needs the appropriate operating condition for effective incineration. The optimum content of water in the heavy oil fly ash was found to be 20 wt% to prevent the ash from flying and reduce the volume. Science combustion rate of oil fly ash depends on the oxygen content, the incinerator must have a equipment to control the oxygen content in the combustion air. The optimum temperature was $750{\sim}800^{\circ}C$ in order to prevent adhesion to the stocker and evaporation of metal compounds of low melting point. Uniform combustion reaction and acceleration of combustion rate required agitation during the combustion of oil fly ash. The incineration rate was $12.53kg/m^2hr$ and the working area of moving bed incinerator was found to be $60m^2$ to incinerate 18 tons of oil fly ash per day.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.18-18
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• 2007

지난 수년 동안 Sn-3.0Ag-0.5Cu 합금은 전자산업의 표준 무연솔더 조성으로 전자제품의 제작에 사용되어져 왔으며, 그 신뢰성도 충분히 검증되어 대표적인 무연 솔더 조성으로의 입지를 굳혀왔다. 그러나 전자제품의 mobile화에 따른 내충격 신뢰성에 대한 요구와 최근의 급격한 Ag 가격의 상승은 Ag 함량의 축소에 의한 원가절감을 요청하게 되었으며, 이에 따라 소량의 Ag를 함유하는 솔더 조성 개발에 대한 연구가 산업 현장을 중심으로 절실히 요청되고 있다. Sn-Ag-Cu의 3원계 함긍에서 Ag는 합금의 융점을 낮추고, 강도와 같은 합금의 기계적 특성을 증가시키는 한편, 모재에 대한 합금의 젖음성을 향상시키는데 필수적인 원소로 인식되고 있다. 따라서 Sn-Ag-Cu의 3원계 함금에서 Ag의 함량을 감소시키게 되면, 합금액 액상선 온도와 고상선 온도가 벌어져 pasty range(또는 mush zone)가 증가하게 되고, wettability도 감소하게 되어 솔더 합금으로서의 요구 특성을 많이 상실하게 된다. 또한 Ag 함량을 감소시키게 되면 합금의 elongation이 향상되면서 내 impact 수명이 향상되는 효과를 볼 수 있으나, 합금의 creep 특성 및 기계적인 강도는 감소하면서 열싸이클링 수명은 감소하는 경향을 나타내게 된다. 따라서 솔더 합금의 내 impact 수명과 열싸이클링 수명을 동시에 만족시키지 위해서는 Ag 함량을 최적화하기 위한 고려가 필요하며, 합금원소에 대한 연구가 요청된다고 하겠다. 한편 Ag의 함량을 3wt.% 이상으로 첨가할 경우에도 비교적 느린 응고 속도에서는 조대한 판상의 $Ag_3Sn$ 상을 형성하는 경향이 있어 외관 물량을 야기 시킬 가능성이 매우 커지는 현상도 보고되고 있다. 따라서 Ag의 첨가량을 최적화 하면서 솔더 재료로서의 특성을 계속적으로 유지하기 위해서는 제 4 원소의 함유가 필수적이라고 할 수 있다. 본 연구에서는 Sn-Ag-Cu계에 첨부하는 제 4원소로서 In을 선택하였다. 비록 In은 Ag보다 고가이기 때문에 산업적인 적용을 위한 솔더 합금 원소로는 거의 각광받지 못했으나, 본 연구의 결과로는 In은 매우 소량 첨가할 경우에도 Sn-Ag-Cu계 합금, 특히 소량의 Ag를 함유하는 Sn-Ag-Cu계 합금의 wettabilty와 기계적 특성 향상에 매우 효과적임을 알 수 있었다. 결론적으로 본 연구를 통해 구현된 Sn-Ag-Cu-In계 최적 솔더 조성의 경우 Sn-3.0Ag-0.5Cu의 표준 조성에 비하여 약 18%의 원자재 가격 절감을 도모할 수 있을 것으로 예상되는 한편. Sn-3.0Ag-0.5Cu에 유사하거나 우수한 wettability 특성을 나타내었고. Sn-1.0Ag-0.5Cu 또는 Sn-l.2Ag-0.5Cu-0.05Ni 조성보다는 월등히 우수한 wettability 특성을 나타내었다. 더구나 Sn-Ag-Cu-In계 최적 솔더 조성은 합금의 강도 저하는 최소화 시키면서 합금의 elongation은 극적으로 향상시켜 합금의 toughness 값이 매우 우수한 특성을 가짐을 알 수 있었다. 이렇게 우수한 toughness 값은 솔더 조인트의 대표적 신뢰성 요구 특성인 열싸이클링 수명과 내 impact 수명을 동시에 향상시킬 수 있을 것으로 예상된다. 요컨대 본 연구를 통해 구현된 Sn-Ag-Cu-In계 솔더 조성은 최적 솔더 조성에서 요구되는 4가지 인자, 즉, 저렴한 원재료 가격, 우수한 wettability 특성, 합금 자체의 높은 toughness, 안정하고 낮은 성장 속도의 계면 반응층 생성을 모두 만족시키는 특징을 가짐으로서 기존 무연솔더 조성의 새로운 대안으로 자리 잡을 것으로 기대된다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.363-364
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• 2005

LTCC(low temperature co-fired ceramics)용 glass/ceramic 복합체를 제조하기 위해 3종류 의 glass를 선정하고 filler로 $Al_2O_3$ 와 $TiO_2$를 사용하여 glass frit에 따른 소결 및 유전 특성에 대하여 조사하였다. Glass frit은 lead-borosilicate(PBS), zinc-borosilicate(ZBS), bismuth-borosilicate(BBS) glass 조성을 사용하였고 1100~$1400^{\circ}C$에서 melting시킨 후 quenching하여 frit화하였다. $Al_2O_3$와 $TiO_2$ filler에 10~50 vol%로 glass frit을 각각 혼합한 후 600~$950^{\circ}C$에서 2시간 동안 소결한 결과 50 vol% glass frit 일 때 $900^{\circ}C$ 이하에서 소성이 가능하였다. 유전특성은 $900^{\circ}C$에서 $Al_2O_3$-50vol%PBS($\varepsilon_{r}$=8.8, $Q{\times}f_o$=4,900, $\tau_f$=-24), $Al_2O_3$-50vol% ZBS($\varepsilon_{r}$=5.7, $Q{\times}f_o$=17,800, $\tau_f$=-21), $Al_2O_3$-50vol%BBS($\varepsilon_{r}$=11.1, $Q{\times}f_o$= 2,080, $\tau_f$=-48), $TiO_2$-50vol%PBS($\varepsilon_{r}$=18.6, $Q{\times}f_o$=3,800, $\tau_f$=+135), $TiO_2$-50vol%ZBS($\varepsilon_{r}$=36.4, $Q{\times}f_o$= 7,500, $\tau_f$=+159), $TiO_2$-50vol%BBS($\varepsilon_{r}$=56.4, $Q{\times}f_o$=520, $\tau_f$=+119)을 나타내었다. 따라서 LTCC용 기판재료 및 마이크로파 유전체로 응용이 가능한 것으로 확인되었다.

• Korean Journal of Optics and Photonics
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• v.9 no.4
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• pp.221-226
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• 1998

Ternary heavy metal oxide glasses in the $PbO-Bi_2O_3-Ga_2O_3$ system doped with $Er_2O_3$ were prepared and their spectroscopic properties, such as radiative transition probability, calculated and measured radiative lifetimes and cross-sections of 1.5 $\mu\textrm{m}$ and 2.7 $\mu\textrm{m}$ emissions were analyzed. Enhanced quantum efficiencies of some electronic transitions were evident mainly because of the low vibrational phonon energy ($~500cm^{-1}$) inherent in the host glasses. This seems to be the main reason for obtaining the 2.7 $\mu\textrm{m}$ luminescence which is normally quenched in the conventional oxide glasses. In addition, green and red fluorescence emissions were observed through the frequency upconversion processes of the 798 nm excitation. Non-radiative transition due to the multiphonon relaxation is a dominant lifetime-shortening mechanism in the 4f-4f transitions in $Er^{3+}$ ion except for the $^4S_{3/2}{\rightarrow}^4I_{15/2}$ transition where a non-radiative transfer to band-gap excitation of the host glasses is dominant. Melting of glasses under an inert gas atmosphere and (or) addition of the typical glass-network former into glasses is necessary in order to enhance the quantum efficiency of the transition.

• Journal of Welding and Joining
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• v.18 no.2
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• pp.213-213
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• 2000

This study was performed to investigate types and formation mechanism of cracks in two Al alloy welds, A5083 and A7NO1 spot-welded by pulse Nd: YAG laser, using SEM, EPMA and Micro-XRD. In the weld zone, three types of crack were observed: center line crack($C_{C}$), diagonal crack($C_{D}$), and U shape crack($C_{U}$). Also, HAZ crack($C_{H}$), was observed in the HAZ region, furthermore, mixing crack($C_{M}$), consisting of diagonal crack and HAZ crack was observed.White film was formed at the hot crack region in the fractured surface after it was immersed to 10%NaOH water. In the case of A5083 alloy, white films in C crack and $C_D crack region were composed of low melting phases, Fe₂Si$Al_8$ and eutectic phases, Mg₂Al₃ and Mg₂Si. Such films observed near HAZ crack were also consist of eutectic Mg₂Al₃. In the case of A7N01 alloy, eutectic phases of CuAl₂, $Mg_{32}$ (Al,Zn) ₃, MgZn₂, Al₂CuMg and Mg₂Si were observed in the whitely etched films near $C_{C}$ crack and $C_{D}$ crack regions. The formation of liquid films was due to the segregation of Mg, Si, Fe in the case of A5083 alloy and Zn, Mg, Cu, Si in the case of A7N01 aooly, respectively.The $C_{D}$ and $C_{C}$ cracks were regarded as a result of the occurrence of tensile strain during the welding process. The formation of $C_{M}$ crack is likely to be due to the presence of liquid film at the grain boundary near the fusion line in the base metal as well as in the weld fusion zone during solidification. The $C_{U}$ crack is considered a result of the collapsed keyhole through incomplete closure during rapid solidification. (Received October 7, 1999)

• Korean Journal of Materials Research
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• v.9 no.3
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• pp.288-294
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• 1999

In the flip chip interconnection using solder bump, the Under Bump Metallurgy (UBM) is required to perform multiple functions in its conversion of an aluminum bond pad to a solderable surface. In this study, various UBM systems such as $Al 1\mu\textrm{m} / Ti 0.2\mu\textrm{m} / Cu 5\mu\textrm{m}, Al 1\mu\textrm{m} / Ti 0.2\mu\textrm{m} / Cu 1\mu\textrm{m}, al 1\mu\textrm{m}/Ni 0.2\mu\textrm{m} / Cu 1\mu\textrm{m} and Al 1\mu\textrm{m}/Pd 0.2\mu\textrm{m} / Cu 1\mu\textrm{m}$ for flip chip interconnection using the low melting point eutectic 63Sn-37Pb solder were investigated and compared to their metallurgical properties. $100\mu\textrm{m}$ size bumps were prepared for using an electroplating process. The effects of the number of reflows and aging time on the growth of intermetallic compounds(IMC) were investigated. $Cu_6Sn_5$ and $Cu_3Sn$ IMC were abserved after aging treatment in the UBM system with thick coper $(Al 1\mu\textrm{m}/Ti 0.2\mu\textrm{m}/Cu 5\mu\textrm{m})$. However only the $Cu_6Sn_5$ was detected in the UBM system with $1\mu\textrm{m}$ thick copper even after 2 reflow and 7 day aging at $150^{\circ}C$. Complete Cu consumption by Cu-Sn IMC growth gives rise to a direct contact between solder inner layer such as Ti, Ni and Pd, and hence to possibly cause reactions between two of them. In this study, however, only for the Pd case, IMC of PdSn. was observed by Cu consumption. UBM interfacial reactions with s이der affected the adhesion strength ot s이der balls after s이der reflow and annealing treatment.